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Injection moldable electric epoxy molding plastic and preparation method thereof

An epoxy molding compound and injection molding technology, which is applied in the field of epoxy molding compound, can solve the problem that the epoxy molding compound for electrical engineering cannot be injection molded by a thermosetting injection machine, and achieve good latent properties, improved production efficiency, and fast curing speed Effect

Active Publication Date: 2012-06-20
桂林金格电工电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a kind of electrical epoxy molding compound with good latent property, fast curing speed at high temperature and injection molding for the existing ordinary epoxy molding compound for electrical engineering which cannot be injection molded by thermosetting injection machine. and its preparation method

Method used

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  • Injection moldable electric epoxy molding plastic and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] 1. Formula

[0046] Epoxy resin: phenolic epoxy resin FM-15 with a softening point of 90°C, 20%;

[0047] Curing agent: PF-8011 linear phenolic resin with a softening point of 84°C, 10%;

[0048] Curing accelerator: SFZ, 1.0%;

[0049] Filler: Silica powder with a particle size of 600 mesh, 47.5%;

[0050] Release agent: 1.5% (consisting of 33% zinc stearate and 67% palm wax);

[0051] Reinforcing fiber: 20% of glass fiber with a diameter of 15 μm and a length of 3 μm.

[0052] 2. Preparation method:

[0053] 1) Weigh each component according to the formula and reserve;

[0054] 2) Take the reinforcing fibers and dry them at 110°C until the water content is ≤0.1%, and cool to room temperature for later use;

[0055] 3) Take the epoxy resin and curing agent and crush them to below 45 mesh, and then send them to the high-speed mixer and mix them with the dried reinforcing fibers and other components;

[0056] 4) Feed the uniformly mixed materials into the thermosetting extruder for refin...

Embodiment 2

[0074] 1. Formula

[0075] Epoxy resin: 18%, of which 16% of the main resin (from 50% of the softening point of 74 ℃ cresol novolac epoxy resin JF-43 and 50% of the softening point of 90 ℃ cresol novolac epoxy resin FM-15 Composition); auxiliary resin is bisphenol A epoxy resin CYD-014 with a softening point of 100°C, 2%;

[0076] Curing agent: phenolic resin PF-8010 with a softening point of 96°C, 8%;

[0077] Curing accelerator: SFZ, 0.7%

[0078] Filler: 46.8% (composed of 83.5% of silica powder with a particle size of 600 mesh and 16.5% of nano calcium carbonate with a particle size of less than 80nm);

[0079] Release agent: 1.5% (consisting of 33% zinc stearate and 67% palm wax);

[0080] Reinforcing fiber: Basalt fiber with a diameter of 20 μm and a length of 3 μm, 25%.

[0081] 2. Preparation method:

[0082] The same as in Example 1.

Embodiment 3

[0094] 1. Formulation epoxy resin: 15% (composed of 50% phenolic epoxy resin FM-15 with a softening point of 95°C and 50% o-cresol phenolic epoxy resin JF-43 with a softening point of 65°C);

[0095] Curing agent: Novolac resin PF-8012 with a softening point of 94℃, 10%;

[0096] Curing accelerator: SFZ, 0.6%

[0097] Filler: Aluminum hydroxide, 54.4%

[0098] Release agent: 2% (consisting of 25% zinc stearate and 75% palm wax);

[0099] Reinforcing fiber: 18% (composed of 40% basalt fiber with a diameter of 20 μm and a length of 3 μm and 60% of an alkali-free glass fiber with a diameter of 15 μm and a length of 6).

[0100] 2. Preparation method:

[0101] Same as Example 1, except that in step 2), the actual temperature of the extruded material is between 85-96°C.

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Abstract

The invention discloses an injection moldable electric epoxy molding plastic and a preparation method thereof. The molding plastic comprises the following components in percentage by weight: 10 to 25 percent of epoxy resin, 5 to 20 percent of curing agent, 0.2 to 1.5 percent of curing accelerator, 30 to 65 percent of filler, 1 to 3 percent of releasing agent and 15 to 35 percent of reinforcing fibers, wherein the epoxy resin consists of 75 to 100 weight percent of primary resin with a softening point of 65 to 100 DEG C and 0 to 25 weight percent of secondary resin with a softening point of 60to 100 DEG C; the curing agent is linear phenolic resin with a softening point of 80 to 110 DEG C; and the curing accelerator is a 2-ethyl-4-methylimidazole derivative. The molding plastic disclosed by the invention is prepared by using specific raw materials and mixing ratio and can be molded by injection in a common thermosetting plastic injection machine; and the preparation method of the molding plastic is simple and easy to control.

Description

Technical field [0001] The invention relates to an epoxy molding compound, in particular to an injection-molded electrical epoxy molding compound and a preparation method thereof. Background technique [0002] Epoxy molding compound is a powder or granular molding compound made of epoxy resin as the matrix resin, adding curing agents, curing accelerators, fillers and other additives. It includes epoxy molding compounds used for electronic packaging and Epoxy molding compound for electricians. Ordinary epoxy molding compounds used in electrical engineering have a low curing temperature or poor latentness of accelerators. If a thermosetting injection machine is used for molding, it may be cross-linked in the barrel at the plasticizing temperature, causing the nozzle The blocked or molded products are not uniform, and only the molding process of molding or transfer can be used. However, molding and transfer molding have the disadvantages of poor processability and low production e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/04C08L63/02C08K13/06C08K9/06C08K7/14C08K7/10C08K5/3445C08G59/62B29C47/92B29C48/92
Inventor 王明军刘建文钟意周缄
Owner 桂林金格电工电子材料科技有限公司
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