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Urea formaldehyde resin adhesive for moisture-proof environment-friendly medium density fiberboard and production method as well as composite additives thereof

A technology of urea-formaldehyde resin and composite additives, which is applied in adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve the problems of high cost, high price, and poor market acceptance, and achieve low cost , low price, and the effect of reducing the amount of raw materials

Active Publication Date: 2012-04-11
GUANGXI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the above-mentioned methods can produce moisture-proof and environmentally friendly fiberboards, phenolic resins, melamine resins or isocyanates are too expensive, and melamine-modified urea-formaldehyde resins, regardless of blending and copolymerization, use more melamine (generally accounting for 8 to 20% of the total resin amount). %), leading to high cost and poor market acceptance

Method used

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  • Urea formaldehyde resin adhesive for moisture-proof environment-friendly medium density fiberboard and production method as well as composite additives thereof
  • Urea formaldehyde resin adhesive for moisture-proof environment-friendly medium density fiberboard and production method as well as composite additives thereof
  • Urea formaldehyde resin adhesive for moisture-proof environment-friendly medium density fiberboard and production method as well as composite additives thereof

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Experimental program
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Effect test

Embodiment 1

[0023] 1. Recipe composition

[0024] The molar ratio of formaldehyde to urea was F / U=1.156, 550 parts of formaldehyde (37% concentration), 354 parts of urea (98% purity), and 60 parts of compounding aids.

[0025] Percentage composition of compound auxiliary: sodium chloride 24%, esterified starch 16%, melamine 57%, dicyandiamide 3%.

[0026] 2. Glue making process

[0027] Put 480 parts of formaldehyde aqueous solution into the reaction kettle, start the stirrer, start heating and heating, stop heating when the temperature is raised to 40 ° C, and adjust the pH value with 25-30% sodium hydroxide aqueous solution to 7.5-8.0;

[0028] Add 170 parts of the first batch of urea, stop heating when the temperature rises to 70°C, then naturally heat up to 90°C, check pH (guaranteed pH=6.5~7.0), add 12 parts of compound additives after holding for 10 minutes, stir for 15 minutes minute;

[0029] Adjust pH=4.8-5.2 with 25-30% formic acid aqueous solution, and carry out polyconden...

Embodiment 2

[0044] 1. Recipe composition

[0045] The molar ratio of formaldehyde to urea was F / U=1.2, 550 parts of formaldehyde (37% concentration), 346 parts of urea (98% purity), and 67 parts of compounding auxiliary.

[0046] Percentage composition of compound auxiliary: sodium chloride 24%, oxidized starch 16%, melamine 57%, dicyandiamide 2%, hexamethylenetetramine 1%.

[0047] 2. Glue making process

[0048] Put 480 parts of formaldehyde aqueous solution into the reaction kettle, start the stirrer, start heating and heating, stop heating when the temperature is raised to 40 ° C, and adjust the pH value with 25-30% sodium hydroxide aqueous solution to 7.5-8.0;

[0049] Add 165 parts of the first batch of urea, stop heating when the temperature rises to 70°C, then naturally heat up to 90°C, check the pH (guaranteed pH=6.5~7.0), add 13 parts of compound additives after holding for 10 minutes, stir for 15 minutes minute;

[0050] Adjust the pH between 5.0 and 5.2 with 25-30% formi...

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Abstract

The invention discloses a urea formaldehyde resin adhesive for a moisture-proof environment-friendly medium density fiberboard and composite additives thereof. The adhesive is mainly prepared from the following raw materials in parts by weight: 50-60 parts of formaldehyde of which the mass concentration is 37%, 35-40 parts of urea of which the purity is 98%, and 4.5-7.5 parts of composite additives, wherein the composite additives comprise the following components in parts by weight: 40-90 parts of melamine, 1-30 parts of modified starch, 1-30 parts of anti-swelling agent and 1-5 parts of accelerant. By utilizing the renewable low-cost modified starch, the water resistance and bonding strength of the urea formaldehyde resin adhesive can be improved, the release amount of formaldehyde is reduced, the consumption of melamine is reduced, the product quality is stable, and the cost is lower. The invention also discloses a production method of the adhesive, which is characterized in that: the formaldehyde is fed for two times, the composite additives are fed for three times and are in end point control for three times, and the urea is fed for four times. Thus, few additives are used for playing a greater role, and the problems of higher reaction speed, longer adhesive curing time and the like caused by the melamine are avoided.

Description

technical field [0001] The invention belongs to the field of modified urea-formaldehyde resin adhesives, and in particular relates to a urea-formaldehyde resin adhesive for moisture-proof and environment-friendly medium-fiber boards, a production method and a composite auxiliary. Background technique [0002] In recent years, my country has become a major producer of wood-based panels. However, although the output is large, there are not many varieties, especially the functional varieties are too few. As far as fiberboard is concerned, most factories only produce furniture-type or common-type medium-density fiberboard used in dry conditions, which cannot meet the requirements of the development of the situation. The new national standard GB / T 11718-2009 for medium density fiberboard (referred to as medium fiberboard), which was implemented on April 1, 2010, has been classified according to the conditions of use. There are three major types of MDF: ordinary type, furniture ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/30C09J103/06C09J103/10C08G12/38
Inventor 刘幽燕张运明李青云
Owner GUANGXI UNIV
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