Method for preparing microcrystalline silicon film by plasma-enhanced chemical vapor deposition
A technology of microcrystalline silicon thin film and plasma, which is applied in the field of plasma enhanced chemical vapor deposition of microcrystalline silicon thin film, can solve the problems of slow deposition rate and small grain size of microcrystalline silicon thin film
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[0042] The invention provides an atomic layer deposition device with an arrayed hollow cathode structure. The set of devices includes a gas distribution system 1, a vacuum chamber 2, an array type hollow cathode upper electrode 3, a flat plate type grounded lower electrode 4, a vacuum system 5, and a power supply system 6. Utilizing the hollow cathode discharge effect of the arrayed hollow cathode upper electrode 3, the ionization efficiency of the gas can be greatly improved, the pressure of the discharge gas and the plasma density can be increased, and the activation efficiency of the reaction monomer in the atomic layer deposition process can be improved, and the space can be increased. The concentration of active groups in the film can greatly increase the deposition rate of the film and reduce the deposition temperature. The measurement results show that this array type hollow discharge can increase the plasma density to 10 11 ~10 13 / cm 3 , reduce the plasma energy be...
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