Process for manufacturing series of intermediate-voltage N-type vertical conduction double-diffused metal oxide semiconductor transistors by using composite epitaxy
A field effect transistor and manufacturing process technology, applied in the field of manufacturing medium-voltage N-type series VDMOS process, can solve the problem of on-resistance drop and so on
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[0046] Such as figure 2 Shown is a composite epitaxy process for manufacturing medium-voltage series vertical double-diffused field effect transistors. The specific implementation method is as follows:
[0047] 1) Feeding: arsenic-doped or antimony-doped substrate silicon wafer material, with a resistivity of 0.03ohm.cm or below.
[0048] 2) The first step of epitaxy: grow N-type epitaxy with a thickness of 4um and a resistivity of 1 ohm.cm. It is used to form a high-concentration transition zone with a high-concentration substrate. On-resistance can be reduced.
[0049] 3) The second step of epitaxy: grow N-type epitaxy with a thickness of 4um and a resistivity of 10 ohm.cm. It is used to epitaxially form a medium-concentration transition region with the high-concentration first part. On-resistance can also be reduced.
[0050] 4) The third step of epitaxy: grow N-type epitaxy with a thickness of 42um and a resistivity of 18 ohm.cm. Provide a withstand voltage layer fo...
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