Method for preparing polishing solution by utilizing tailings recovered from crystal silicon cutting waste mortar

Abstract

The invention discloses a method for preparing a polishing solution by utilizing tailings in the process of recycling crystal silicon cutting waste mortar. The method comprises the following steps of: deironing by two steps, grinding, converting, stabilizing and the like. According to the method, the problems that silicon powder is passivated, silicon carbide is wrapped by silica sol and the like are solved effectively by a crushing and grinding process of a wet-method superfine stirring mill, wherein the solation conversion rate of a silicon component is over 98.5 percent. According to the method, silicon carbide of less than 5 micrometers and the silicon component resources are utilized comprehensively, the prepared novel silicon carbide and silica sol composite polishing solution has the high-efficiency grinding capacity of the silicon carbide, and silicon dioxide sol can be embedded into gaps of a textured surface in a polishing surface, so that the polishing surface is smooth.

Description

technical field [0001] The invention relates to a method for preparing a polishing liquid by using the tailing material in the resource recycling process of crystal silicon cutting waste mortar. Its application field is mainly the environmental protection of the resource recycling industry of crystal silicon cutting waste mortar, and realizes the comprehensive utilization of silicon component resources and ultra-fine silicon carbide. Background technique [0002] Silicon wafers are an important foundation for the development of the solar industry. With the rapid development of the global solar energy industry, the demand and processing volume of silicon wafers are increasing. According to industry statistics, China's silicon wafer production capacity has ranked first in the world since 2008. In 2010, the total domestic silicon wafer production capacity was nearly 14GW, accounting for more than 50% of the global total production capacity. [0003] Wire cutting is currently ...

AI Technical Summary

Problems solved by technology

[0004] As we all know, more than 50% of the crystalline silicon in the silicon wafer production process is cut into silicon powder and enters the slurry. Due to the lack of effective recycling and comprehensive utilization technologies, such a large amount of crystalline silicon materials are lost in vain every year.