Superhigh heat conduction metal-based circuit board as well as preparation method and applications thereof

A heat-conducting metal and circuit board technology, applied in the electronic field, can solve problems such as low product yield, energy consumption in the production process, and difficult processing and molding, so as to improve product yield, reduce production cost, and improve production efficiency.

Active Publication Date: 2012-10-17
STARARC COATING TECH SUZHOU
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Problems solved by technology

[0005] At present, most AlN ceramic substrates are manufactured by sintering ceramic powders. The circuit boards produced in this way have relatively high material brittleness, cannot be made into large-area circuit board products, and are not easy to process and shape; in addition, due to the sintering temperature High, the cost of sintering AlN ceramics on metal substrates is high and the product yield is low
[0006] A

Method used

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  • Superhigh heat conduction metal-based circuit board as well as preparation method and applications thereof
  • Superhigh heat conduction metal-based circuit board as well as preparation method and applications thereof

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[0031] In recent years, various coating technologies have developed continuously, bringing many advances and conveniences to industrial manufacturing and people's daily life. Relying on coating technology, products or parts can obtain better surface properties, so as to make up for some characteristics that the material itself does not have. Diamond-like Carbon coating (Diamond-like Carbon), or referred to as DLC coating is a diamond structure (sp 3 bond) and graphite structure (sp 2 bond) metastable amorphous material.

[0032] In coating technology, physical vapor deposition refers to the process of evaporation, ionization or sputtering to produce metal particles and react with reactive gases to form compounds deposited on the surface of the workpiece, referred to as PVD. At present, the commonly used PVD coating technology is mainly divided into three categories, which are vacuum evaporation coating technology, vacuum sputtering coating technology and vacuum ion beam coat...

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Abstract

The invention provides a superhigh heat conduction metal-based circuit board as well as a preparation method thereof. A layer of AIN (aluminum nitride) ceramic coating or AIN+DLC (aluminum nitride+diamond like carbon) composite coating is coated on the surface of a metal-based plate material, such as aluminum, copper so as to form a superhigh heat conduction circuit board. The superhigh heat conduction metal-based circuit board is applied to the fields which need superhigh heat conduction, such as high-power LED (light-emitting diode) devices or modules, improves the heat conduction and heat radiation capability of a base plate as well as meets the requirements of heat conduction and dissipation of electric appliance.

Description

technical field [0001] The invention relates to a metal-based circuit board with ultra-high thermal conductivity and a preparation method thereof, belonging to the technical field of electronics. Background technique [0002] In industry, some heat sources or light sources, such as emerging LED devices or modules, often require rapid heat conduction and heat dissipation. LED has the advantages of energy saving and environmental protection, and has become the fourth generation of solid-state lighting fixtures. The development of LEDs from signal indicators to lighting fixtures needs to increase power, that is, to develop high-power chips. This needs to solve many problems, among which the heat conduction and heat dissipation of high-power chips is a technical problem that must be solved. It is an effective technical way to package high-power LEDs with circuit substrates with high thermal conductivity and heat dissipation performance. [0003] LED packaging substrates can in...

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Application Information

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IPC IPC(8): H01L33/62C23C14/06C23C14/14C23C14/34
Inventor 钱涛张铁乐务时
Owner STARARC COATING TECH SUZHOU
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