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High-strength semiconductor packaging ceramic material and manufacturing method thereof

A ceramic material and semiconductor technology, applied in the production of high-reliability multi-layer ceramic packaging shells and the field of ceramic material production, can solve the problems of not fully satisfying high-speed and high-frequency fields, high manufacturing costs, and insufficient flexural strength. The effect of reducing size, improving conductivity, and reducing fuel cost

Active Publication Date: 2013-07-17
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The sintering temperature of conventional alumina ceramics is above 1500°C, which requires high-temperature hydrogen sintering furnace and consumes a lot of energy, such as electricity and hydrogen, so the manufacturing cost has been high. Moreover, the higher sintering temperature also limits the use of refractory W, Mo and other metals as conductor materials.
The metallization resistance of W and Mo materials is large, and the conductor loss is high, which cannot fully meet the applications in high-speed and high-frequency fields.
Although LTCC (low temperature co-fired ceramic materials) can use low-resistance conductors such as gold, silver, and copper, a large amount of glass components are added to reduce the sintering temperature, resulting in a bending strength of less than 200Mpa
[0004] At present, there is no domestic unit producing ceramic packaging materials that can match low-resistance conductor materials while maintaining high mechanical properties

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The raw materials are composed of the following materials in mass percentage: glass powder 20%, colorant 10%, and alumina powder 70%.

[0023] Alumina powder is alpha phase, purity is greater than 99.9%, powder particle size is less than 1μm, specific surface area is 3~10m 2 / g.

[0024] The mass ratio of each substance in the glass powder is: Li 2 O: SiO 2 : MgO: MnO 2 : Y 2 O 3 =1:4:2:3:1.

[0025] The mass ratio of each substance in the colorant is: TiO 2 : Cr 2 O 3 =1:1.

[0026] The preparation method is: (1) each component in the raw material is made into 0.5 micron powder and mixed uniformly; (2) molding; (3) after molding 2 :H 2 Sintering is carried out in a =1:1 atmosphere, and the sintering temperature is 1250°C.

[0027] The main technical indicators of the manufactured high-strength semiconductor packaging ceramic materials are as follows:

[0028] Flexural strength> 300MPa

[0029] Dielectric constant <9.5 (1MHz)

[0030] <9 (10GHz)

[0031] Dielectric loss -4 (1MHz)

[...

Embodiment 2

[0035] The raw materials are composed of the following materials in mass percentage: 15% glass powder, 5% colorant, and 80% alumina powder.

[0036] Alumina powder is alpha phase, purity is greater than 99.9%, powder particle size is less than 1μm, specific surface area is 3~10m 2 / g.

[0037] The mass ratio of each substance in the glass powder is: Li 2 O: SiO 2 : MgO: MnO 2 : Y 2 O 3 =1:4:2:3:1.

[0038] The mass ratio of each substance in the colorant is: TiO 2 : Cr 2 O 3 =1:1.

[0039] The preparation method is as follows: (1) each component in the raw material is made into 0.7 micron powder and mixed uniformly; (2) molding; (3) after molding 2 :H 2 =1:3 sintering in an atmosphere, the sintering temperature is 1300°C.

[0040] The main technical indicators of the manufactured high-strength semiconductor packaging ceramic materials are as follows:

[0041] Flexural strength> 300MPa

[0042] Dielectric constant <9.5 (1MHz)

[0043] <9 (10GHz)

[0044] Dielectric loss -4 (1MHz)

[0045] -4...

Embodiment 3

[0048] The raw materials are composed of the following substances in mass percentage: 15% glass powder, 15% colorant, 70% alumina powder.

[0049] Alumina powder is alpha phase, purity is greater than 99.9%, powder particle size is less than 1μm, specific surface area is 3~10m 2 / g.

[0050] The mass ratio of each substance in the glass powder is: Li 2 O: SiO 2 : MgO: MnO 2 : Y 2 O 3 =1:4:2:3:1.

[0051] The mass ratio of each substance in the colorant is: TiO 2 : Cr 2 O 3 =1:1.

[0052] The preparation method is as follows: (1) each component in the raw material is made into 0.6 micron powder and mixed uniformly; (2) molding; (3) after molding 2 :H 2 =1:2 sintering is performed in an atmosphere, and the sintering temperature is 1200°C.

[0053] The main technical indicators of the manufactured high-strength semiconductor packaging ceramic materials are as follows:

[0054] Flexural strength> 300MPa

[0055] Dielectric constant <9.5 (1MHz)

[0056] <9 (10GHz)

[0057] Dielectric loss -4 (1...

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Abstract

The invention discloses a high-strength semiconductor packaging ceramic material and a manufacturing method thereof, which relate to the field of manufacturing of high-reliability multilayer ceramic packaging shells. Raw materials include, by weight, 15%-25% of glass powder, 5%-15% of colorant, and the balance of aluminum oxide powder. The preparation method includes: firstly, making the raw materials into powder from 0.5 micrometer to 0.7 micrometer in size and mixing the powder uniformly; secondly, moulding; and thirdly, sintering in an atmosphere accordant to N2:H2=1:1-3 at the temperatureranging from 1200 DEG C to 1300 DEG C after moulding, wherein the proportion of the nitrogen to the hydrogen is volume ratio. The ceramic material is high in mechanical strength and low in sintering temperature, can be used as a conductor material matched with copper-tungsten, and conductivity of the conductor material can be improved greatly.

Description

Technical field [0001] The invention relates to the field of manufacturing ceramic materials, in particular to the field of manufacturing highly reliable multilayer ceramic packaging shells. Background technique [0002] In recent years, driven by the rapid development of semiconductor technology, electronic components have continued to develop in the direction of miniaturization, integration and high frequency. [0003] The sintering temperature of conventional alumina ceramics is above 1500°C, which has higher requirements for sintering equipment, requires a high-temperature hydrogen sintering furnace, and consumes a lot of energy, such as electricity, hydrogen, etc., so the manufacturing cost has been high. Moreover, the higher sintering temperature also limits the use of refractory metals such as W and Mo as conductor materials. W and Mo materials have large metallization resistance and high conductor loss, which cannot fully meet the applications in high-speed and high-freque...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/10C04B35/622
Inventor 张金利
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP