Copolyamide hot melt adhesive and its preparation method

A technology of copolyamide and hot melt adhesive, which is applied in the directions of adhesives, adhesive additives, non-polymer adhesive additives, etc. High and low temperature performance and mechanical properties, low water absorption, easy molding effect

Active Publication Date: 2012-05-09
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ordinary dimer acid type polyamide hot melt adhesive has high viscosity at high temperature, so it needs to be applied at a t

Method used

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  • Copolyamide hot melt adhesive and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0026] Example 1

[0027] Add 190.00g hydrogenated dimer acid, 12.50g sebacic acid, 1.8g tetra[β-(3,5-di-tert-butyl-4) into a 500mL four-necked flask with thermometer, stirrer, reflux and nitrogen tube. -Hydroxyphenyl) propionic acid) pentaerythritol ester, and 19.82g of ethylenediamine was charged into the constant pressure dropping funnel, and nitrogen was introduced to stir to start heating. The temperature was raised to 120°C within 30 minutes and kept at this temperature Start slowly adding ethylenediamine dropwise, and the dropwise addition is completed within 40 minutes. At this time, the temperature rises to 130°C, and the salt is formed at this temperature for 2 hours, and then the temperature rises slowly. In the process, water will evaporate. 3 The temperature rose to 240°C within hours, kept at this temperature for 2 hours, and then evacuated with a vacuum pump for 2 hours to a pressure of 100 Pa, and finally discharged under the protection of nitrogen to obtain a lig...

Example Embodiment

[0028] Example 2

[0029] Add 193.10g dimer acid, 15.0g sebacic acid, 1.0g tetra[β-(3,5-di-tert-butyl-4) into a 500mL four-necked flask with thermometer, stirrer, condenser and nitrogen tube. -Hydroxyphenyl) propionic acid] pentaerythritol ester, 0.6 g of tris(2,4-di-tert-butylphenyl) phosphite, and 29.80 g of ethylenediamine into a constant pressure dropping funnel, and nitrogen gas Stir and start heating, raise the temperature to 120°C within 60 minutes, and slowly add ethylenediamine at this temperature. The addition is completed within 60 minutes. At this time, the temperature rises to 130°C, and the salt is formed at this temperature. 2 The temperature will rise to 280℃ within 3 hours, keep it at this temperature for 5 hours, and then use a vacuum pump to evacuate for 3 hours to a pressure of 200Pa, and finally under nitrogen protection Lower the material to obtain a light yellow strip.

Example Embodiment

[0030] Example 3

[0031] Add 200.0g dimer acid, 10.00g sebacic acid, 1.5g tetra[β-(3,5-di-tert-butyl-4) into a 500mL four-necked flask with thermometer, stirrer, condenser and nitrogen tube. -Hydroxyphenyl) propionic acid] pentaerythritol ester, and 21.22g of ethylenediamine was charged into the constant pressure dropping funnel, and nitrogen was introduced to stir to start heating. The temperature was raised to 110°C within 50 minutes and kept at this temperature Start adding ethylenediamine slowly, and the addition is completed within 70 minutes. At this time, the temperature rises to 130℃, and the salt is formed at this temperature for 2 hours, and then the temperature is slowly raised. In the process, water will be evaporated, 2 hours The internal temperature was raised to 220°C, kept at this temperature for 1 hour, and then evacuated with a vacuum pump for 3 hours to a pressure of 400 Pa, and finally discharged under the protection of nitrogen to obtain a light yellow strip...

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PUM

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Abstract

The invention relates to a copolyamide hot melt adhesive and its preparation method. The copolyamide hot melt adhesive is composed of diacid, aliphatic diamine and an antioxidant. The preparation method comprises the following concrete steps of: (1) adding dimeric acid, aliphatic dibasic acid and the antioxidant into a reactor, stirring and heating under the protection of nitrogen, adding aliphatic diamine with continuously stirring, and reacting for 1-5 hours; (2) slowly heating up to the temperature of 220-280 DEG C while continuously steaming out water generated from the reaction, insulating, reacting for 1-3 hours and maintaining for 1-5 hours, and finally discharging under the protection of nitrogen to obtain the copolyamide hot melt adhesive. The copolyamide hot melt adhesive has low high-temperature viscosity, is easy to mold, has good high and low temperature resistance and mechanical properties, has low water absorption, is environmentally friendly and solvent-free, and can be widely applied in automobile electronic industry.

Description

technical field [0001] The invention relates to a copolyamide hot-melt adhesive and a preparation method thereof, in particular to an extremely low-viscosity fast-curing copolyamide hot-melt adhesive and a preparation method thereof, belonging to the field of hot-melt adhesives. Background technique [0002] Dimer acid type polyamide hot melt adhesive is formed by condensation of dimer acid and diamine or polyamine. It has good bonding performance to various polar substrates, has good flexibility, and has a wide range of applications. , environmental protection and solvent-free, good chemical resistance and excellent molding properties, etc., can be widely used in electronic appliances, automobiles, packaging, machinery and other industries. However, the ordinary dimer acid type polyamide hot melt adhesive has high viscosity at high temperature, so it needs to be applied at a temperature range of 30-80°C higher than the softening point, and the cooling speed is also very slo...

Claims

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Application Information

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IPC IPC(8): C09J177/08C09J11/06C08G69/34
Inventor 白战争王建斌陈田安
Owner YANTAI DARBOND TECH
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