High temperature curing monocomponent heat-conduction flame-retardation electronic pouring sealant and preparation method thereof

A high-temperature curing and potting glue technology, applied in chemical instruments and methods, non-polymer adhesive additives, adhesives, etc., can solve the problems of poor stability of one-component silica gel, low production efficiency, short operation time, etc. The effect of convenient construction, improved service life and long storage period

Inactive Publication Date: 2012-06-27
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One-component silica gel is generally realized by adding inhibitors, but this method is not only complicated in the process of preparing one-component silica gel, but also has relatively poor stability and short storage capacity. Generally 1 to 6 months
The two-component addition-type electronic potting glue needs to be mixed during use, and a large number of air bubbles are generated after mixing, and it needs to be used for a long time after vacuuming and degassing treatment, resulting in a long actual construction time and low production efficiency; and The operation time is short and it is easy to cause waste

Method used

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  • High temperature curing monocomponent heat-conduction flame-retardation electronic pouring sealant and preparation method thereof
  • High temperature curing monocomponent heat-conduction flame-retardation electronic pouring sealant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Accurately weigh 356.00g of vinyl silicone oil, 4.00g of low-hydrogen-containing silicone oil crosslinking agent, 20.00g of microcapsule-type platinum catalyst, 20.00g of carbon black, and 800.00g of modified silica powder with an average particle size of 5 μm, with an average particle size of 600.00g of 40μm spherical aluminum hydroxide powder and 200.00g of aluminum hydroxide powder with an average particle size of 10μm are added to a 2L double planetary power mixing mixer in turn, with a rotation speed of 100 rpm and a revolution speed of 8 rpm. After stirring for 0.5 hours under the condition of 10 minutes, raise the stirring paddle, scrape off the powder on the paddle, and under the conditions of vacuum degree -0.1MPa, rotation speed of 800 rpm and revolution speed of 16 rpm, Stir mechanically for 2 hours to obtain a high-temperature-cured thermally conductive and flame-retardant electronic potting adhesive.

[0043] When used, it is cured at 110°C for 0.5 hours to...

Embodiment 2

[0046] Accurately weigh 538.00g of vinyl silicone oil, 132.00g of low-hydrogen-containing silicone oil crosslinking agent, 800.00g of modified silica powder with an average particle size of 2μm, and 300.00g of spherical aluminum hydroxide powder with an average particle size of 60μm. 200.00g of spherical alumina powder with an average particle size of 10μm, 12.00g of microcapsule-type platinum catalyst, and 18.00g of iron blue are added to a 2L double planetary power mixer in turn, with a rotation speed of 70 rpm and a revolution speed of 5 rpm After stirring for 0.2 hours under the condition of 1 / min, raise the agitator, scrape off the powder on the agitator, and put it under the conditions of vacuum degree -0.10MPa, rotation speed of 200 rpm and revolution speed of 5 rpm , and mechanically stirred for 3 hours to obtain a high-temperature curing thermally conductive and flame-retardant electronic potting compound, which was packaged and placed for use.

[0047] When in use, c...

Embodiment 3

[0050] Accurately weigh 720.00g of vinyl silicone oil, 260.00g of low-hydrogen silicone oil crosslinking agent, 400.00g of silicon nitride powder with an average particle size of 10μm, 200.00g of spherical silicon oxide powder with an average particle size of 30μm, 50.00g of aluminum powder with a diameter of 20μm, 350.00g of aluminum hydroxide powder with an average particle size of 5μm, 4.00g of microcapsule-type platinum catalyst, and 16.00g of titanium dioxide were added in turn to a 2L double planetary power mixer with a rotation speed of 150 After stirring for 0.5 hours at a revolution speed of 10 revolutions per minute, raise the stirring paddle and scrape off the powder on the stirring paddle, at a vacuum degree of -0.09MPa, the rotation speed is 600 revolutions per minute, and the revolution Under the condition of a speed of 20 rpm, mechanically stir for 2 hours to obtain a high-temperature curing heat-conducting and flame-retardant potting compound, which is packaged ...

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Abstract

The invention relates to a high temperature curing monocomponent heat-conduction flame-retardation electronic pouring sealant and a preparation method thereof. The preparation method concretely comprises the following steps: 1, sequentially adding liquid silicon oil, a silane crosslinking agent, a microcapsule type catalyst, a toner, and heat-conduction flame-retardation powder to a stirring machine, and stirring for 0.2-1h to obtain a viscous liquid; and 2, stirring the viscous liquid obtained in step 1 for 2-3h under conditions that the vacuum degree is -0.08MPa--0.1MPa to obtain the high temperature curing monocomponent heat-conduction flame-retardation electronic pouring sealant. The high temperature curing monocomponent heat-conduction flame-retardation electronic pouring sealant of the invention has the advantages of enough long operation time, waste phenomenon reduction, solution of a bubble problem generated by mixing in the two-component silica gel applying process, and construction convenience.

Description

technical field [0001] The invention relates to a high-temperature curing electronic potting glue and a preparation method thereof, in particular to a high-temperature curing one-component heat-conducting and flame-retardant electronic potting glue and a preparation method thereof. Background technique [0002] With the development of the electronics industry, the performance requirements for electronic components and their assembly parts are becoming more and more stringent. In order to improve the shock and vibration resistance, anti-corrosion, dust-proof, moisture-proof, insulation and heat conduction performance of electronic components and their assembly parts, it is often necessary to fill the electronic components and their assembly parts to isolate them from the outside world and protect them. effect. [0003] Epoxy resin and silicone potting materials are widely used in the potting of electronic components and their components due to their excellent performance. A...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04C09K3/10
Inventor 唐丽王建斌解海华
Owner YANTAI DARBOND TECH
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