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Manufacturing method of gecko hair-imitating dry adhesive

A production method and a technology of imitating gecko, which are applied in the production of high aspect ratio micro-nano hierarchical structure, high aspect ratio micro-nano hierarchical structure, and the field of strong dry adhesive, which can solve the complex, cumbersome and wet adhesive of dry adhesive. Adhesives are easy to degrade and difficult to use again, so as to achieve the effect of easy production, overcoming easy degradation and easy desorption

Inactive Publication Date: 2012-03-21
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a method for making a dry adhesive imitating gecko hair, which overcomes the disadvantages of current wet adhesives such as easy degradation, easy pollution, self-adhesion, and difficulty in re-use after being torn off, and improves the previous methods. The complex and cumbersome problem of dry adhesive

Method used

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  • Manufacturing method of gecko hair-imitating dry adhesive
  • Manufacturing method of gecko hair-imitating dry adhesive
  • Manufacturing method of gecko hair-imitating dry adhesive

Examples

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example 1

[0032] In the present invention, the diameter of the nanoscale fiber is 0.8 μm, the length is 4 μm, and the spacing is 0.4 μm; the diameter of the micron-scale fiber is 5.2 μm, the length is 30 μm, and the spacing is 5.2 μm. The specific implementation steps are as follows:

[0033] (1).ICP etching silicon motherboard:

[0034] like image 3 As shown in (A), the silicon motherboard 1 is first cleaned by the RCA cleaning method, and then etched by the ICP process. The pattern distribution of the mask plate 2 used for etching is the set nano-scale fiber array distribution, and the etching depth is 4 μm. ; Finally soak the silicon motherboard with a film remover, remove the photoresist on the surface, rinse with pure water, and blow dry with nitrogen to obtain a silicon motherboard 1 with a deep hole array;

[0035] (2). Uniform glue:

[0036] like image 3 As shown in (B), put the silicon motherboard 1 with a deep hole array on the coating machine, and spin-coat SU-8 photore...

example 2、3

[0046] According to the steps of Example 1, the dry adhesive imitating gecko hair can be prepared by using the parameters in the following table.

[0047]

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Abstract

A manufacturing method of a gecko hair-imitating dry adhesive. Aiming at disadvantages of easy degradation, easy pollution, and self-adhesion for current wet adhesives, and complicated and tedious manufacturing modes of current dry adhesives, by studying the micro-nano hierarchical structure characteristics of gecko foot hair in the nature, the invention manufactures a composite mold of SU-8 adhesive and silicon by combined ICP etching technology and thick-resist technology; a micro-nano hierarchical structure fiber array with a high depth to width ratio is obtained by one-step forming through a micro-molding mode; the structure imitates the structure characteristics of gecko in the nature, and has a superactive adhesion characteristic. The invention comprises silicon mother board manufacturing based on ICP etching technology, composite mold manufacturing based on thick-resist technology, and bilayer fiber array manufacturing based on micro-molding formation. The invention can manufacture a micro-nano hierarchical structure which has parameters close to parameters of gecko foot hair in the nature; the prepared product is a superactive dry adhesive which not only adapts different surfaces but also is easy to desorb the surfaces actively; the manufacturing cost is low, and the method is simple.

Description

technical field [0001] The invention belongs to a method for making a micro-nano bionic structure, in particular to a method for making a high-aspect-ratio micro-nano hierarchical structure, which can be used to make a high-aspect-ratio micro-nano hierarchical structure imitating gecko hair. A strong dry adhesive that can be easily detached from the surface. Background technique [0002] In recent years, in the field of microelectromechanical systems (MEMS), various commercialized MEMS devices have emerged and been successfully applied in aerospace, biomedicine, energy transportation, scientific instruments and other fields. Due to the unique tiny size of MEMS devices, adhesives are generally used for their installation and fixing. Adhesives that are widely used at present are almost all wet adhesives (such as adhesive tapes and glues). Due to some inherent characteristics, they are easy to degrade, easy to be polluted, self-adhesive, and difficult to use again after being ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00C09J7/00
CPCC09J7/00B81C99/0085B81B2203/0361B81B2207/056C09J2301/31
Inventor 刘世元张鹏张传维
Owner HUAZHONG UNIV OF SCI & TECH
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