Paste solder for hard soldering of SiCp/Al composite material and preparation method and use method thereof

A technology of paste solder and composite materials, which is applied in the direction of welding/cutting media/materials, welding equipment, welding media, etc., and can solve the problem of welding irregular, small or complex geometric parts, strips, etc. Shaped or foil-shaped solder is unfavorable to the automation of the brazing process, and it is beneficial to automation, saving solder, and increasing the specific surface area.

Inactive Publication Date: 2013-05-15
HENAN POLYTECHNIC UNIV +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the existing strip-shaped or foil-shaped solder is not conducive to the automation of the brazing process, and is not suitable for welding irregular, small or geometrically complex parts, and provides a method for Paste solder for SiCp / Al composite material brazing and preparation method thereof

Method used

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  • Paste solder for hard soldering of SiCp/Al composite material and preparation method and use method thereof

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specific Embodiment approach 1

[0019] Specific embodiment 1: This embodiment is a paste solder used for brazing of SiCp / Al composite materials, which consists of 30% to 35% alloy solder powder, 35% to 40% flux and 25% to 35% binder is mixed.

[0020] The alloy solder powder described in this embodiment consists of 21% to 25% of Cu, 4% to 6% of Si, 1% to 2% of Mg, 0.3% to 0.7% of Ni and 66% to 74% by mass percentage. % Al prepared.

[0021] The flux described in this embodiment is based on KF-AlF 3 Eutectic aluminum flux is added K 2 SiF 6 Mixed as a surfactant, wherein the KF-AlF 3 Eutectic aluminum flux with K 2 SiF 6 The mass ratio is 1:(0.074~0.131).

[0022] The binder described in this embodiment is prepared by mixing 85% to 90% of white oil, 6% to 10% of rosin resin, 2% to 5% of glycerin and 0.5% to 1.5% of hydrogenated castor oil according to the mass percentage. become.

[0023] The brazing alloy powder in this embodiment has a particle size of 5 μm to 25 μm.

[0024] The viscosity of the ...

specific Embodiment approach 2

[0030] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the white oil has a flash point of 180° C. to 190° C. and a viscosity of 3.5 cp to 5 cp. Others are the same as the first embodiment.

specific Embodiment approach 3

[0031] Specific embodiment three: the present embodiment is a kind of preparation method for the paste solder of SiCp / Al composite material brazing, specifically is finished according to the following steps:

[0032] 1. Preparation of alloy solder powder: ① Preparation of materials: Firstly, cut or crush the raw materials containing Cu, Si, Mg, Ni and Al to a particle size of 5mm-20mm, and then put them into alcohol for ultrasonication Clean for 15min to 25min, then prepare materials according to the mass percentage of 21% to 25% Cu, 4% to 6% Si, 1% to 2% Mg, 0.3% to 0.7% Ni and 66% to 74% Al ; ②Nitrogen atomization: put the materials prepared in step ① into an intermediate frequency induction furnace for smelting, -3 Pa~1.5×10 -3 Pa and heating rate of 40°C / min~60°C / min are melted into molten metal, and then the molten metal is passed through the annular nozzle. mm, and the annular seam gap of the annular seam nozzle is 0.5mm to carry out nitrogen atomization to obtain sphe...

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Abstract

The invention relates to a paste solder for the hard soldering of a SiCp/Al composite material and a preparation method and use method thereof, and relates to a solder for the hard soldering of the SiCp/Al composite material and a preparation method and use method thereof. The paste solder for the hard soldering of the SiCp/Al composite material aims at the problem that the traditional strip-shaped solder or foil-shaped solder is adverse to the automation in a hard soldering process and is not suitable to weld an irregular, small-sized or geometrical complicated part. The paste solder for the hard soldering of the SiCp/Al composite material is prepared by mixing solder alloy powder, a soldering flux and an adhesive. The preparation method comprises the following steps of: 1, preparing the solder alloy powder; 2, preparing the soldering flux; 3, preparing the adhesive; and 4, mixing to prepare the hard soldering of the paste solder for the SiCp/Al composite material. The use method comprises the following steps of: adopting coating type cloth or needle tube type cloth; and then carrying out vacuum heating treatment so as to complete welding. The preparation method disclosed by the invention is mainly used for preparing the paste solder for the hard soldering of the SiCp/Al composite material.

Description

technical field [0001] The invention relates to a brazing filler metal for SiCp / Al composite material brazing, a preparation method and a use method thereof. Background technique [0002] SiCp / Al composite material has the advantages of high specific strength, high specific modulus, high temperature resistance, corrosion resistance, wear resistance, good electrical and thermal conductivity, and small linear expansion coefficient. It has broad application prospects in fields such as chemical industry and chemical industry, but its poor weldability has become a "bottleneck" technical problem for popularization and application. Brazing is one of the ideal effective connection methods. However, the brazing filler metals currently used for brazing SiC particle-reinforced aluminum matrix composites are mostly in the form of strips and foils, which are not conducive to the automation of the brazing process, especially not suitable for irregular and small Or use on parts with comp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/28B23K35/363B23K1/008B23K1/19B23K1/20
Inventor 牛济泰王鹏杨顺成徐冬霞李强
Owner HENAN POLYTECHNIC UNIV
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