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Process for preparing SiC/Al electronic packaging materials by means of pressureless infiltration

A technology of electronic packaging materials and infiltration method, applied in the field of preparation of electronic packaging materials, can solve the problems of low SiC content, unsatisfactory wettability, and inability to keep up with dimensional accuracy.

Active Publication Date: 2014-01-15
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The Al / SiC electronic packaging material prepared by the pressureless infiltration method can greatly reduce the thermal expansion coefficient of the material while ensuring high thermal conductivity, but due to the pressureless infiltration process, the interface between the molten aluminum and SiCp The wettability of Al is not ideal, which will reduce the capillary action of the material during the impregnation process. In the absence of external force, it is difficult for the Al liquid to penetrate into the SiC preform smoothly.
At the same time, there are still problems such as low SiC content, dimensional accuracy cannot keep up, and high production cost, so only small batch production can be carried out

Method used

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  • Process for preparing SiC/Al electronic packaging materials by means of pressureless infiltration
  • Process for preparing SiC/Al electronic packaging materials by means of pressureless infiltration
  • Process for preparing SiC/Al electronic packaging materials by means of pressureless infiltration

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] The process for preparing SiC / Al electronic packaging materials by pressureless impregnation method includes the following steps:

[0037] Weigh silicon carbide particles with a particle size of 150 μm, 20 μm, and 15 μm according to a mass ratio of 8:1:1;

[0038] Mix the silicon carbide particles into a ball mill and mix them evenly, then add binders, plasticizers, lubricants and solvents and mix them evenly. The amount of binders, plasticizers, lubricants and solvents added is 1% of the total weight of silicon carbide. %; the binder, plasticizer, lubricant and solvent are respectively polyvinyl alcohol, glycerol, stearic acid and distilled water, and the mass percentages added are 20%, 5%, 5%, and 70% respectively. The mixture is introduced into a mold for compression molding; the molding pressure is 30-40MPa, and when the pressure reaches the preset value, the pressure is maintained for 1-2 minutes, and then the pressure is released to obtain a formed SiC preform.

...

Embodiment 2

[0042] The process for preparing SiC / Al electronic packaging materials by pressureless impregnation method includes the following steps:

[0043] Weigh silicon carbide particles with a particle size of 150 μm, 20 μm, and 15 μm according to a mass ratio of 7:2:1;

[0044] Mix the silicon carbide particles into a ball mill and mix them evenly, then add binders, plasticizers, lubricants and solvents and mix them evenly. The amount of binders, plasticizers, lubricants and solvents added is 1% of the total weight of silicon carbide. %; The binder, plasticizer, lubricant and solvent are respectively polyvinyl alcohol, glycerol, stearic acid and distilled water, and the additions are respectively 20%, 5%, 5%, and 70%. The mixture is introduced into a mold for compression molding; the molding pressure is 30-40 MPa, and when the pressure reaches a preset value, the pressure is maintained for 1-2 minutes, and the pressure is released to obtain a formed SiC preform.

[0045] Heat the mo...

Embodiment 3

[0048] The process for preparing SiC / Al electronic packaging materials by pressureless impregnation method includes the following steps:

[0049] Weigh silicon carbide particles with a particle size of 150 μm, 20 μm, and 15 μm according to a mass ratio of 6:3:1;

[0050] Mix the silicon carbide particles into a ball mill and mix them evenly, then add binders, plasticizers, lubricants and solvents and mix them evenly. The amount of binders, plasticizers, lubricants and solvents added is 1% of the total weight of silicon carbide. %; The binder, plasticizer, lubricant and solvent are respectively polyvinyl alcohol, glycerol, stearic acid and distilled water, and the additions are respectively 20%, 5%, 5%, and 70%. The mixture is introduced into a mold for compression molding; the molding pressure is 30-40 MPa, and when the pressure reaches a preset value, the pressure is maintained for 1-2 minutes, and the pressure is released to obtain a formed SiC preform.

[0051] Heat the mo...

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Abstract

The invention relates to a process for preparing SiC / Al electronic packaging materials by means of pressureless infiltration. The process includes: weighing silicon carbide gains with the grain sizes of 140-170 micrometers, 15-70 micrometers and 14-17 micrometers respectively within the mass ratio range of 6-9:0.5-2:0.5-2, adding binding agent, plasticizer, lubricant and solvent with uniform mixing, performing preheating treatment and sintering after compression molding, and then infiltrating in an Al-Mg-Si alloy melt. The thermal physical property and the mechanical property of the three-grain SiC / Al composite materials prepared by the grains with the three grain sizes are better than those of double-grain SiC / Al composite materials, the thermal expansion coefficient of the SiC / Al electronic packaging materials ranges from 7.92X10<-6>K<-1> to 9.71X10<-6>K<-1>, the thermal conductivity of the SiC / Al electronic packaging materials ranges from 140W / mK to 159W / mK, and the bending strength of the SiC / Al electronic packaging materials ranges from 300MPa to 337MPa.

Description

technical field [0001] The invention relates to a preparation method of an electronic packaging material, in particular to a process for preparing a SiC / Al electronic packaging material by a pressureless impregnation method. Background technique [0002] The so-called electronic packaging is to use micro-connection technology to seal semiconductor components and devices. In addition to achieving reliable electrical connection with external circuits, it can also play an effective role in heat transfer, machinery and insulation, thereby forming a complete three-dimensional structure. craft. It has the functions of transmitting electric energy and circuit signals, providing heat dissipation channels, bearing external forces and structural protection. [0003] Electronic packaging materials mainly have four functions: mechanical support, heat dissipation, signal transmission and chip protection. These functions determine that electronic packaging materials require the followin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C29/06C22C1/10
Inventor 陈传忠何青山王佃刚
Owner SHANDONG UNIV