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Curable composition, cured article, and use of curable composition

A technology of curable composition and cured product, which can be applied in the direction of adhesive type, electric solid device, semiconductor/solid device manufacturing, etc., can solve the problems of inability to meet the light deterioration resistance, decreased adhesion, etc., and achieve excellent transparency , the effect of high adhesion

Active Publication Date: 2014-11-12
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, when these compositions are used, there are cases where sufficient resistance to light deterioration due to changes over time cannot be satisfied, or the adhesive force may be lowered.

Method used

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  • Curable composition, cured article, and use of curable composition
  • Curable composition, cured article, and use of curable composition
  • Curable composition, cured article, and use of curable composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0216] Hereinafter, the present invention will be described in more detail by way of examples and comparative examples, but the present invention is not limited to the following examples.

[0217] (Determination of weight average molecular weight)

[0218] The weight average molecular weight (Mw) of the silane compound copolymer obtained in the manufacture example was measured with the following apparatus and conditions as a standard polystyrene conversion value.

[0219] Device name: HLC-8220GPC, manufactured by Tosoh Corporation

[0220] Column: Connect TSKgelGMHXL, TSKgelGMHXL and TSKgel2000HXL in sequence

[0221] Solvent: THF

[0222] Injection volume: 80μl

[0223] Measuring temperature: 40°C

[0224] Flow rate: 1ml / min

[0225] Detector: Differential refractometer.

[0226] (Measurement of IR spectrum)

[0227] The IR spectrum of the silane compound copolymer obtained in the manufacture example was measured using the following apparatus.

[0228] Fourier transfo...

manufacture example 1）

[0230] In a 300 ml eggplant-shaped flask, 16.7 g (84 mmol) of phenyltrimethoxysilane (manufactured by Tokyo Chemical Industry Co., Ltd.) as the silane compound (2) and 3-acetoxypropyltrimethoxysilane as the silane compound (1) were charged. 8.0 g (36 mmol) of methyl silane (manufactured by Aymax Co., Ltd.), 120 ml of toluene as a solvent, and 60 ml of distilled water, and then add 0.15 g (1.5 mmol) of phosphoric acid (manufactured by Kanto Chemical Co., Ltd.) as a catalyst while stirring, and continue stirring at room temperature 16 hours.

[0231] After completion of the reaction, 100 ml of ethyl acetate was added to the reaction mixture, and neutralized with saturated aqueous sodium bicarbonate solution. After standing still for a while, water was removed, and the organic layer was washed twice with distilled water, and dried over anhydrous magnesium sulfate. After filtering the magnesium sulfate, the filtrate was concentrated to 50 ml with a rotary evaporator, added dropwi...

manufacture example 2）

[0236] In Production Example 1, except that the usage-amount of phenyltrimethoxysilane was 14.3 g (72 mmol), and the usage-amount of 3-acetoxypropyltrimethoxysilane was 10.7 g (48 mmol). 1 was carried out in the same manner to obtain 15.9 g of a silane compound copolymer (A2).

[0237] The weight average molecular weight (Mw) of the silane compound copolymer (A2) was 2,600, and the molecular weight distribution (Mw / Mn) was 1.51.

[0238] In addition, the IR spectrum data of the silane compound copolymer (A2) are shown below.

[0239] Si-Ph: 699cm -1 , 741cm -1 , Si-O: 1132cm -1 ,-CO: 1738cm -1 .

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Abstract

Disclosed are: a curable composition comprising (A) a silane compound copolymer having a specific repeating unit, (B) an epoxy compound, and (C) a curing agent comprising an alicyclic acid anhydride having a carboxyl group and another alicyclic acid anhydride at a such a ratio that (A):[(B)+(C)] is 100:20 to 100:60 (by mass); a cured article produced by curing the composition; and a method for utilizing the composition as an adhesive agent for a fixing material for an optical element or a sealing material for a fixing material for an optical element. The curable composition can exhibit excellent heat resistance and transparency for a long period and enables the production of a cured article capable of exhibiting high adhesion properties even at high temperatures.

Description

technical field [0001] The present invention relates to a curable composition capable of obtaining a cured product having excellent transparency and heat resistance and high adhesive force, a cured product obtained by curing the composition, and use of the composition as an optical element fixing material The method of using adhesives or sealants for optical element fixing materials. Background technique [0002] Hitherto, curable compositions have been variously improved according to their uses, and have been widely used industrially as raw materials for optical parts or molded articles, adhesives, coating agents, and the like. For example, curable compositions that form cured products with excellent transparency are often used preferably as raw materials or coating agents for optical parts, and curable compositions that form cured products with high adhesive force are often used preferably as adhesives. or coating agent. [0003] In addition, in recent years, curable com...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/04C08L63/00C08K5/12C08K5/49C09J183/04C09J163/00C08G59/42H01L21/52H01L23/29H01L23/31H01L33/56C08G77/04
CPCH01L2924/09701H01L23/293C08G77/24C08G77/26C08L83/08C08G59/4085C08G59/4215H01L2924/0002
Inventor 樫尾干广赵立民
Owner LINTEC CORP
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