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Relay liquid state epoxy resin pouring sealant and preparation method thereof

A technology of liquid epoxy resin and epoxy resin, which is applied in the direction of epoxy resin glue, chemical instruments and methods, adhesives, etc., can solve the problems of deterioration of packaging product characteristics, high curing temperature, poor temperature resistance of relay plastic shells, etc., to achieve Wide range of effects

Inactive Publication Date: 2013-05-08
深圳市宝力科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] However, the inventor found in the process of implementing the present invention that the conventional liquid epoxy resin encapsulant for relays has a curing temperature greater than 120°C, a higher curing temperature and a slower curing speed, while the low-cost relay plastic casing Poor temperature resistance, which tends to degrade the characteristics of packaged products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

experiment example 1

[0086] In grams, weigh 20.5 parts of high-purity bisphenol A type epoxy resin (828EL), 35.3 parts of electronic grade bisphenol F diglycidyl ether (830s), 0.5 parts of black paste, 4.6 parts of dicyandiamide curing agent, 1.5 parts of curing accelerator, 2.0 parts of coupling agent (KH560), and 92 parts of alumina spherical filler were prepared according to the above preparation method to obtain sample 1.

[0087] After testing, the curing temperature is 110°C for 20 minutes, the shear strength is 13MPa, the coefficient of linear expansion (CTE) a1 is 20ppm, the Tg point is 137°C, the thermal conductivity is 1.0w / m.k, the storage period at 40°C exceeds 10h, and its 2- The storage period at 8°C is 10 months.

experiment example 2

[0089] In grams, weigh 20 parts of high-purity bisphenol A epoxy resin (828EL), 40.0 parts of electronic grade bisphenol F diglycidyl ether (830s), 0.5 parts of black paste, 5.4 parts of dicyandiamide curing agent, 0.5 parts of curing accelerator, 2.0 parts of coupling agent KH560, and 80 parts of alumina spherical filler were prepared according to the above preparation method to obtain sample 2.

[0090] After testing, the curing temperature of sample 2 is 110°C for 20 minutes, and the shear strength is 10MPa; the storage period at 40°C is more than 10 hours, and its storage period at 2-8°C is 10 months.

experiment example 3

[0092] In grams, weigh 25 parts of high-purity bisphenol A epoxy resin (828EL), 35.0 parts of electronic grade bisphenol F diglycidyl ether (830s), 0.5 parts of black paste, and 5.4 parts of dicyandiamide curing agent , 0.5 parts of curing accelerator, 1.5 parts of KH560 coupling agent, and 80 parts of alumina spherical filler were prepared according to the above-mentioned preparation method to obtain sample 3.

[0093] After testing, the curing temperature of sample 3 is 110°C for 20 minutes, and the shear strength is 11MPa; the storage period at 40°C is more than 10 hours, and its storage period at 2-8°C is 10 months.

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Abstract

The invention discloses a relay liquid state epoxy resin pouring sealant which comprises the following components: 15-25 parts of bisphenol A epoxy resin, 30-45 parts of bisphenol F epoxy resin, 0.5 part of pigment, 70-100 parts of spheroidal filler, 4-6 parts of curing agent, 0.5-2 parts of curing accelerator, and 1-3 parts of coupling reagent. The invention also discloses a preparation method of the relay liquid state epoxy resin pouring sealant. The relay liquid state epoxy resin pouring sealant has lower curing temperature, the curing temperature is around 110 DEG C, the curing speed is faster, the bonding strength is stronger, the percentage of concentration is lower, the ion content is lower, and the heat conducting property is good; the storage performance is more stable, and the storage life in a refrigerator at 2-8 DEG C is above six months; and the preparation technology is simple and environment-friendly, the cost is low and the application range is wide.

Description

technical field [0001] The invention relates to relay manufacturing calculations, in particular to a relay liquid epoxy resin potting glue and a preparation method thereof. Background technique [0002] Relay (Relay) is an electronic control device, which has a control system (also known as input circuit) and a controlled system (also known as output circuit), usually used in automatic control circuits, it actually uses a small current to An "automatic switch" that controls relatively large currents. Therefore, it plays the role of automatic adjustment, safety protection, and conversion circuit in the circuit. As one of the four major electronic components, it is widely used in remote control, telemetry, communication, automatic control, mechatronics and power electronic equipment. [0003] Relays are generally composed of iron core, coil, armature, contact reed and so on. As long as a certain voltage is applied to both ends of the coil, a certain current will flow throug...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J11/04C09J11/06C09J9/00C09K3/10
Inventor 左斌文
Owner 深圳市宝力科技有限公司
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