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Halogen-free environment-friendly copper-clad foil plate and preparation method thereof

A copper clad laminate and environmental protection technology, applied in the field of halogen-free environmental protection copper clad laminate and its preparation, can solve the problems of poor drilling performance, drill needle wear, broken needle, etc., and achieve low Z-CTE coefficient and water absorption rate, The effect of good machinability

Active Publication Date: 2014-07-23
NANYA NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is also poor in drilling performance in the PCB processing industry, and the drill needle is severely worn, which is likely to cause needle breakage

Method used

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  • Halogen-free environment-friendly copper-clad foil plate and preparation method thereof
  • Halogen-free environment-friendly copper-clad foil plate and preparation method thereof
  • Halogen-free environment-friendly copper-clad foil plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] 1. Raw material ratio

[0061] raw material

Formula ratio (mass ratio)

DOPO Structural Epoxy Resin

64.83

Phosphorus-containing phenolic resin

5

Dicyandiamide curing agent

2

Diethyltetramethylimidazole

0.15

Aluminum hydroxide (average particle size<8μm)

7.4

Silica powder (i.e. SiO 2 Powder, average particle size <8μm)

5.5

Silane

0.12

[0062] DMF

15

[0063] 2. Preparation process

[0064] 1> Glue adjustment:

[0065] a>Add DMF, silane and dicyandiamide curing agent into the stirring tank according to the proportion, start the high-speed stirrer to stir, the stirrer speed is 1700 rpm, then add aluminum hydroxide and silicon micropowder and stir for 2 hours, control the stirring tank The temperature is at 40°C;

[0066] b>Add phosphorus-containing phenolic resin and DOPO structure epoxy resin within 50 minutes after step a> is completed,...

Embodiment 2

[0082] 1. Raw material ratio

[0083] raw material

Formula ratio (mass ratio)

DOPO Structural Epoxy Resin

69.37

Phosphorus-containing phenolic resin

4

Dicyandiamide curing agent

2

Diethyltetramethylimidazole

1.15

Aluminum hydroxide (average particle size<8μm)

5.5

Silica powder (i.e. SiO 2 Powder, average particle size <8μm)

4.8

Silane

0.18

DMF

13

[0084] 2. Preparation process

[0085] 1> Glue adjustment:

[0086] a>Add DMF, silane and dicyandiamide curing agent into the mixing tank according to the proportion, turn on the high-speed stirrer to stir, the stirrer speed is 1700 rpm, then add aluminum hydroxide, silicon micropowder and stir for 1-3 hours, control the stirring The temperature in the tank is 40°C;

[0087] b>Add phosphorus-containing phenolic resin and DOPO structure epoxy resin within 50 minutes after step a> is completed, and at the sa...

Embodiment 3

[0103] 1. Raw material ratio

[0104] raw material

Formula ratio (mass ratio)

DOPO Structural Epoxy Resin

56.45

Phosphorus-containing phenolic resin

6

Dicyandiamide curing agent

1.8

Diethyltetramethylimidazole

2.15

Aluminum hydroxide (average particle size<8μm)

6.9

Silica powder (i.e. SiO 2 Powder, average particle size <8μm)

7.5

Silane

0.20

DMF

19

[0105] 2. Preparation process

[0106] 1> Glue adjustment:

[0107] a>Add DMF, silane and dicyandiamide curing agent into the stirring tank according to the proportion, start the high-speed stirrer to stir, the stirrer speed is 1700 rpm, then add aluminum hydroxide and silicon micropowder and stir for 2 hours, control the stirring tank The temperature is at 40°C;

[0108] b>Add phosphorus-containing phenolic resin and DOPO structure epoxy resin within 50 minutes after step a> is completed, and at the sam...

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Abstract

The invention discloses a halogen-free environment-friendly copper-clad foil plate and a preparation method thereof. The copper-clad foil plate is mainly prepared by coating adhesive prepared from DOPO structure epoxy resin and auxiliary materials on glass fiber cloth and then cladding copper foil through hot pressing. The preparation method comprises the following steps of 1) mixing the adhesive; 2) coating the adhesive and manufacturing prepregs; and 3) arranging plates and pressing. The prepared halogen-free glass cloth-based copper-clad foil plate has the glass transition temperature of more than or equal to 140 DEG C, low Z-axis coefficient of thermal expansion (Z-CTE), low water absorption, excellent heat resistance, machinability and flame retardance and the like.

Description

technical field [0001] The invention relates to the field of printed circuit copper clad laminates, in particular to a halogen-free environment-friendly copper clad laminate and a preparation method thereof. Background technique [0002] At present, the main FR-4 products in the CCL market often contain halogen elements that are harmful to organisms in order to meet the characteristics of related flame-retardant products. As people's requirements for the environment are getting higher and higher, relevant laws and regulations are gradually improving, so more environmentally friendly products are needed to meet the needs of production. [0003] Halogen-containing epoxy resins commonly used in industry have achieved the purpose of material flame retardancy, especially epoxy resins containing bromine elements are the most widely used. The flame retardant mechanism is as follows: the halogen is thermally decomposed to produce hydrogen halide during combustion, and the free radi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B17/02B32B15/14B32B15/18B32B7/12B32B37/06B32B37/10B32B37/12D06M15/55D06M15/415D06M11/45C09J163/00C09J161/06C08L63/00C08L61/06
Inventor 况小军粟俊华席奎东
Owner NANYA NEW MATERIAL TECH CO LTD