Flexure testing method and flexure testing device for quantitatively characterizing interface binding property of thin-film material
A technology of interfacial bonding and thin-film materials, which is applied in measurement devices, analysis materials, and mechanical devices, etc., can solve the problems of application limitation of indentation method, increase the difficulty of experiments, and difficulty in sample preparation.
Active Publication Date: 2013-04-03
XIANGTAN UNIV
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Problems solved by technology
The indentation method is suitable for brittle film/rigid substrate, brittle film/brittle substrate material system, some theoretical mechanisms, the characterization of interface bonding strength and the influence of various factors on critical load, etc. If these problems cannot be solved well, indentation The application of trace method will be limited
Th...
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Embodiment 1
[0063] Consider a specific situation: the nickel film-low carbon steel system is selected as the coating-substrate, and the thickness of the nickel film is h=6×10 -5 m, the modulus of elasticity is E f =2.2×10 11 Pa, elastic modulus E of low carbon steel substrate s =2×10 11 Pa, Poisson's ratio υ f = υ s =0.3. critical buckling stress σ cr =4.46×10 8 Pa, the stress σ in the membrane when loaded 0 =6×10 8 Pa, for the nickel film-low carbon steel substrate system, α≈0, β≈0, from the data in the table, ω=52.1°, the deflection ω of the buckling center point of the sample coating max =6.7×10 -5 Substituting m into the above formula, the interface binding energy of the nickel film-low carbon steel substrate system is obtained G=37.1J / m 2 , the phase angle Ψ=-637°.
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Abstract
The invention relates to a flexure testing method and a flexure testing device for quantitatively characterizing the interface binding property of thin-film material and belongs to the technical field of property characterization of experimental mechanics and material mechanics. The method is characterized in that uniaxial compression is performed to a sample in the axial direction through a universal material testing machine, and the stress strain values of the sample are recorded; meanwhile, the cross section of the sample is observed synchronously in real time through a CCD camera during the loading process, and stripping characteristics such as critical stress, deflexion and crack length can be recorded in real time during the flexure process; and a relation between the coating and plating-substrate stress strain history and the stripping characteristics is established to characterizing the interface binding property of the coating and plating-substrate. According to the device, the CCD camera, a monitor, an image processing card, a computer, a data processing card, a load sensor and the universal material testing machine are connected in sequence. The invention has the advantages of simple principle, simplicity in sample preparation, clear model, easiness in operation, and the like.
Description
technical field [0001] The invention relates to a buckling test method and device for quantitatively characterizing the interfacial bonding properties of thin film materials, and belongs to the technical field of experimental mechanics and material mechanical performance characterization. Background technique [0002] With the rapid development of science and technology, thin film / substrate systems are widely used in surface modification and material science. During the use of thin film materials, due to the differences in microstructure and other aspects of substrate materials, the mechanical load, thermal Under various complex environments such as loading, there will be a mismatch of stress and strain, which will eventually lead to the failure of the thin film coating material. In engineering applications, the typical failure mode of the film / substrate system is: the film or coating peels off from the substrate. Whether the interfacial bonding of the film / substrate system...
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Inventor 周益春朱旺郭进伟杨丽蔡灿英
Owner XIANGTAN UNIV
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