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Polyimide stripping liquid for chips and preparation method of polyimide stripping liquid

A technology of polyimide and stripping solution, which is applied in the field of polyimide stripping solution and preparation for chips, can solve the problems of slow removal speed, low chip yield, easy oxidation or damage of metal materials, etc., to prevent Oxidation damage, the effect of improving the good rate

Inactive Publication Date: 2013-02-27
DALIAN SANDA WEIXIN SEMICON MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this process has the following disadvantages: slow removal speed, low productivity; cannot be completely removed, often leaving residues on the chip surface; metal materials are easily oxidized or damaged, resulting in low chip yield or scrap

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] The components and their mass percentages are as follows: 5% methylpyrrolidone, 80% methyl sulfoxide, 5% ethylene glycol monomethyl ether, 0.1% tetramethylammonium hydroxide, 0.1% sodium hydroxide and 9.8% pure water.

[0015] The preparation method is carried out according to the following steps: start the reactor stirrer, the rotating speed is 500 rpm, and add the calculated amount of water, methylpyrrolidone, methyl sulfoxide, ethylene glycol monomethyl ether, tetramethyl Ammonium hydroxide and sodium hydroxide, after adding all the materials, continue to stir for one hour, and the solution in the reaction kettle is a uniform transparent liquid.

Embodiment 2

[0017] The components and their mass percentages are as follows: 60% ethylpyrrolidone, 5% ethyl sulfoxide, 20% propylene glycol monomethyl ether, 5% tetraethylammonium hydroxide, 5% sodium hydroxide and 5% pure water.

[0018] The preparation method is carried out according to the following steps: start the reactor stirrer, the rotating speed is 500 rpm, add the calculated amount of water, ethyl pyrrolidone, ethyl sulfoxide, propylene glycol monomethyl ether, tetraethyl hydroxide Ammonium and sodium hydroxide, after adding all the materials, continue to stir for one hour, and the solution in the reaction kettle is a uniform transparent liquid.

Embodiment 3

[0020] The components and their mass percentages are as follows: 20% hydroxyethylpyrrolidone, 40% dimethyl sulfoxide, 20% propylene glycol monobutyl ether, 1.5% tetrapropylammonium hydroxide, 0.5% potassium hydroxide, and 18% pure water.

[0021] The preparation method is carried out according to the following steps: start the reactor stirrer, the rotating speed is 500 rpm, and add the calculated amount of water, hydroxyethylpyrrolidone, dimethyl sulfoxide, propylene glycol monobutyl ether, tetrapropyl Ammonium hydroxide and potassium hydroxide, continue stirring for one hour after all the materials are added, and the solution in the reaction kettle is a uniform transparent liquid.

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PUM

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Abstract

The invention discloses polyimide stripping liquid for chips. The polyimide stripping liquid is characterized by comprising the following ingredients (mass percent): 5 to 60 percent of pyrrolidone, 5 to 80 percent of sulfoxide, 5 to 40 percent of alcohol ether, 0.1 to 20 percent of quaternary ammonium, 0.1 to 10 percent of alkali and the rest of water. Polyimide can be fast and thoroughly removed (without residues), metal materials can also be prevented from being damaged through oxidation, and the qualified rate of products is effectively improved.

Description

technical field [0001] The invention relates to a polyimide stripping liquid and a preparation method thereof, in particular to a polyimide stripping liquid for a chip that can quickly and thoroughly (without residue) remove polyimide and prevent metal materials from being damaged. Preparation. Background technique [0002] Polyimide has excellent high temperature and low temperature resistance, chemical corrosion resistance and excellent strength and toughness. It is a widely used functional polymer material and has been widely used in semiconductor integrated circuit chips, LED chips, etc. in the manufacturing industry. For example, it can be used as a dielectric layer for interlayer insulation; as a buffer layer to reduce stress and improve yield; as a protective layer, it can reduce the impact of the environment on the device, and can also shield a-particles, reducing or eliminating the soft error of the device ; Photosensitive polyimide can also be used for positive a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/42
Inventor 廖勇勤
Owner DALIAN SANDA WEIXIN SEMICON MATERIAL