Novel high-power light emitting diode (LED) light source structure based on non-metal-based printed circuit board

Abstract

The invention discloses a novel high-power light emitting diode (LED) light source structure based on a non-metal-based printed circuit board (PCB). The novel high-power LED light source structure mainly comprises high-power LEDs, non-metal-based PCBs, a radiator, and a corresponding insulating spacer or gasket which is added according to the needs of electrical insulation and fastening degree control, wherein LEDs have a thermoelectrically separated pin type packaging structure, the pins can be bent toward the direction of a lens or a base, provide electrical connection and provide high fastening force; the non-metal-based PCBs are common hard single-sided copper-clad plates and are provided with LED assembling through holes which have the same number as that of the LEDs, and two sides of each assembling through hole are uniformly provided with circuits and pads; and therefore, the welded LEDs can give out light outwards through the assembling through holes, and the assembling through holes have the functions of clamping the LEDs at fixed points and can provide high fastening force. The LED bases with the novel structure can be directly contacted with the radiator, so that the radiating thermal resistance is obviously reduced.

Description

technical field [0001] The invention relates to a new structure of an LED light source, in particular to a new structure of a high-power LED light source based on a non-metallic circuit board to achieve good electrical connection, physical bearing and heat dissipation effect, and can be widely used in the field of LED semiconductor lighting. Background technique [0002] LED (Light Emitting Diode) semiconductor light-emitting device has many performance advantages that traditional light sources cannot match. It is a new generation of "green lighting" light source that meets energy conservation and environmental protection. At present, in order to realize the large-scale replacement of traditional lamps by LED light sources and open up a huge general lighting market, LEDs need to greatly increase their input power to achieve higher luminance. However, with the continuous improvement of input electric power, the chip area of ​​high-power LED (≥1W) will produce up to 100W / cm 2...

AI Technical Summary

Problems solved by technology

However, this assembly structure often has the following problems: (1) The heat generated by the LED must be dissipated to the surrounding environment through the package base → thermal grease filling interface 1 → MCPCB → thermal grease filling interface 2 → radiator, the heat flow The path is long, and the thermal resistance of the sub-structure and the interface are more; (2) It is difficult to minimize the thickness of the thermal grease layer under the LED base only by relying on the weak fastening force generated after the LED pins are soldered, causing the interface 1. The bonding is not tight, even there are obvious gaps, and the interface thermal resistance is high; (3) The MCPCB has a large area, and a large amount of thermal conductive silicone grease must be applied when assembling with the radiator, and air bubbles need to be removed when the screws are fastened. and excess silicone grease are discharged from the interface. Due to the high price of thermal conductive silicone grease, the consumption is large, and the assembly cost is high; and the fluidity of the silicone grease is poor. The uneven thickness of silicone grease occurs, which brings about the consequences of large thermal resistance of interface 2 and poor regional consistency

[0005] Similarly, MCPCB itself also has some shortcomings: (1) The dielectric layer inside the MCPCB is a polymer composite material, and its thermal conductivity is too low, which has become a bottleneck for heat conduction through MCPCB; (2) The temperature resistance of the dielectric layer material Poor, it should not exceed 250°C to 300°C during the manufacturing process, so the temperature control parameters of the soldering process must be adjusted in advance when passing through the tin furnace;

[0006] (3) The manufacture of MCPCB requires a large amount of metal materials as the substrate, and the process is complicated, which makes the cost of the lamp board high, limits its market development potential, and affects the popularization of high-power LED light sources to ordinary users

However, due to the poor thermal conductivity of non-metallic substrates, it is limited to the production of low-power LED lamp panels that generate little heat and have almost no heat dissipation problems. Therefore, in order to apply it to high-power LED light sources, the relevant structural design must be improved. , thus significantly improving the heat dissipation capacity of the light source system while realizing the electrical connection and mechanical load-bearing functions

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