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Composition for anisotropic conductive adhesive film, anisotropic conductive adhesive film and semiconductor device

A conductive adhesion, anisotropic technology, applied in conductive adhesives, conductive materials dispersed in non-conductive inorganic materials, semiconductor devices, etc., can solve problems such as reduced dimensional stability and insufficient adhesion of glass substrates , to improve the filling rate, improve connection reliability and stability, and improve production efficiency.

Active Publication Date: 2013-05-08
KUKDO ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, these conventional adhesive compositions have a very high weight ratio of binder system to cured system and thus exhibit reduced dimensional stability and insufficient adhesion to glass substrates after curing

Method used

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  • Composition for anisotropic conductive adhesive film, anisotropic conductive adhesive film and semiconductor device
  • Composition for anisotropic conductive adhesive film, anisotropic conductive adhesive film and semiconductor device
  • Composition for anisotropic conductive adhesive film, anisotropic conductive adhesive film and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0138] Example 1: Preparation of anisotropic conductive adhesive film

[0139] (1) Preparation of anisotropic conductive adhesive composition

[0140] By mixing 30 wt% epoxy-functional acrylate copolymer (solids content: 18%), 5 wt% carboxyl-modified acrylonitrile butadiene rubber dissolved in toluene and methyl ethyl ketone (MEK) (solid content: 25%, weight average molecular weight: 240,000g / mol, Nipol NBR, Zeon Co., Ltd.), 15wt% styrene-acrylonitrile resin dissolved in MEK (solid content: 50%, Tg: 120°C , weight average molecular weight: 100,000g / mol), 20wt% isocyanurate ethylene oxide modified diacrylate (DSC exothermic peak: 92°C to 95°C), 20wt% bisphenol fluorene diacrylate (weight-average molecular weight: 1,400g / mol), 1.5wt% acidified phosphoethyl methacrylate, 2.5wt% phosphate acrylate (weight-average molecular weight: 12,000g / mol), 1.0wt% as Organic peroxide lauroyl peroxide (solid content: 10%) dissolved in toluene and 2.0 wt% benzoyl peroxide (solid content: 10%) ...

Embodiment 2

[0145] In the same manner as in Example 1, except that the contents of acrylate copolymer, oxirane-isocyanurate-modified diacrylate and bisphenol fluorene diacrylate were changed to 35wt%, 15wt% and 25wt% respectively An anisotropic conductive film according to Example 2 was prepared.

Embodiment 3

[0147] An anisotropic conductive film of Example 3 was prepared in the same manner as in Example 1, except that the following urethane acrylate resin was used instead of the carboxy-modified acrylonitrile butadiene rubber.

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Abstract

Disclosed is an anisotropic conductive adhesive film that comprises an acrylic acid ester copolymer as a polymer binder system, an acrylic ester with high reactivity and forming a solid structure after being cured as a curing system, a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40, so that occurrence of bubbles in about 5 seconds or less at about 160 to about 200 DEG C can be prevented, which can not be realized in an epoxy film. Beside, the adhesive film has high adhesive strength, connection reliability and dimensional stability. The invention also discloses a composition for the anisotropic conductive adhesive film and a semiconductor device comprising the anisotropic conductive adhesive film.

Description

technical field [0001] The present invention relates to a composition for an anisotropic conductive adhesive film and an anisotropic conductive adhesive film. More specifically, the present invention relates to anisotropic conductive adhesive films comprising epoxy functional groups as the polymer binder system and acrylates as the curing system which are highly reactive and form a strong structure after curing. Acrylate copolymer. The adhesive film has a solid content ratio between the polymer binder system and the curing system of 40:60 to 60:40, thereby preventing the generation of air bubbles during a connection time of 5 seconds or less at 160 to 200°C, which Not implemented in epoxy films. In addition, the film exhibits high bond strength, connection reliability and dimensional stability. Background technique [0002] With the recent trend toward large and thin displays, the spacing between electrodes and circuits has become precise. The anisotropic conductive adhe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J4/02C09J4/06C09J175/14C09J7/00H01L23/488
CPCH01L2224/29444C09J133/04H01L2224/29339H01B1/124H01L2224/2939H01L2224/2929H01L2224/29344H01B1/22H01L2224/29455H01L23/4828H01L2224/29347H01L24/29H01L2924/07811H01L2224/29355H01L2224/29439H01L2224/29393C09J9/02H01L2224/29298C08F230/02C08L25/12C08L55/02C09J133/068C08F222/1025H01L2924/15788H01L2924/0665H01L2924/00014H01L2924/00C09J2203/00C09J7/385C09J7/40C09J2301/304C09J2301/312C09J2301/314C09J2301/408H01L21/02002
Inventor 南宫贤熺韩在善金显昱徐辰瑛郑光珍鱼东善
Owner KUKDO ADVANCED MATERIALS CO LTD
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