Low temperature co-fired microwave dielectric ceramic material and preparation method thereof

A microwave dielectric ceramic and low-temperature co-firing technology, applied in ceramics, inorganic insulators, etc., can solve the problems of complex process, long manufacturing cost and long cycle, and achieve simple chemical composition and preparation process, low cost, and excellent microwave performance. Effect

Inactive Publication Date: 2012-03-21
GUILIN UNIV OF ELECTRONIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Chemical method synthesis and ultrafine powder as raw materi...

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  • Low temperature co-fired microwave dielectric ceramic material and preparation method thereof
  • Low temperature co-fired microwave dielectric ceramic material and preparation method thereof
  • Low temperature co-fired microwave dielectric ceramic material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0023] A preparation method of low-temperature co-fired microwave dielectric ceramic material, adding TiO in its composition 2 and LZB glass powder.

[0024] 1) Synthesis of Li 2 ZnTi 3 o 8 : Li 2 CO 3 (purity>97.5%), ZnO and TiO 2 (purity ≥ 99%) as raw material, according to the molar ratio Li 2 CO 3 :ZnO:TiO 2 = 1:1:3 Weigh the material, mix the prepared material with absolute alcohol as the medium, ball mill and mix for 12 h, dry and sieve, and then synthesize Li at 900°C for 4 h 2 ZnTi 3 o 8 main powder.

[0025] 2) Preparation of LZB glass powder: with Li 2 CO 3(purity>97.5%), ZnO and H 3 BO 3 (purity ≥ 99%) as raw material, according to aLi 2 O+ bZnO +cB 2 o 3 Carry out batching, wherein a=10%, b=37%, c=53% by weight percentage. Melt the batch material at 900°C for 1 hour, then pour it into cold water to form glass slag, and obtain D through ball milling 50 =10 μm LZB glass powder, the glass softening point is 490 ℃.

[0026] 3) Take a certain amount...

Embodiment 2

[0028] A preparation method of a low-temperature co-fired microwave dielectric ceramic material, in which LZB glass powder is added into the composition.

[0029] 1) Synthesis of Li 2 ZnTi 3 o 8 : Li 2 CO 3 (purity>97.5%), ZnO and TiO 2 (purity ≥ 99%) as raw material, according to the molar ratio Li 2 CO 3 :ZnO:TiO 2 = 1:1:3 Weigh the material, mix the prepared material with absolute alcohol as the medium, ball mill and mix for 12 h, dry and sieve, and then synthesize Li at 900°C for 4 h 2 ZnTi 3 o 8 .

[0030] 2) Preparation of LZB glass powder: with Li 2 CO 3 (purity>97.5%), ZnO and H 3 BO 3 (purity ≥ 99%) as raw material, according to aLi 2 O+ bZnO +cB 2 o 3 Carry out batching, wherein a=15%, b=40%, c=50% by weight percentage. Melt the batch material at 900°C for 1 hour, then pour it into cold water to form glass slag, and obtain D through ball milling 50 =8 μm LZB glass powder, the glass softening point is 480 ℃.

[0031] 3) Take a certain amount of syn...

Embodiment 3

[0033] A preparation method of a low-temperature co-fired microwave dielectric ceramic material, in which LZB glass powder is added into the composition.

[0034] 1) Synthesis of Li 2 ZnTi 3 o 8 : Li 2 CO 3 (purity>97.5%), ZnO and TiO 2 (purity ≥ 99%) as raw material, according to the molar ratio Li 2 CO 3 :ZnO:TiO 2 =1:1:3 Weigh the material, mix the prepared material with anhydrous alcohol as the medium, ball mill and mix for 24 hours, dry and sieve, and then synthesize Li at 900°C for 4 hours 2 ZnTi 3 o 8 .

[0035] 2) Preparation of LZB glass powder: with Li 2 CO 3 (purity>97.5%), ZnO and H 3 BO 3 (purity ≥ 99%) as raw material, according to aLi 2 O+ bZnO +cB 2 o 3 Carry out batching, wherein a=10%, b=35%, c=55% by weight percentage. Melt the batch material at 900°C for 1 hour, then pour it into cold water to form glass slag, and obtain D through ball milling 50 =9 μm LZB glass powder, the glass softening point is 485 ℃.

[0036] 3) Take a certain amoun...

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Abstract

The invention discloses a low temperature co-fired microwave dielectric ceramic material and a preparation method thereof. The ceramic material comprises a main powder material Li2ZnTi3O8, an auxiliary component TiO2 and low-melting-point LZB (Li2O-ZnO-BiO2) or LBS (Li2O-B2O3-SiO2) glass powder. The preparation method comprises the following steps of: adding TiO2 and the glass powder into the Li2ZnTi3O8 powder in a powder form; and then evenly mixing in a ball mill, drying, pelleting and sintering so as to obtain the ceramic material. In the invention, based on the Li2ZnTi3O8 powder as a reference, batching is carried out according to the proportions that the mass of the glass powder is 0.5-3wt% of that of Li2ZnTi3O8 and the mass of the TiO2 powder is 0-5wt% of that of Li2ZnTi3O8; and thematerial of the invention can be obtained by a traditional solid phase reaction method. The low temperature co-fired microwave dielectric ceramic material prepared by the method of the invention has low sintering temperature (about 875 DEG C) and good microwave dielectric property, and can be well co-fired with a Ag electrode; pure silver with high electricity conductivity and low cost is used asan electrode material, thus the manufacturing cost of a device can be greatly reduced; and the low temperature co-fired microwave dielectric ceramic material can be used for a low temperature co-fired ceramic (LTCC) system and manufacturing of microwave devices such as multilayer dielectric resonators, microwave antennas, filters and the like.

Description

technical field [0001] The invention belongs to the field of electronic ceramics and its manufacture, and relates to a microwave dielectric ceramic material, in particular to a low-temperature co-fired microwave dielectric ceramic material and a preparation method thereof. Background technique [0002] With the continuous development of electronic information technology in the direction of high frequency and digitalization, the requirements for miniaturization, integration and modularization of components are becoming increasingly urgent. Low temperature co-fired ceramics (Low Temperature Co-fired Ceramics) , Mechanical, thermal and process characteristics and high reliability have become one of the main technologies for modularization of electronic devices. The sintering temperature of the LTCC system is low, and base metals with high conductivity (such as Ag, Cu, etc.) can be used as conductor materials for multilayer wiring, which can improve assembly density and signal t...

Claims

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Application Information

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IPC IPC(8): C04B35/462C04B35/622H01B3/12
Inventor 陈国华康晓玲侯美珍包燕狄洁昌李擘杨云
Owner GUILIN UNIV OF ELECTRONIC TECH
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