Buckling test method and device for quantitatively characterizing interfacial bonding properties of thin film materials

Abstract

The invention relates to a flexure testing method and a flexure testing device for quantitatively characterizing the interface binding property of thin-film material and belongs to the technical field of property characterization of experimental mechanics and material mechanics. The method is characterized in that uniaxial compression is performed to a sample in the axial direction through a universal material testing machine, and the stress strain values of the sample are recorded; meanwhile, the cross section of the sample is observed synchronously in real time through a CCD camera during the loading process, and stripping characteristics such as critical stress, deflexion and crack length can be recorded in real time during the flexure process; and a relation between the coating and plating-substrate stress strain history and the stripping characteristics is established to characterizing the interface binding property of the coating and plating-substrate. According to the device, the CCD camera, a monitor, an image processing card, a computer, a data processing card, a load sensor and the universal material testing machine are connected in sequence. The invention has the advantages of simple principle, simplicity in sample preparation, clear model, easiness in operation, and the like.

Description

Technical field [0001] The invention relates to a buckling test method and device for quantitatively characterizing the interface bonding performance of thin film materials, and belongs to the technical field of experimental mechanics and material mechanical property characterization. Background technique [0002] With the rapid development of science and technology, the film / substrate system is widely used in surface modification and material science. In the process of use, film materials are different from the substrate materials in terms of microstructure and so on. Under various complex environments such as loads, there will be a mismatch of stress and strain, which will eventually lead to the failure of the film coating material. In engineering applications, the typical failure mode of the film / substrate system is: the film or coating peels off the substrate. Whether the film / substrate system interface is good or not determines the service life of this material to a large e...

AI Technical Summary

Problems solved by technology

The indentation method is suitable for brittle film / rigid substrate, brittle film / brittle substrate material system, some theoretical mechanisms, the characterization of interface bonding strength and the influence of various factors on critical load, etc. If these problems cannot be solved well, indentation The application of trace method will be limited

The exfoliation method is suitable for brittle and ductile films, although it is intuitive and easy to implement, it is difficult to extract the interfacial crack propagation energy

Although the bulging method can quantitatively measure the interfacial bonding properties of thin films, it is difficult to prepare samples, which increases the difficulty of experiments.

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