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Green and environment-friendly epoxy resin composition for high-power device packaging

An epoxy resin, green and environmental protection technology, applied in electrical components, circuits, electric solid devices, etc., can solve the problems of insufficient melt viscosity of epoxy resin compositions, lack of toughening effect, poor bonding force, etc. The effect of good formability and workability, good workability, low melt viscosity

Inactive Publication Date: 2013-01-02
JIANGSU ZHONGPENG NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional silane coupling agent used in this method has a small molecular weight, poor binding force with the inorganic filler, and cannot achieve a certain toughening effect, so that the melt viscosity of the epoxy resin composition is not small enough, so Need to further improve the technology

Method used

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  • Green and environment-friendly epoxy resin composition for high-power device packaging

Examples

Experimental program
Comparison scheme
Effect test

experiment example 1

[0053] Experimental example 1. 70 grams of epoxy resin (a+b) described in embodiment 1; 52 grams of phenolic resin (c+d); 100 grams of high thermal conductivity filler silicon carbide; inorganic filler: 580 grams of e part, 90 grams of f part; Accelerator 1.5 grams; flame retardant 6 grams; coupling agent KH-560 4.5 grams; colorant carbon black 3 grams; release agent carnauba wax 3 grams; silicone 3 grams. After the components of the raw materials in the above formula are accurately weighed, the silicon micropowder is treated with a coupling agent in the mixer for 5 minutes, then other components are added, and melted and kneaded on a two-roll kneader at a temperature of 90 o C. The mixing time is 10 minutes. Press the mixed material into a 1.5mm thick sheet. After mixing evenly, cool and pulverize it, press it into a cake, and conduct a performance test.

experiment example 2

[0054] Experimental example 2. 70 grams of epoxy resin (a+b) described in embodiment 2; 52 grams of phenolic resin (c+d); Inorganic filler: 580 grams of e part, 90 grams of f part; 100 grams of silicon carbide; 1.5 grams of accelerator; 6 grams of flame retardant; 4.5 grams of coupling agent KH-560; 3 grams of colorant carbon black; 3 grams of release agent carnauba wax; 6 grams of silicone. After the components of the raw materials in the above formula are accurately weighed, the silicon micropowder is treated with a coupling agent in the mixer for 5 minutes, then other components are added, and melted and kneaded on a two-roll kneader at a temperature of 90 o C. The mixing time is 10 minutes. Press the mixed material into a 1.5mm thick sheet. After mixing evenly, cool and pulverize it, press it into a cake, and conduct a performance test.

experiment example 3

[0055] Experimental example 3. 73 grams of epoxy resin (a+b) described in embodiment 3; 55 grams of phenolic resin (c+d); Inorganic filler: 590 grams of e part, 100 grams of f part; 100 grams of silicon carbide; 1.5 grams of accelerator; 6 grams of flame retardant; 4.5 grams of coupling agent KH-560; 3 grams of colorant carbon black; 3 grams of release agent carnauba wax; 6 grams of silicone. After the components of the raw materials in the above formula are accurately weighed, the silicon micropowder is treated with a coupling agent in a mixing machine for 5 minutes, and then other components are added, and melted and mixed on a double-roller mixer. The mixing temperature is 90 o C. The mixing time is 10 minutes. Press the mixed material into a 1.5mm thick sheet. After mixing evenly, cool and pulverize it, press it into a cake, and conduct a performance test.

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Abstract

A green and environment-friendly epoxy resin composition for high-power device packaging comprises an epoxy resin, a phenolic resin, an inorganic filler, a high thermal conductivity filler, a curing accelerant, silicone, a release agent, a coloring agent and a fire retardant, wherein the fire retardant is formed by matching aluminum hydroxide and zinc borate. The epoxy resin and the curing agent phenolic resin use environment-friendly mixed components which are free of harmful substances, and the silicone containing epoxy groups is added, so that a molecular chain has certain flexibility and malleability due to high molecular weight of the silicone, and a certain toughening effect is achieved. The green and environment-friendly epoxy resin composition is low in melt viscosity, good in mobility and operability, applicable to the green high-power device packaging and capable of meeting high radiating performance requirements of semiconductors, achieving good formability and operability during packaging processes and meeting halogen-free and antimony-free requirements of green packaging.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition for environmental protection and high-power encapsulation. Background technique [0002] In February 2003, the WEEE and RoHS regulations issued by the European Union stipulated that six kinds of harmful materials will be used within a limited period of time in discarded electrical or electronic equipment. Japan implements stricter SONY standards. "Administrative Measures for Pollution Control of Electronic Information Products", the green environmental protection requirements of electronic products have become an irreversible trend. With the improvement of people's environmental protection awareness, electronic waste has also begun to attract attention. Epoxy molding compounds as electronic packaging materials Environmental protection has become an irreversible trend. Since the epoxy molding compound contains organic polymer compounds such as epoxy resin, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/06C08L83/06C08K13/06C08K9/06C08K3/36C08K3/22C08K3/38H01L23/29
Inventor 张德伟单玉来孙波周佃香王松松
Owner JIANGSU ZHONGPENG NEW MATERIAL
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