Relay liquid state epoxy resin pouring sealant and preparation method thereof

A technology of liquid epoxy resin and epoxy resin, which is applied in the direction of epoxy resin glue, chemical instruments and methods, adhesives, etc., can solve the problems of deterioration of packaging product characteristics, high curing temperature, poor temperature resistance of relay plastic shells, etc., to achieve Wide range of effects

Inactive Publication Date: 2013-05-08
深圳市宝力科技有限公司
View PDF3 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] However, the inventor found in the process of implementing the present invention that the conventional liquid epoxy resin encapsulant for relays has a curing temperature greater than 12

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0085] Experimental example 1

[0086] In grams, weigh 20.5 parts of high-purity bisphenol A epoxy resin (828EL), 35.3 parts of electronic grade bisphenol F diglycidyl ether (830s), 0.5 parts of black paste, and 4.6 parts of dicyandiamide curing agent. 1.5 parts of curing accelerator, 2.0 parts of coupling agent (KH560), 92 parts of alumina spherical filler were prepared according to the above preparation method to obtain sample 1.

[0087] After testing, the curing temperature is 110℃ for 20 minutes, the shear strength is 13MPa, the coefficient of linear expansion (CTE) a1 is 20ppm, the Tg point is 137℃, the thermal conductivity is 1.0w / mk, and the storage period is more than 10h at 40℃. The storage period at 8°C is 10 months.

Example Embodiment

[0088] Experimental example 2

[0089] In grams, weigh 20 parts of high-purity bisphenol A epoxy resin (828EL), 40.0 parts of electronic grade bisphenol F diglycidyl ether (830s), 0.5 parts of black paste, and 5.4 parts of dicyandiamide curing agent. 0.5 parts of curing accelerator, 2.0 parts of coupling agent KH560, and 80 parts of alumina spherical filler were prepared according to the above preparation method to obtain sample 2.

[0090] After testing, the curing temperature of sample 2 is 110℃ for 20 minutes, and the shear strength is 10MPa; the storage period at 40℃ exceeds 10h, and the storage period at 2-8℃ is 10 months.

Example Embodiment

[0091] Experimental example 3

[0092] In grams, weigh 25 parts of high-purity bisphenol A epoxy resin (828EL), 35.0 parts of electronic grade bisphenol F diglycidyl ether (830s), 0.5 parts of black paste, and dicyandiamide curing agent: 5.4 parts , 0.5 parts of curing accelerator, 1.5 parts of KH560 coupling agent, 80 parts of alumina spherical filler, prepared according to the above preparation method, to obtain sample 3.

[0093] After testing, the curing temperature of sample 3 is 110°C for 20 minutes, and the shear strength is 11MPa; the storage period at 40°C exceeds 10 hours, and the storage period at 2-8°C is 10 months.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Curing temperatureaaaaaaaaaa
Shear strengthaaaaaaaaaa
Shear strengthaaaaaaaaaa
Login to view more

Abstract

The invention discloses a relay liquid state epoxy resin pouring sealant which comprises the following components: 15-25 parts of bisphenol A epoxy resin, 30-45 parts of bisphenol F epoxy resin, 0.5 part of pigment, 70-100 parts of spheroidal filler, 4-6 parts of curing agent, 0.5-2 parts of curing accelerator, and 1-3 parts of coupling reagent. The invention also discloses a preparation method of the relay liquid state epoxy resin pouring sealant. The relay liquid state epoxy resin pouring sealant has lower curing temperature, the curing temperature is around 110 DEG C, the curing speed is faster, the bonding strength is stronger, the percentage of concentration is lower, the ion content is lower, and the heat conducting property is good; the storage performance is more stable, and the storage life in a refrigerator at 2-8 DEG C is above six months; and the preparation technology is simple and environment-friendly, the cost is low and the application range is wide.

Description

technical field [0001] The invention relates to relay manufacturing calculations, in particular to a relay liquid epoxy resin potting glue and a preparation method thereof. Background technique [0002] Relay (Relay) is an electronic control device, which has a control system (also known as input circuit) and a controlled system (also known as output circuit), usually used in automatic control circuits, it actually uses a small current to An "automatic switch" that controls relatively large currents. Therefore, it plays the role of automatic adjustment, safety protection, and conversion circuit in the circuit. As one of the four major electronic components, it is widely used in remote control, telemetry, communication, automatic control, mechatronics and power electronic equipment. [0003] Relays are generally composed of iron core, coil, armature, contact reed and so on. As long as a certain voltage is applied to both ends of the coil, a certain current will flow throug...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C09J163/02C09J11/04C09J11/06C09J9/00C09K3/10
Inventor 左斌文
Owner 深圳市宝力科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap