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Anti-etching compound and base material coated with same

A composition and anti-etching technology, applied in photosensitive materials for opto-mechanical equipment, photo-engraving process of pattern surface, instruments, etc., can solve the problem that potassium permanganate cannot meet the needs, the anti-etching composition cannot resist etc. problem, to achieve the effect of excellent anti-oxidation and excellent linearity

Inactive Publication Date: 2012-12-12
深圳市容大感光科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One of the LED boards containing chromium plating requires the use of strong oxidant potassium permanganate as the etching solution in the etching process, and the traditional anti-etching composition cannot meet the needs because it cannot withstand the oxidation of potassium permanganate

Method used

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  • Anti-etching compound and base material coated with same
  • Anti-etching compound and base material coated with same
  • Anti-etching compound and base material coated with same

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0095]Add 200g of novolac epoxy resin CNE-202 (Taiwan Changchun Life Resin Factory, epoxy equivalent 210), 250g of propylene glycol methyl ether acetate (PMA) and 69g of acrylic acid into a 1L reactor, heat and melt, and then add p-benzene 0.5g of diphenol and 1.5g of triphenylphosphine were reacted at 108°C for 12 hours to obtain a product with an acid value (determined according to the measurement standard for the acid value of unsaturated polyester resin in GB2895-1982, the same below) as 3, and then four 85g of hydrophthalic anhydride, heated to 100°C, reacted for 6 hours, the acid value was measured as 52 by sampling, and the hydroxyl content was calculated to be 0.392mol by acid value, adding triphenylmethyl ether and 0.5 g of 4-dimethylaminopyridine (DMAP) catalyst, reacted for 4 hours to obtain resin solution A1.

Synthetic example 2

[0097] Add 200g of novolac epoxy resin CNE-202 (Taiwan Changchun Life Resin Factory, epoxy equivalent 210), 250g of PMA and 69g of acrylic acid into a 1L reactor, heat and melt, then add 0.5g of hydroquinone and triphenylphosphine 1.5g, reacted at 108°C for 12 hours to obtain a product with an acid value of 3, then added 80g of tetrahydrophthalic anhydride, heated to 100°C, and reacted for 6 hours. The acid value was measured as 49 by sampling and calculated by acid value To obtain a hydroxyl content of 0.425 mol, add triphenylmethyl ether and 0.5 g of DMAP catalyst in an equimolar amount to the hydroxyl group, and react for 4 hours to obtain resin solution A2.

Synthetic example 3

[0099] Add 200g of linear o-cresol formaldehyde resin (Dainippon Ink Co., Ltd. epoxy resin N-680), 200g of ethylene glycol butyl ether acetate, 72g of acrylate and 0.5g of catechol into a 1L reactor, and heat up to React at 120°C for 24 hours until the acid value is 1, add 60g of tetrahydrophthalic anhydride, react at 105°C for 6 hours, the acid value is 36 by sampling, and the hydroxyl content is 0.557mol based on the acid value calculation. The molar amount of methoxychloromethane and 0.5 g of triethylamine catalyst were reacted for 4 hours to obtain resin solution A3.

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Abstract

The invention provides a strong oxidization resisting anti-etching compound, which comprises the following components in percentage by weight: 15-80% of photosensitive resin, 0.5-15% of photoinitiator, 5-60% of diluent, 0-40% of filler, 0-20% of dyestuff or pigment and 0-20% of additive, the total percentage of all components is 100%, wherein the photosensitive resin meets two conditions at the same time: 1) a molecule comprises at least one carboxyl and at least two ethylene type unsaturated bonds, and does not comprise hydroxy, and 2) a carbon atom which is connected with a benzene ring does not have a hydrogen atom. The anti-etching compound disclosed by the invention has a strong oxidation resistance, and is particularly suitable for etching protection under the condition of an etching liquid containing a strong oxidant (such as potassium permanganate). The invention also provides a base material coated with the anti-etching compound.

Description

technical field [0001] The invention relates to an anti-etching composition resistant to strong oxidation and a substrate coated with the composition as an anti-etching layer. Background technique [0002] In recent years, LEDs (Light Emitting Diodes, light-emitting diodes) have been used more and more widely, and the amount of anti-etching materials that play a protective role in the etching process of LED liquid crystal displays is also increasing. One of the LED boards containing chromium plating requires the use of strong oxidizing agent potassium permanganate as the etching solution in the etching process, and the traditional anti-etching composition cannot meet the requirements because it cannot withstand the oxidation of potassium permanganate. Contents of the invention [0003] In order to solve the above problems, the present invention provides an anti-etching composition, which contains [0004] Photosensitive resin, 15-80%, [0005] Photoinitiator, 0.5-15%, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/027C08G59/17C08G59/14C08G8/28C08G8/30C08F212/12C08F220/06C08F220/32C08F220/18G03F7/09
Inventor 李长春杨遇春张华蔡宣海
Owner 深圳市容大感光科技股份有限公司
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