Conductive paste for thick film circuit, thick film circuit board employing same and manufacturing method thereof

A conductor paste, thick film circuit technology, applied in semiconductor/solid-state device manufacturing, circuits, electric solid-state devices, etc. Good chemical properties, excellent square resistance effect

Inactive Publication Date: 2012-10-31
SHENZHEN SENLONT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, in the field of photovoltaic solar energy, transparent glass is mostly used as a protective device for solar panels, and the current is exported through wires. However, this method results in dense and numerous lines and an unsophisticated appearance. How to solve the above problems has become a challenge for technicians. new challenges ahead

Method used

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  • Conductive paste for thick film circuit, thick film circuit board employing same and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The formula of the conductor paste: copper powder A45g, copper powder B27g, lead-free cadmium-free glass powder 8.4g, organic binder composed of ethyl cellulose and terpineol 4g, terpineol 10g, phthalate di Butyl ester 1.6g, KH-5502g, Bi 2 o 3 3g

[0036] Formulation of encapsulation slurry: Cr 2 o 3 Pigment 6g, glass-ceramic powder 75g, organic binder composed of ethyl cellulose and diethylene glycol butyl ether 5g, terpineol 13g, Airex9800.5g, Dispers7100.5g

[0037] Manufacturing of thick film circuit boards:

[0038] a. Preparation of conductive paste: Mix the components in the formula except terpineol and dibutyl phthalate into a three-roll rolling mill, and add terpineol dibutyl phthalate while rolling the paste Ester, adjust the viscosity, grind for 40 minutes, disperse into a uniformly dispersed slurry with a certain fineness, the viscosity of the slurry is 30pa s / 25°C, the fineness is 20μm, and the copper content is 72%, and it is bottled for later use;

...

Embodiment 2

[0046]The formula of the conductor paste: copper powder A45g, copper powder B30g, lead-free cadmium-free glass powder 8.8g, organic binder composed of ethyl cellulose and terpineol 4.3g, terpineol 2g, diethylene glycol Butyl ether 4g, dibutyl phthalate 1.6, lecithin 1g, Bi 2 o 3 3.3g

[0047] Formulation of encapsulation slurry: Cr 2 o 3 Pigment 6g, glass-ceramic powder 78g, organic binder 5.2g, terpineol 4.8g, diethylene glycol butyl ether 5g, Airex9800.5g, Dispers7100. 5g

[0048] Manufacturing of thick film circuit boards:

[0049] a. Preparation of conductive paste: Copper powder A, copper powder B, lead-free and cadmium-free glass powder, organic binder, lecithin and Bi in the formula 2 o 3 Mix and add to a three-roll mill, add terpineol, diethylene glycol butyl ether and dibutyl phthalate while rolling the slurry to adjust the viscosity, grind for 40 minutes, and disperse into a uniform dispersion with a certain fineness Slurry, the viscosity of the slurry is 32p...

Embodiment 3

[0057] The formula of the conductor paste: copper powder A45g, copper powder B32g, lead-free cadmium-free glass powder 9g, organic binder composed of ethyl cellulose and terpineol 4.5g, diethylene glycol butyl ether 4g, ortho-benzene Dibutyl Diformate 1.5g, Span 80 1g, Bi 2 o 3 3g

[0058] Formulation of encapsulation slurry: Cr 2 o 3 Pigment 6g, glass-ceramic powder 80g, organic binder composed of ethyl cellulose and diethylene glycol butyl ether 5.4g, diethylene glycol butyl ether 7.6g, Airex9800.5g, Dispers7100.5g

[0059] Manufacturing of thick film circuit boards:

[0060] a. Preparation of conductive paste: Mix the components in the formula except diethylene glycol butyl ether and dibutyl phthalate into a three-roll rolling mill, and add diethylene glycol butyrate while rolling the paste Ether and dibutyl phthalate, adjust the viscosity, grind for 40 minutes, and disperse into a uniformly dispersed slurry with a certain fineness. The viscosity of the slurry is 35pa...

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Abstract

A conductive paste for a thick film circuit, a thick film circuit board employing the same and a manufacturing method thereof relate to the field of thick film circuits. One of the purposes of the invention is to provide a conductive paste for a thick film circuit, which can replace a silver paste and low cost and high security. The conductive paste comprises the following components by mass percent: 72-77 percent of copper powder, 8-10 percent of inorganic adhesive, 4-6 percent of organic adhesive, 5-12 percent of organic solvent and 1-5 percent of additive. Another purpose of the invention is to provide a thick film circuit board employing the paste and adopting toughened glass as a baseplate. The third purpose of the invention is to provide a manufacturing method of the thick film circuit board. The manufacturing method comprises the steps of preparation of the conductive paste, a encapsulating paste and the baseplate, as well as the printing, encapsulating, sintering, performance test and packaging of a circuit diagram. The thick film circuit board has favorable sintering characteristic and aesthetic appearance, and can be widely used in the manufacturing field of electronic components.

Description

technical field [0001] The invention relates to the field of thick film circuits, in particular to a conductor paste for thick film circuits, a thick film circuit board using the paste and a manufacturing method thereof. Background technique [0002] Thick film circuit is a kind of integrated circuit, which refers to a circuit unit with certain functions made on a substrate by printing, firing and welding processes such as resistors, inductors, capacitors, semiconductor components and interconnection wires. [0003] In thick film circuits, conductive paste is required for the conductive connection between functional components. Most of the existing conductive pastes are silver pastes. Excellent, but due to the limited amount of silver reserves in the world, coupled with the over-exploitation in recent years, the price of precious metal silver has soared, and the cost of producing products for enterprises remains high. Moreover, under the action of DC bias, silver is prone t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/22H01Q13/00H01L27/01H01L21/70
Inventor 叶志龙张炳胡教军
Owner SHENZHEN SENLONT ELECTRONICS
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