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Preparation method for temperature compensation type multi-layer ceramic chip capacitor

A multi-layer ceramic and capacitor technology, applied in capacitors, fixed capacitors, fixed capacitor electrodes, etc., can solve the problems of increasing product manufacturing costs, rising market prices, scarcity, etc., to reduce product costs, save precious metal resources, and have a wide range of capacity. Effect

Active Publication Date: 2012-02-15
GUANGDONG FENGHUA ADVANCED TECH HLDG
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Problems solved by technology

However, there are many deficiencies in the MLCC products of the Ag / Pd system, which are mainly manifested in the following aspects: the use of precious metal Pd / Ag as the inner electrode and noble metal Ag as the terminal electrode, due to the continuous shortage of Pd resources, the market price is also rising, resulting in the product Increased production costs

Method used

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  • Preparation method for temperature compensation type multi-layer ceramic chip capacitor

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Embodiment

[0009] A method for preparing a Ni electrode SL (the temperature coefficient of the capacitor is SL) chip multilayer ceramic capacitor, mainly by preparing porcelain slurry, casting a dielectric diaphragm, alternately overprinting internal electrodes and dielectric layers, laminating, cutting, and debinding , Sintering, chamfering, capping, and firing process.

[0010] The porcelain material used in the preparation process of porcelain paste, its main component is CaZrO 3 and SrTiO 3 . The two are mixed according to the weight ratio of 1: (1.5~3) to adjust the dielectric constant and temperature coefficient of the dielectric material. Porcelain also includes ZnO, MnO 2 , SiO 2 One or several of them are used as sintering aids, and the total amount does not exceed 5wt%. The adhesive (PVB), plasticizer (DOP, DBP), dispersant (GTO, AKM0531), defoamer (methyl silicone oil) used are all materials commonly used by those skilled in the art, and the solvent used is toluene and A...

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Abstract

The invention discloses a preparation method for a temperature compensation type multi-layer ceramic chip capacitor, which mainly includes the processes of ceramic slurry preparation, medium film curtain-casting, alternate inner electrode and medium layer overprinting, lamination, cutting, binder removal, sintering, chamfering, end capping and firing. In the ceramic slurry preparation, the used ceramic materials are CaZrO3 ceramic material and SrTiO3 ceramic material, and the weight ratio of the CaZrO3 to the SrTiO3 is 1:(1.5 to 3); the maximum temperature for binder removal is 270 DEG C to 290 DEG C; the maximum temperature for sintering is 1270 DEG C to 1300 DEG C, and the sintering temperature-keeping time is 2 to 3 hours. With the adoption of the preparation method, the production cost is greatly reduced, and also temperature compensation type multi-layer ceramic capacitors with nickel-sputtered metal electrodes can be prepared. The capacitor is quite suitable for the fields of automotive electronics, illuminating electronics and other new industries in China.

Description

technical field [0001] The present invention relates to a preparation method of a ceramic capacitor, more particularly, the present invention relates to a preparation method of a chip type multilayer ceramic capacitor using nickel as an internal electrode. Background technique [0002] Chip multilayer ceramic capacitor (MLCC) is a new type of electronic component, which is widely used in the surface mount of consumer electronics such as communications, computers, and household appliances. With the rapid development of global surface mount technology, the output of surface mount components has risen rapidly, and the demand for MLCC has continued to rise. At present, domestic and foreign temperature-compensated multilayer chip ceramic capacitors (MLCC) all use precious metal Ag / Pd materials as internal electrodes. For some products with high quality requirements, they even use all-Pd internal electrodes, while the terminal electrodes are Ag. lead to high production costs. Th...

Claims

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Application Information

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IPC IPC(8): H01G4/00H01G4/008H01G4/12H01G4/232
Inventor 祝忠勇陆亨宋子峰
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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