Method for preparing anti-radiation coating film

Abstract

The invention discloses a method for preparing an anti-radiation coating film. The method comprises the following steps of: performing surface treatment on a transparent film substrate, and coating a compound adhesive layer on the treated surface; adding a dispersing agent into mixed nano powder of which the average particle diameter is 15-300 nanometers, and grinding and dispersing into a suspension by using a grinder; and coating the suspension onto a compound adhesive layer surface of the transparent film substrate, and curing into a film to obtain an anti-radiation coating film. Compared with the prior art, the method has the advantages: the anti-radiation coating film produced by adopting the method has the characteristics of uniformity and high thickness controllability of a coating formed by a coating compound, higher adhesion among film layers, and excellent product quality performance; and the method has the advantages of simple process, high efficiency, low cost and capability of realizing industrial mass production.

Description

technical field [0001] The invention relates to a preparation method of an anti-radiation coating film. Background technique [0002] With the vigorous development of electronic technology, electronic products such as mobile phones, MP4, MP5, cameras, digital video cameras, and notebook computers are being introduced from old to new. In order to prevent the screen surface of electronic products from being scratched or worn, affecting the use, and to shield electromagnetic waves and eliminate static electricity, a screen protective film is generally attached to the screen surface of electronic products. [0003] The anti-radiation layer of the screen protective film is generally combined with the PET base film by high-temperature sputtering, evaporation or chemical deposition. However, the preparation process of the sputtering method is complicated, and the sputtering process needs to be completed under high temperature conditions, resulting in equipment and product costs ar...

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Problems solved by technology

[0003] The anti-radiation layer of the screen protective film is generally combined with the PET base film by high-temperature sputtering, evaporation or chemical deposition. However, the preparation process of the sputtering method is complicated, and the sputtering process needs to be completed under high temperature conditions, resulting in equipment and product costs are high; although the production cost of the evaporation method is lower than that of the high-temperature sputtering method, it is not suitable for refractory metals and high-temperature-resistant dielectric materials, so its use is limited; The production and growth speed cannot be controlled, so it is difficult to prepare ideal and complex film materials, and the product performance is not high