Low temperature solidified silver paste for keyboard lines and preparation method thereof

A line and low-temperature technology, which is applied in the field of low-temperature curing silver paste for keyboard lines and its preparation, can solve the problems of high cost and limited application range of silver conductor paste, and achieve the effect of changing electrical conductivity, excellent connection performance, and stable quality

Inactive Publication Date: 2012-04-25
IRICO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the silver powder in the existing silver paste is micron-based powder, and the film thickness and printing performance of the paste made by it have great limitations for the current high-end precision instruments. It

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A kind of low-temperature curing silver paste for keyboard circuit, its specific preparation is completed according to the following process steps:

[0024] First prepare the following raw materials according to mass percentage:

[0025] Silver powder 5%, silver-coated copper powder 60%, organic carrier 25%, additive 10%;

[0026] The above-mentioned silver powder is flake silver powder with a particle size of 1-10 μm, and the silver-coated copper powder is a silver-coated copper powder with a silver content of 10% and a particle size of 1-10 μm (no shape requirement). The additive is a dispersant, a defoamer and a smoothing agent, and the ratio of the three is 1:1:1 by weight, wherein the dispersant is selected from ethyl acetate; the defoamer is selected from light calcium carbonate; the smoothing agent is selected from Sodium dodecyl sulfonate.

[0027] Prepare the slurry according to the following process:

[0028] 1) Powder mixing: first weigh flake silver powde...

Embodiment 2

[0033] A kind of low-temperature curing silver paste for keyboard circuit, its specific preparation is completed according to the following process steps:

[0034] First prepare the following raw materials according to mass percentage:

[0035] Silver powder 20%, silver-coated copper powder 30%, organic carrier 44%, additive 6%;

[0036] The above-mentioned silver powder is flake silver powder with a particle size of 1-10 μm, and the silver-coated copper powder is a silver-coated copper powder with a silver content of 10% and a particle size of 1-10 μm. The additive is a dispersant, a defoamer and a smoothing agent, and the ratio of the three is 1:2:1 by weight, wherein the dispersant is selected for phosphoric acid triester; the defoamer is selected to have triglyceride; the smoothing agent is selected for Span- 60.

[0037] Prepare the slurry according to the following process:

[0038] 1) Powder mixing: first weigh flake silver powder with a particle size of 1-10 μm and ...

Embodiment 3

[0043] A kind of low-temperature curing silver paste for keyboard circuit, its specific preparation is completed according to the following process steps:

[0044] First prepare the following raw materials according to mass percentage:

[0045]Silver powder 10%, silver-coated copper powder 50%, organic carrier 32%, additive 8%;

[0046] The above-mentioned silver powder is flake silver powder with a particle size of 1-10 μm, and the silver-coated copper powder is a silver-coated copper powder with a silver content of 10% and a particle size of 1-10 μm. The additive is a dispersant, a defoamer and a smoothing agent, and the ratio of the three is 2:1:3 by weight, wherein the dispersant is selected from triphosphorus hydrogenated lactic acid; the defoamer is selected from hydrogenated castor oil; the smoothing agent is selected from two Methicone.

[0047] Prepare the slurry according to the following process:

[0048] 1) Powder mixing: first weigh flake silver powder with a p...

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Abstract

The invention relates to low temperature solidified silver paste for keyboard lines and a preparation method thereof. The silver paste is characterized by comprising the following components by weight percent: 5-20% of silver powder, 25-50% of organic carrier, 6-20% of additives and the balance of silver-coated copper powder. According to the invention the latest developed silver-coated copper powder is utilized to replace part of pure silver powder in the existing low temperature solidified silver paste, so that the microstructure of the silver paste is changed and the silver content is simultaneously reduced, thus changing the electrical conductivity, printing property and connection firmness of the paste, simultaneously reducing the cost and expanding the application range of the silver paste in the keyboard lines; the low temperature solidified silver paste prepared by the method has excellent electrical conductivity, contact property and connection property; and by adjusting the contents of various inorganic components and organic components, the silver paste can adapt to the printed substrates to achieve the effect of ensuring the properties of the product to be excellent, thus ensuring the product quality stability.

Description

technical field [0001] The invention relates to a low-temperature curing silver paste for keyboard circuits and a preparation method thereof. Background technique [0002] With the development of microelectronics technology, people have higher and higher requirements for electronic components, and the production is mostly carried out by process and standardization to reduce costs. The printing of keyboard lines is born with this demand of the electronic computer industry. Correspondingly, it is imperative to carry out research on new low-temperature curing pastes that require new low-temperature curing pastes to match the printing of keyboard circuits. [0003] Generally speaking, the main components of electronic paste include functional phases such as metals, noble metal powders, etc., inorganic binders such as glass powders, oxide powders, etc., organic binders, other solvents and additives. Generally, the functional phase in the electronic paste plays a conductive role ...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
Inventor 张宇阳
Owner IRICO
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