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Method for forming curing laminated film of siloxane resin compound

A technology of siloxane resin and composition, which is applied in the direction of coating, etc., can solve the problems of hindering the properties of the film, reducing the hardness of the film, forming wrinkles, etc., and achieving high insulation, high scratch hardness, and low dielectric constant Effect

Active Publication Date: 2012-04-04
MERCK PATENT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to make the cured coating of the silicone resin less prone to cracking, it is possible to use a silicone resin in which 2 of the 4 linkages of silicon atoms are linked to carbon atoms and 2 to be linked to oxygen atoms, or to add methods of organic resins (e.g., acrylic resins), but these methods tend to hinder the above-mentioned film properties
In addition, if a silicone resin is added separately or added to the polymer repeating unit of the silicone resin, since the sublimation property is also improved while the fluidity is improved, there is a risk of polluting the oven during film formation, forming wrinkles according to the flow trace, or The problem that the hardness of the cured film becomes low

Method used

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  • Method for forming curing laminated film of siloxane resin compound

Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1

[0078]47.6g (0.35mol) methyltrimethoxysilane, 29.7g (0.15mol) phenyltrimethoxysilane, 4.83g (0.015mol) 3,3',4,4'-benzophenone tetracarboxylic acid The dianhydride was dissolved in 200 g of 3-methyl-3-methoxybutanol, and 34.2 g of distilled water was added with stirring at 45° C., followed by heating and stirring for 1 hour to perform hydrolysis and condensation. Thereafter, it was washed with water five or more times, and the ethyl acetate oil layer was recovered. Next, the ethyl acetate oil layer was concentrated and replaced with propylene glycol monomethyl ether acetate to obtain a 40% solution of a polycondensate of methylphenylsilsesquioxane.

[0079] The obtained siloxane resin was methylphenylsilsesquioxane (methyl:phenyl=7:3 molar ratio) having a weight average molecular weight (Mw) of 1,000.

[0080] The measurement of the weight average molecular weight (Mw) was performed using the following apparatus and conditions (for example, in the following examples, it measur...

manufacture example 2

[0085] In Production Example 1, except that the reaction temperature was changed from 45°C to 60°C, the same method as in Production Example 1 was carried out, thereby obtaining methylphenylsilsesquioxane (methylphenylsilsesquioxane) with a weight average molecular weight (Mw) of 2,000. base: phenyl = 7:3 molar ratio).

manufacture example 3

[0087] In Production Example 1, except that the reaction temperature was changed from 45°C to 60°C, and the reaction time was changed from 1 hour to 6 hours, the same method as in Production Example 1 was carried out, thereby obtaining formazan with a weight average molecular weight (Mw) of 4,000. phenyl silsesquioxane (methyl:phenyl=7:3 molar ratio).

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Abstract

The invention relates to a method for forming curing laminated films of a siloxane resin compound. By using the siloxane resin compound, the curing laminated films which have the characteristics of excellent transparency, high scratch hardness, high insulation, low dielectric constant, excellent smoothness, no film loss during a sintering process, no crack even in case of thick films, no film peeling on a substrate interface and excellent sealing performances. The method comprises the steps of coating the siloxane resin compound containing a silanol group or an alkoxy silyl group on a substrate, pre-baking the siloxane resin compound, flushing and sintering the compound after the compound is processed in an alkaline aqueous solution. Then Sintered curing laminated films of the siloxane resin compound having the silanol group or the alkoxy silyl group are formed.

Description

technical field [0001] The invention relates to a method for forming a cured film of a silicone resin composition containing a silanol group or an alkoxysilyl group, and more particularly relates to a method for forming a silicone resin composition containing a silanol group or an alkoxysilyl group. A method of curing a film of an oxane resin composition, the cured film is excellent in transparency, has high scratch hardness, high insulation, low dielectric constant and excellent flatness, and does not generate cracks even when a thick film is formed , and there is no peeling of the film on the substrate interface, and the adhesion is excellent. Background technique [0002] Silicone resins are known as materials with high heat resistance, high hardness, high insulation, and high transparency, and are used in various applications. As one of these applications, a coating containing a silicone resin is cured (hereinafter, sometimes referred to as "fire-cured") coating, which ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/00C08J5/18C08L83/04C08L83/06C08G77/06C08G77/16
CPCC08J7/04C08J7/08C08J2483/04C08K5/19
Inventor 关藤高志田代裕治福家崇司横山大志野中敏章
Owner MERCK PATENT GMBH
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