Surface mount adhesive for surface mount technology and preparation method of surface mount adhesive

A surface mount technology and patch adhesive technology, applied in the direction of adhesives, epoxy resin glue, film/sheet adhesive, etc., to achieve the effect of low curing temperature, good bonding effect, and short curing time

Inactive Publication Date: 2013-01-02
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the SMT patch adhesives on the market are monopolized by some large foreign companies (such as FUJI, Heraeus, loctite, etc.), and some domestic brands have problems of one kind or another, which cannot fully meet the needs of current surface mount technology.

Method used

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  • Surface mount adhesive for surface mount technology and preparation method of surface mount adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Weigh raw materials according to the following parts by mass

[0026] Epoxy resin: EP-828EL 40 parts

[0027] Reactive diluent: glycidyl ether of tertiary carbonic acid 9.5 parts

[0028] Stabilizer: 0.1 parts of salicylic acid

[0029] Curing agent: FXR-1020 10 parts

[0030] Curing accelerator PN-23 5 parts

[0031] Thixotropic agent R202 5 parts

[0032] Filler: microsilica powder 20 parts

[0033] Talc powder 10 parts

[0034] Pigment: 0.4 parts of permanent red

[0035] First add epoxy resin, reactive diluent, stabilizer and pigment into the double planetary stirring tank, stir for 20 minutes under vacuum, then add thixotropic agent and filler, mix well and stir at high speed under vacuum for 2 hours, and finally Add curing agent and curing accelerator and stir evenly, then vacuumize and stir at low speed for 2-3 hours before discharging.

[0036]

Embodiment 2

[0038] Weigh raw materials according to the following parts by mass

[0039] Epoxy resin: DER331 60 parts

[0040] Reactive diluent: tertiary carbonic acid glycidyl ether 2 parts

[0041] Stabilizer: 1 part of benzoic acid

[0042] Curing agent: EH-4360S 15 parts

[0043] Curing accelerator: MC120D 1 part

[0044] Thixotropic agent: TS720 10 parts

[0045] Filler: microsilica powder 10 parts

[0046] Pigment: 1 part of permanent red

[0047] First add epoxy resin, reactive diluent, stabilizer, and pigment into the double planetary stirring tank, stir for 25 minutes under vacuum, then add thixotropic agent and filler, mix well, stir at high speed under vacuum for 2.5 hours, and finally Add curing agent and curing accelerator in turn and stir evenly, then vacuumize and stir at low speed for 3 hours, then discharge.

[0048]

Embodiment 3

[0050] Weigh raw materials according to the following parts by mass

[0051] Epoxy resin: E51 43.4 parts

[0052] Reactive diluent: 3 parts of tert-butylphenyl glycidyl ether

[0053] Stabilizer: 0.5 parts of lactic acid

[0054] Curing agent: EH-5031S 30 parts

[0055] Curing accelerator: PN-40 2 parts

[0056] Thixotropic agent: R202 6 parts

[0057] Filler: calcium carbonate 15 parts

[0058] Pigment: permanent yellow 0.1 parts

[0059] First add epoxy resin, active diluent, stabilizer, and pigment into the double planetary stirring tank, stir for 30 minutes under vacuum, then add thixotropic agent and filler, mix well, stir at high speed under vacuum for 3 hours, and finally Add curing agent and curing accelerator and stir evenly, then vacuumize and stir at low speed for 2.5 hours before discharging.

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PUM

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Abstract

The invention relates to surface mount adhesive for the surface mount technology and a preparation method of the surface mount adhesive. The surface mount adhesive is prepared by utilizing low-viscosity liquid epoxy resin, latent curing agent, curing accelerator, thixotropic agent, inorganic filler and pigment as raw materials, adding the raw materials into a stirring container and stirring uniformly in vacuum, and is obtained after discharging. The obtained surface mount adhesive has excellent high-temperature-resistant performance, fast in curing, fine in storage stability, high in humidity and strength, fine in thixotropy and free of wiredrawing and collapse and can be widely applied to the SMT (surface mount technology).

Description

technical field [0001] The invention relates to a patch glue used in surface mount technology and a preparation method thereof, belonging to the field of electronic adhesives. Background technique [0002] Surface mount technology SMT (Surface Mounted Technology) is to place electronic parts on the surface of the printed circuit board, and then use solder to connect the pins of the electronic parts and the pads of the printed circuit board for metallization. It is the current electronic assembly industry. One of the most popular techniques and crafts in China. With the development trend of miniaturization, multi-function and high-performance of electronic appliances, higher requirements are put forward for the adhesive used in surface mount technology, and the adhesive is required to have good storage stability and good thixotropy , Easy printing and dispensing, no stringing, high wet strength, low curing temperature, short curing time, and has sufficient bonding strength, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J163/02C09J163/00C09J11/06
Inventor 白战争王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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