Manufacturing method of resin diamond wire

A technology of resin diamond wire and manufacturing method, which is applied in the direction of fine working devices, manufacturing tools, metal sawing equipment, etc., can solve the problem that it takes a long time for the adhesive to harden, and achieves short half-hardening time, advanced technology, The effect of stable production process

Inactive Publication Date: 2012-09-12
HONGKONG YACHENG INT
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0016] However, the current production process of diamond wire still has defects. In the past, resin was used as a binder for the manufacture of diamond wire grit fixing wires. After the powder slurry containing sand grains and binder was applied to the core wire, the binder takes a long time to harden

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  • Manufacturing method of resin diamond wire
  • Manufacturing method of resin diamond wire

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Embodiment Construction

[0043] As shown in the figure, the process flow diagram of the present invention shows that the steps include continuous release of the core wire, cleaning of the steel wire, slurry distributor, semi-hardening treatment in the heating furnace, take-up of the qualified wire, and curing and setting in the constant temperature furnace.

[0044] The first step is to prepare emery resin liquid, including: emery after metal (Ni, Ti or Cu, etc.) Paste in methyl formamide, the components are calculated by weight percentage: 5-30 wt% of corundum with nickel coating (coating amount is 1-55 wt%), resin binder is resole phenolic resin (resole resin), (C 6 h 6 O??CH 2 O) x )5~30wt%, SiC5~20wt%, organic solvent N,N-dimethylformamide ((CH 3 )2NCHO) 5-25wt%, put each component into a container, stir with a mixer, dissolve the powdered resole phenolic resin in an organic solution, and mix emery and SIC to obtain a paste emery resin liquid, which is injected into the mold. The embodiment i...

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Abstract

The invention discloses a manufacturing method of a resin diamond wire, relating to the field of photovoltaic technology. The manufacturing method of a resin diamond wire adopts viscose, carborundum and core wire and sequentially comprises the following steps of: preparing carborundum resin liquid including carborundum coated with metal, resin adhesive, organic solvent and SiC sand grain auxiliary, wherein the resin adhesive is soluble phenolic resin; mixing with a mixer until the phenolic resin is dissolved in the paste in dimethylformamide, and then injecting into a mould; in the mould, smearing the resin liquid on the steel wire; processing the steel wire with the resin liquid by a heating furnace to obtain a semi-hardened resin diamond wire; and collecting the wire to obtain a finished product of the resin diamond wire. The method disclosed by the invention has stable technology, short semi-hardening time and high production efficiency; and the production equipment can also be miniaturized.

Description

technical field [0001] The invention relates to a manufacturing method of a resin diamond wire, which relates to the technical field of photovoltaics. Background technique [0002] Photovoltaic (PV or photovoltaic) is the abbreviation of solar photovoltaic power system (photovoltaic power system). It is a new type of power generation system that uses the photovoltaic effect of solar cell semiconductor materials to directly convert solar radiation energy into electrical energy. There are two modes of independent operation and grid-connected operation. [0003] At present, the governments of various countries are actively developing clean energy. With the reduction of technology upgrading costs and the introduction of active photovoltaic policies in various countries, the photovoltaic industry is expected to develop rapidly. According to the forecast of the European Photovoltaic Industry Association (EPIA), the photovoltaic market will maintain a rapid growth rate of 30% to 4...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04
CPCB23D61/185
Inventor 德田龙一吴燕飞
Owner HONGKONG YACHENG INT
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