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Copolyamide hot melt adhesive and its preparation method

A technology of copolyamide and hot melt adhesive, which is applied in the directions of adhesives, adhesive additives, non-polymer adhesive additives, etc. High and low temperature performance and mechanical properties, low water absorption, easy molding effect

Active Publication Date: 2012-05-09
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ordinary dimer acid type polyamide hot melt adhesive has high viscosity at high temperature, so it needs to be applied at a temperature range of 30-80°C higher than the softening point, and the cooling speed is also very slow, which is not conducive to molding

Method used

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  • Copolyamide hot melt adhesive and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Add 190.00 g of hydrogenated dimer acid, 12.50 g of sebacic acid, 1.8 g of tetrakis[β-(3,5-di-tert-butyl-4 -Hydroxyphenyl)propionic acid]pentaerythritol ester, and 19.82g ethylenediamine is packed in the constant pressure dropping funnel, feed into nitrogen and stir and start heating, the temperature is raised to 120 ℃ in 30 minutes, and at this temperature Start to slowly add ethylenediamine dropwise, and the dropwise addition is completed within 40 minutes. At this time, the temperature rises to 130°C, and forms a salt at this temperature for 2 hours, and then slowly raises the temperature. During this process, water will evaporate, 3 The temperature rose to 240°C within one hour, and was maintained at this temperature for 2 hours, then vacuumed with a vacuum pump for 2 hours to a pressure of 100 Pa, and finally discharged under the protection of nitrogen to obtain a light yellow rubber strip.

Embodiment 2

[0029] Add 193.10 g of dimer acid, 15.0 g of sebacic acid, 1.0 g of tetrakis[β-(3,5-di-tert-butyl-4 -Hydroxyphenyl) propionic acid] pentaerythritol ester, 0.6g tris (2,4-di-tert-butylphenyl) phosphite, and 29.80g ethylenediamine is packed in the constant pressure dropping funnel, feed nitrogen Stir and start heating, raise the temperature to 120°C within 60 minutes, and slowly add ethylenediamine dropwise at this temperature, complete the dropwise addition within 60 minutes, then the temperature rises to 130°C, and form a salt at this temperature 2 Hours, and then slowly raise the temperature, during which water will evaporate, the temperature will rise to 280°C within 3 hours, keep at this temperature for 5 hours, then use a vacuum pump to evacuate for 3 hours to a pressure of 200Pa, and finally protect it under nitrogen Bottom discharge to obtain light yellow rubber strips.

Embodiment 3

[0031] Add 200.0g of dimer acid, 10.00g of sebacic acid, 1.5g of tetrakis[β-(3,5-di-tert-butyl-4 -Hydroxyphenyl) propionic acid] pentaerythritol ester, and 21.22g ethylenediamine is packed in the constant pressure dropping funnel, feed nitrogen and stir and start heating, the temperature is raised to 110 ℃ in 50 minutes, and at this temperature Start to slowly add ethylenediamine dropwise, and the dropwise addition will be completed within 70 minutes. At this time, the temperature will rise to 130°C, and salt will be formed at this temperature for 2 hours, and then the temperature will be raised slowly. During this process, water will evaporate, and it will take 2 hours The internal temperature was raised to 220°C, kept at this temperature for 1 hour, and then evacuated with a vacuum pump for 3 hours to a pressure of 400 Pa, and finally discharged under the protection of nitrogen to obtain a light yellow rubber strip.

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Abstract

The invention relates to a copolyamide hot melt adhesive and its preparation method. The copolyamide hot melt adhesive is composed of diacid, aliphatic diamine and an antioxidant. The preparation method comprises the following concrete steps of: (1) adding dimeric acid, aliphatic dibasic acid and the antioxidant into a reactor, stirring and heating under the protection of nitrogen, adding aliphatic diamine with continuously stirring, and reacting for 1-5 hours; (2) slowly heating up to the temperature of 220-280 DEG C while continuously steaming out water generated from the reaction, insulating, reacting for 1-3 hours and maintaining for 1-5 hours, and finally discharging under the protection of nitrogen to obtain the copolyamide hot melt adhesive. The copolyamide hot melt adhesive has low high-temperature viscosity, is easy to mold, has good high and low temperature resistance and mechanical properties, has low water absorption, is environmentally friendly and solvent-free, and can be widely applied in automobile electronic industry.

Description

technical field [0001] The invention relates to a copolyamide hot-melt adhesive and a preparation method thereof, in particular to an extremely low-viscosity fast-curing copolyamide hot-melt adhesive and a preparation method thereof, belonging to the field of hot-melt adhesives. Background technique [0002] Dimer acid type polyamide hot melt adhesive is formed by condensation of dimer acid and diamine or polyamine. It has good bonding performance to various polar substrates, has good flexibility, and has a wide range of applications. , environmental protection and solvent-free, good chemical resistance and excellent molding properties, etc., can be widely used in electronic appliances, automobiles, packaging, machinery and other industries. However, the ordinary dimer acid type polyamide hot melt adhesive has high viscosity at high temperature, so it needs to be applied at a temperature range of 30-80°C higher than the softening point, and the cooling speed is also very slo...

Claims

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Application Information

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IPC IPC(8): C09J177/08C09J11/06C08G69/34
Inventor 白战争王建斌陈田安
Owner YANTAI DARBOND TECH
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