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Underfill flowable at room temperature and rapidly solidified at low temperature, and preparation method thereof

An underfill and rapid curing technology, which is applied to semiconductor/solid-state device components, adhesives, adhesive types, etc., to achieve the effects of low curing temperature, easy rework, and improved process efficiency

Active Publication Date: 2012-08-08
连云港华海诚科电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing technologies cannot meet the above requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Embodiment 1, a kind of underfill agent that can flow at room temperature and low temperature and quickly solidify, it is made of the raw materials of following weight ratio:

[0036] Liquid epoxy resin 20; Reactive epoxy thinner 5;

[0037] Polyester or polyether polyols 5;

[0038] Catalyst 0.1; Coupling agent 0.2;

[0039] Colorant 0.1; and the appropriate amount of blowing agent and flow aid;

[0040] in:

[0041] The liquid epoxy resin is selected from one or more mixtures of bisphenol A epoxy resin, bisphenol F epoxy resin and cycloaliphatic epoxy resin;

[0042] Reactive epoxy diluents are aliphatic or aromatic epoxy diluents with a viscosity of 10-1000 mpas instead of epoxy groups;

[0043] The average particle size of spherical silica powder is 0.1-1.0 microns, and the maximum particle size is 5 microns;

[0044] Polyester or polyether polyol is a polyester or polyether polyol prepolymer with a molecular weight of 200-50000 with hydroxyl groups;

[0045] ...

Embodiment 2

[0049] Embodiment 2, a kind of underfill agent that can flow at room temperature and cure quickly at low temperature, it is made of the raw materials with the following weight ratio:

[0050] Liquid epoxy resin 50; Reactive epoxy thinner 20;

[0051] Spherical silica powder 60; Polyester or polyether polyol 20;

[0052] Catalyst 5; Coupling agent 2;

[0053] Colorant 2; and the appropriate amount of blowing agent and flow aid;

[0054] in:

[0055] The liquid epoxy resin is selected from one or more mixtures of bisphenol A epoxy resin, bisphenol F epoxy resin and cycloaliphatic epoxy resin;

[0056] Reactive epoxy diluents are aliphatic or aromatic epoxy diluents with a viscosity of 10-1000 mpas instead of epoxy groups;

[0057] The average particle size of spherical silica powder is 0.1-1.0 microns, and the maximum particle size is 5 microns;

[0058] Polyester or polyether polyol is a polyester or polyether polyol prepolymer with a molecular weight of 200-50000 with hyd...

Embodiment 3

[0066] Embodiment 3, a kind of underfill agent that can flow at room temperature and cure quickly at low temperature, it is made of the raw materials with the following weight ratio:

[0067] Liquid epoxy resin 35; Reactive epoxy thinner 12;

[0068] Spherical silica powder 20; Polyester or polyether polyol 12;

[0069] Catalyst 2.5; Coupling agent 1.2;

[0070] Colorant 1.0; and the appropriate amount of foam blowing agent and flow aid;

[0071] in:

[0072] The liquid epoxy resin is selected from one or more mixtures of bisphenol A epoxy resin, bisphenol F epoxy resin and cycloaliphatic epoxy resin;

[0073] Reactive epoxy diluents are aliphatic or aromatic epoxy diluents with a viscosity of 10-1000 mpas instead of epoxy groups;

[0074] The average particle size of spherical silica powder is 0.1-1.0 microns, and the maximum particle size is 5 microns;

[0075] Polyester or polyether polyol is a polyester or polyether polyol prepolymer with a molecular weight of 200-500...

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Abstract

The invention discloses an underfill which is flowable at room temperature and is rapidly solidified at a low temperature. The underfill is prepared from the following raw materials, by weight, 20-50 parts of a liquid epoxy resin, 5-20 parts of an active epoxy diluent, 0-60 parts of spherical silicon powder, 5-20 parts of a polyester or polyester polyol, 0.1-5 parts of a catalyst, 0.2-2 parts of a coupling agent, 0.1-2 parts of a pigment, and proper amounts of a defoaming agent and a flow assistant. The invention also discloses a preparation method of the underfill. The underfill flowable at room temperature and rapidly solidified at a low temperature, which is prepared according to the method of the invention, has the advantages of reasonable composition ratio, fast flow speed, low solidification temperature, short solidification time, easy reparation, and effective improvement of the technological efficiency of a production lien of electronic products.

Description

technical field [0001] The present invention relates to an underfill material used for assembling semiconductor components on electronic circuit boards, especially an underfill that can flow at room temperature and quickly solidify at low temperature; the invention also relates to a preparation method of the underfill . Background technique [0002] With the rapid development and popularization of automotive electronic devices and other consumer electronic products, microelectronic packaging technology is facing challenges and opportunities brought about by the development trend of electronic products "high cost performance, high reliability, multi-function, miniaturization and low cost". . Flip Chip (FC), Chip Scale Package (CSP), Ball Grid Array (BGA) and Micro Ball Grid Array (μBGA) emerged under these challenges and opportunities. Usually FC / CSP / BGA / μBGA is welded together with the substrate through bump soldering points in the form of flip chip, which provides higher...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/04H01L23/18
Inventor 季青秦苏琼谢雷陶军韩江龙王志孙勇张永成李兰侠
Owner 连云港华海诚科电子材料有限公司
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