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Negative temperature coefficient thermal resistor chip material and preparation method thereof

A thermistor chip and negative temperature coefficient technology, which is applied in the field of negative temperature coefficient thermistor chip materials and its preparation, can solve the problems of NTC thermistor performance disadvantages, unfavorable suppression of surge current, chip stress concentration, etc., to achieve Good high-temperature aging performance and through-current aging performance, less defects, and large maximum stable current

Inactive Publication Date: 2012-08-01
SHENZHEN SUNLORD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Existing NTC thermistor chips for suppressing surge current are all prepared by dry compression molding process, but the chips prepared by dry compression molding process are prone to stress concentration or pore concentration, and these defects are harmful to NTC thermal sensitivity. The influence of resistance performance is extremely unfavorable, and the performance degradation or even destruction during use often starts from these defects, which is not conducive to better play its role in suppressing surge current

Method used

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preparation example Construction

[0030] In one embodiment, the preparation method of the negative temperature coefficient thermistor chip sequentially includes preparing slurry, casting the slurry into a green film, laminating the green film, isostatic pressing and firing; preparing the slurry The steps include: adding an organic solvent and a binder to the heat-sensitive powder in any of the above-mentioned embodiments to make a slurry, the quality of the organic solvent being 1.0-1.3 times the quality of the heat-sensitive powder, and the quality of the binder being 0.5-0.8 times the mass of heat-sensitive powder.

[0031] Among them, the following conditions can be preferred: the mass ratio of ethyl acetate and propanol mixture is 2:1 ~ 4:1 as organic solvent; the mass ratio of diethyl phthalate and isopropyl alcohol is 1:2 ~ 1:4 Alcohol is used as a binder; the pressure of isostatic pressing is 10-50MPa; the temperature of calcination is 1050-1250℃; the slurry of heat-sensitive powder is obtained by ball ...

Embodiment 1

[0034] The green diaphragm is prepared according to the following ratio, and is mixed, pre-sintered and pulverized to prepare heat-sensitive powder:

[0035] MnO 2 60mol%;

[0036] NiO 20mol%;

[0037] CuO 20mol%;

[0038] SiO 2 1% of the total mass of the above three main powders;

[0039] ZrO 2 1% of the total mass of the above three main powders;

[0040] Bi 2 o 3 0.5% of the total mass of the above heat-sensitive powder.

[0041] Add the mixture of ethyl acetate and propanol of 1.2 times of the total mass of the thermosensitive powder to the above thermosensitive powder, wherein the mass ratio of ethyl acetate and propanol is 2:1, and add the total mass of the thermosensitive powder A mixture of 60% diethyl phthalate and isopropanol, wherein the mass ratio of diethyl phthalate and isopropanol is 1:3 for tape casting, and the thickness is 20~50μm ( In this case specifically 40 μm) green membrane.

[0042]The thermistor chip is lamin...

Embodiment 2

[0046] The green diaphragm is prepared according to the following ratio, and is mixed, pre-sintered and pulverized to prepare heat-sensitive powder:

[0047] MnO 2 65mol%;

[0048] NiO 20mol%;

[0049] CuO 15mol%;

[0050] Al 2 o 3 1.5% of the total mass of the above three main powders;

[0051] Bi 2 o 3 1.5% of the total mass of the above three main powders.

[0052] Add the mixture of ethyl acetate and propanol of 1.2 times of the total mass of thermosensitive powder to the above thermosensitive powder, wherein the mass ratio of ethyl acetate and propanol is 2:1, and add the total mass of thermosensitive powder A mixture of 60% diethyl phthalate and isopropanol, wherein the mass ratio of diethyl phthalate and isopropanol is 1:3 for tape casting, and the thickness is 20~50μm ( In this case specifically 40 μm) green membrane.

[0053] The thermistor chip is laminated by the above-mentioned green film, after isostatic pressing at 30MPa, it is fir...

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Abstract

The present invention discloses a negative temperature coefficient thermal resistor chip material, wherein a thermal powder material of the negative temperature coefficient thermal resistor chip material comprises a transition metal oxide mixing powder material, and the transition metal oxide mixing powder material comprises, 50-85 mol% of manganese dioxide MnO2, 1-30 mol% of nickel monoxide NiO, and 1-20 mol% of copper oxide CuO, and further comprises, by weight, at least one component selected from 0.2-5% of silicon dioxide SiO2, 0.2-5% of zirconium dioxide ZrO2, 0.2-5% of aluminum oxide Al2O3, and 0.2-5% of yttrium oxide Y2O3. The thermal resistor chip of the present invention has the following advantages that: the defects are less; the high temperature aging property and the through-flow aging property are good; the maximum standing current and the maximum permission capacitance are high; the application range can be significantly extended; the material is suitable for inhibition of surge current; and the like.

Description

technical field [0001] The invention relates to a negative temperature coefficient (Negative Temperature Coefficient, NTC) thermistor, in particular to a chip material of the NTC thermistor used to suppress surge current in a circuit and a preparation method thereof. Background technique [0002] Existing NTC thermistor chips for suppressing surge current are all prepared by dry compression molding process, but the chips prepared by dry compression molding process are prone to stress concentration or pore concentration, and these defects have great influence on NTC thermal sensitivity. The influence of resistance performance is extremely unfavorable, and the performance degradation or even destruction during use often starts from these defects, which is not conducive to better play its role in suppressing surge current. Contents of the invention [0003] The technical problem to be solved by the present invention is to remedy the defects of the above-mentioned prior art, a...

Claims

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Application Information

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IPC IPC(8): C04B35/01C04B35/622
Inventor 严友兰包汉青潘士宾刘传东
Owner SHENZHEN SUNLORD ELECTRONICS
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