Conductive paste for thick film circuit, thick film circuit board employing same and manufacturing method thereof
A conductor paste, thick film circuit technology, applied in semiconductor/solid-state device manufacturing, circuits, electric solid-state devices, etc. Good chemical properties, excellent square resistance effect
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Embodiment 1
[0035] The formula of the conductor paste: copper powder A45g, copper powder B27g, lead-free cadmium-free glass powder 8.4g, organic binder composed of ethyl cellulose and terpineol 4g, terpineol 10g, phthalate di Butyl ester 1.6g, KH-5502g, Bi 2 o 3 3g
[0036] Formulation of encapsulation slurry: Cr 2 o 3 Pigment 6g, glass-ceramic powder 75g, organic binder composed of ethyl cellulose and diethylene glycol butyl ether 5g, terpineol 13g, Airex9800.5g, Dispers7100.5g
[0037] Manufacturing of thick film circuit boards:
[0038] a. Preparation of conductive paste: Mix the components in the formula except terpineol and dibutyl phthalate into a three-roll rolling mill, and add terpineol dibutyl phthalate while rolling the paste Ester, adjust the viscosity, grind for 40 minutes, disperse into a uniformly dispersed slurry with a certain fineness, the viscosity of the slurry is 30pa s / 25°C, the fineness is 20μm, and the copper content is 72%, and it is bottled for later use;
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Embodiment 2
[0046]The formula of the conductor paste: copper powder A45g, copper powder B30g, lead-free cadmium-free glass powder 8.8g, organic binder composed of ethyl cellulose and terpineol 4.3g, terpineol 2g, diethylene glycol Butyl ether 4g, dibutyl phthalate 1.6, lecithin 1g, Bi 2 o 3 3.3g
[0047] Formulation of encapsulation slurry: Cr 2 o 3 Pigment 6g, glass-ceramic powder 78g, organic binder 5.2g, terpineol 4.8g, diethylene glycol butyl ether 5g, Airex9800.5g, Dispers7100. 5g
[0048] Manufacturing of thick film circuit boards:
[0049] a. Preparation of conductive paste: Copper powder A, copper powder B, lead-free and cadmium-free glass powder, organic binder, lecithin and Bi in the formula 2 o 3 Mix and add to a three-roll mill, add terpineol, diethylene glycol butyl ether and dibutyl phthalate while rolling the slurry to adjust the viscosity, grind for 40 minutes, and disperse into a uniform dispersion with a certain fineness Slurry, the viscosity of the slurry is 32p...
Embodiment 3
[0057] The formula of the conductor paste: copper powder A45g, copper powder B32g, lead-free cadmium-free glass powder 9g, organic binder composed of ethyl cellulose and terpineol 4.5g, diethylene glycol butyl ether 4g, ortho-benzene Dibutyl Diformate 1.5g, Span 80 1g, Bi 2 o 3 3g
[0058] Formulation of encapsulation slurry: Cr 2 o 3 Pigment 6g, glass-ceramic powder 80g, organic binder composed of ethyl cellulose and diethylene glycol butyl ether 5.4g, diethylene glycol butyl ether 7.6g, Airex9800.5g, Dispers7100.5g
[0059] Manufacturing of thick film circuit boards:
[0060] a. Preparation of conductive paste: Mix the components in the formula except diethylene glycol butyl ether and dibutyl phthalate into a three-roll rolling mill, and add diethylene glycol butyrate while rolling the paste Ether and dibutyl phthalate, adjust the viscosity, grind for 40 minutes, and disperse into a uniformly dispersed slurry with a certain fineness. The viscosity of the slurry is 35pa...
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