Zero-halogen and flame-retardation epoxy resin composition, adhesive tape and preparation method of adhesive tape

Abstract

The invention discloses a zero-halogen and flame-retardation epoxy resin composition, an adhesive tape used for a flexible printed circuit board, and a preparation method of the adhesive tape. The zero-halogen and flame-retardation epoxy resin composition comprises 100 parts by weight of a zero-halogen epoxy resin, 30-100 parts by weight of a thermoplastic resin and / or synthetic rubber, 20-100 parts by weight of a composite curing agent, 0.01-1.0 part by weight of a curing promoter, 5-50 parts by weight of a phosphorus-containing flame retardant and 5-80 parts by weight of an inorganic filler. The adhesive tape used for the flexible printed circuit board comprises an insulation substrate layer, a primary coat and an adhesive layer. The preparation method of the adhesive tape used for the printed circuit board is characterized in that the primary coat composed of a polyurethane system resin compound is obtained on at least one dominant surface of the insulation substrate layer, and the primary coat substantially enhances the adhesion between the insulation substrate layer and the adhesive layer. The zero-halogen and flame-retardation epoxy resin composition contains no halogens, and satisfies an environment requirement; and the adhesive tape used for the flexible printed circuit board has a flame resistance reaching an UL94V-0 grade, and has the advantages of excellent peeling strength, excellent solder resistance, excellent dimension stability and excellent processability.

Description

technical field [0001] The invention relates to an adhesive tape, in particular to a halogen-free flame-retardant epoxy resin composition used for a flexible printed circuit board, an adhesive tape prepared by using the composition and a preparation method of the adhesive tape. Background technique [0002] Generally, adhesives used in electronic materials such as semiconductor seals and epoxy-based glass cloth copper-clad laminates contain bromine-containing epoxy resins or bromine-containing phenoxy resins in order to ensure their excellent flame retardancy. resin or similar. However, since compounds containing halogens such as bromine emit toxic gases such as dioxin-like compounds when burned, it is necessary to use halogen-free materials in adhesives. [0003] On the other hand, flexible copper-clad laminates, which are thinner than epoxy-based glass-cloth copper-clad laminates and take into account flexibility, are currently widely used, and their market size continues...

AI Technical Summary

Problems solved by technology

However, these treatment methods have the following disadvantages: (1) After corona discharge treatment, the cross-linked structure of the plastic surface layer is less than that of the inner layer, so the functional groups on the surface layer have higher mobility, resulting in During storage, many plastics have a decline in the effect of corona discharge treatment. Additives migrate from the inside to the surface, which is also a factor that reduces surface energy and affects adhesion. This negative effect cannot be completely suppressed; (2) corona discharge treatment will Ozone is produced, the environment is polluted, and pinholes are produced under high power, which affects the appearance of the tape; (3) Flame plasma treatment has disadvantages such as low speed limitation and reduced clarity of the treated insulating layer; (4) Low temperature plasma treatment has high speed limitation, and the treatment The cost is relatively high, and special plasma processing equipment needs to be purchased

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