Diamond fret saw and production technology thereof

Abstract

The invention relates to a diamond fret saw, which comprises a fret saw inner core, wherein the fret saw inner core is formed by mutually twisting more than two strands of metal wires; a metal layer is plated on the surface of the fret saw inner core; the surface of the metal layer is fixedly provided with abrasive grains; and the abrasive grains are diamond particles, other wear-resistant material particles, or mixture of diamond particles and other wear-resistant material particles. The continuous production technology of the diamond fret saw provided by the invention has the advantages of being reasonable in flow, high in yield and the like, and the diamond fret saw can be continuously produced.

Description

technical field [0001] The invention relates to a diamond wire saw and a production process thereof. Background technique [0002] Diamond wire saw, referred to as diamond wire, is a high-strength cutting wire with a layer of diamond abrasive particles consolidated on the surface. It is used for cutting hard and brittle materials such as single crystal / polycrystalline silicon, sapphire, gallium arsenide, magnetic materials, and crystal. Compared with the traditional free mortar cutting method, the diamond wire cutting technology is a revolutionary progress. The diamond wire cutting process has been widely used by more than 90% of users in Japan, and more than 20% of users in Europe and the United States. At present, the diamond wire in the domestic market is mainly monopolized by foreign companies. In the diamond wire market for solar silicon material cutting, Chinese manufacturing is still in a blank state. The domestic diamond wire for solar silicon material cutting is ba...

AI Technical Summary

Problems solved by technology

[0010] At present, the conventional diamond wire saw is a single-strand steel wire coated with diamond abrasive grains. Compared with the traditional mortar cutting, the diamond wire saw with this structure has made great progress. However, due to the small diameter of the abrasive grains, the corresponding chip space is also small. At the same time, the cutting wire has a poor liquid-carrying capacity, especially when cutting large-size materials, it is easy to cause insufficient cooling in the middle area of ​​the material, and the cutting ability of the diamond wire saw cannot be fully utilized. In addition, the single-strand diamond wire with the same outer diameter has more toughness. The diamond wire is much worse, so it is prone to brittle fracture under the action of sawing force

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