The purpose of the present invention is to provide a photosensitive resin composition, a method for producing a cured film, and a method for producing a cured relief pattern, the photosensitive resin composition having excellent resolution even when a
polymer having high
absorbance such as a high
glass transition temperature (Tg) is imparted thereto, and having reduced
copper voids when in contact with
copper. [Solution] A photosensitive resin composition comprising: (A) a
polymer which is (A1) a soluble
polyimide or (A2) a
polyimide precursor; (B) a photopolymerization initiator; the
solvent is N-ethyl-2-pyrrolidone; (E) a photopolymerizable
unsaturated monomer; and (X) at least one substance selected from the group consisting of
toluene,
xylene,
tetrahydrofuran, gamma-butyrolactone, and gamma-
valerolactone, the content of the (X) being 1 ppm or more and 10000 ppm or less relative to the total
mass of the photosensitive resin composition.