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A method for forming a pressure-sensitive adhesive printed circuit

A technology of printed circuit and forming method, which is applied in the field of conductive powder forming circuit, can solve the problems of low-cost large-scale application and high cost, and achieve the effects of excellent folding resistance, recycling and low cost

Inactive Publication Date: 2016-02-03
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the large amount of precious metals used in this method, the cost of the product is relatively high, which does not meet the requirements of low-cost large-scale applications.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 1) Use screen printing to print the target circuit of pressure-sensitive adhesive composed of solvent-based pressure-sensitive adhesive on the coated paper substrate;

[0028] 2) Put the coated paper substrate in an oven at 80°C for 10 minutes and take it out after the target line of pressure-sensitive adhesive is completely dry;

[0029] 3) After the pressure-sensitive adhesive target circuit is dried, sprinkle the conductive powder on the pressure-sensitive adhesive target circuit, so that the pressure-sensitive adhesive target circuit is fully covered by the conductive powder, and a conductive powder layer is formed on the pressure-sensitive adhesive target circuit; conductive powder The body is silver flake powder with a diameter of 30-50μm;

[0030] 4) Use a suction fan to suck the excess silver flake powder away from the printing substrate and recover it;

[0031] 5) Put the printing substrate on the press for pressure, and compact the conductive powder layer (silver flak...

Embodiment 2

[0034] 1) Print the target circuit pattern on the PET film substrate, the printing method is letterpress printing, and the printing material is ultraviolet curing pressure sensitive adhesive;

[0035] 2) Irradiate the reverse side of the printing substrate with a UV lamp until the pressure-sensitive adhesive is completely cured;

[0036] 3) Sprinkle an excessive amount of copper flakes and silver nanowires mixed powder on the printed pattern, with a mass ratio of 3:1, so that the powder can fully cover the printed pattern; the diameter of the copper flakes is 50-100μm, and the diameter of the silver nanowires is 100-200nm, length is 20-30μm.

[0037] 4) Use a suction fan to suck the excess mixed powder away from the substrate and recycle it. Only the mixed powder on the printed target circuit pattern will be stuck.

[0038] 5) Put the substrate into the press for pressure, the pressure is 20MPa, and compact the powder.

[0039] 6) Spray a UV-curable acrylate coating on the powder layer...

Embodiment 3

[0041] 1) Print the target circuit pattern on the glass fiber reinforced epoxy resin board, the printing method is pad printing, and the printing material is water-based pressure-sensitive adhesive.

[0042] 2) Place the substrate at room temperature for 30 minutes to completely dry the water-based pressure-sensitive adhesive.

[0043] 3) Sprinkle an excessive amount of graphene and carbon nanotube mixed powder on the printed pattern with a mass ratio of 1:1, so that the powder can fully cover the printed pattern; the average diameter of graphene is 10μm and the diameter of carbon nanotube is 40 -50nm, the length is 15-20μm.

[0044] 4) Use a suction fan to suck the excess powder away from the substrate and recycle it. Only the powder at the printed pattern is stuck and remains on the substrate.

[0045] 5) Put the matrix into the press to pressurize the powder at a pressure of 50MPa.

[0046] 6) Brush the silicone coating on the wire, and after the coating is completely dry, a pressur...

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Abstract

The invention relates to a pressure-sensitive adhesive printed circuit forming method which includes steps of printing a pressure-sensitive adhesive target circuit consisting of pressure-sensitive adhesive on a printed substrate; placing the printed substrate with the pressure-sensitive adhesive target circuit into an oven or at the normal temperature until the pressure-sensitive adhesive target circuit is dried completely; spreading conductive powder onto the pressure-sensitive adhesive target circuit to cover the same completely so as to form a conductive powder layer on the pressure-sensitive adhesive target circuit after the pressure-sensitive adhesive circuit is dried; removing residual conductive powder on the printed substrate by blowing or sucking and recovering the residual conductive powder; pressurizing the printed substrate on a press machine to compact the conductive powder on the pressure-sensitive adhesive target circuit; and coating a protective layer on the conductive powder layer to obtain a pressure-sensitive adhesive circuit. The pressure-sensitive adhesive printed circuit forming method has the advantages that production process is clean and environment-friendly, environment-friendly base materials can be adopted, production efficiency is high, cost is low and the like.

Description

Technical field: [0001] The invention relates to a method for forming a circuit, in particular to a method for forming a circuit by using conductive powder after printing a pattern through a pressure-sensitive adhesive. technical background: [0002] As an important part of electronic products, circuit boards are in increasing demand in modern life. The circuit board is made into a rigid board or a flexible flexible board according to the different requirements of the application environment. The currently widely used production processes are etching and silver paste printing. The etching method is a "subtraction" operation on the metal-clad plate, that is, the unnecessary part outside the target circuit is corroded by an etching solution to form a conductive circuit. The "subtraction" operation will cause metal waste and form metal ion pollution. The etching method also has the disadvantage of certain restrictions on the selection of substrate materials. The silver paste pri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/10
Inventor 付绍云黄贵文
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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