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Thermoplastic polyimide (TPI) adhesive film, double-sided base material containing same and preparation method thereof

A technology of polyimide film and polyimide, applied in the direction of adhesives, film/sheet adhesives, layered products, etc., can solve the problem of difficult to obtain molded products, insoluble TPI, easy to appear bubbles, etc. problem, to achieve good peel strength, uniform thickness, and good heat resistance

Inactive Publication Date: 2013-08-07
SHENZHEN DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the molecules of aromatic polyimides are in an orderly composition, and they are insoluble and insoluble (meaning that they cannot be compatible with thermosetting substances, because thermosetting substances will solidify when heated. Since thermoplastic polyimides are thermoplastic substances, It will soften when heated, the two are exactly contradictory and will cancel each other), and in the process of converting into imide, because there will be by-product water, it is easy to appear bubbles, and it is difficult to obtain molded products. Especially difficult to film
[0004] In addition, it is well known that as a method of connecting semiconductor motherboards, semiconductor devices and chips on lead frames have been widely used in the past, and packaging methods with epoxy resin have been widely used. The most advanced method is to use TPI film lamination base material as the wiring substrate, which is very eye-catching and gives designers a new space for imagination and freedom
Therefore, the problems that TPI is insoluble, insoluble, and difficult to form a film need to be solved urgently

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Dissolve 25 L of 2,2-bis[4-(4-aminophenoxy)phenyl]propane (BAPP) and 4,4'- Diaminodiphenyl ether (4,4'-ODA) 25 liters, add 3,3',4,4'-benzophenone tetra-acid dianhydride (BTDA) 30 liters, and add pyromellitic acid after dissolving Diacid dianhydride (PMDA) 15 liters and stirred for 2 hours to form a thermoplastic polyimide prepolymer prepolymer; after a period of reaction, add 3,3',4,4'-benzophenone tetraacid di Anhydride and / or pyromellitic dianhydride, so that the molar ratio of synthesis is actually approximately equimolar, and a thermoplastic phase-embedded polyimide prepolymer is obtained.

[0020] Dissolve 50 liters of p-phenylenediamine (P-PDA) in this solution, add 55 liters of tetracarboxylic boric acid, stir for 2 hours to dissolve, and then add pyromellitic dianhydride (PMDA) in N,N-dimethylformamide CDMF solution, monitor the viscosity of the solution, stop adding when the viscosity reaches 5000, and stir for 2 hours to obtain a solid content of 20% by weigh...

Embodiment 2

[0025] Dissolve 25 L of 2,2-bis[4-(4-aminophenoxy)phenyl]propane (BAPP) and 4,4'- 25 liters of diaminodiphenyl ether (4,4'-ODA), add 25 liters of 3,3',4,4'-benzophenone tetra-acid dianhydride (BTDA), dissolve and add pyromellitic acid Diacid dianhydride (PMDA) 15 liters and stirred for 2 hours to form a thermoplastic polyimide prepolymer prepolymer; after a period of reaction, add 3,3',4,4'-benzophenone tetraacid di Anhydride and / or pyromellitic dianhydride, so that the molar ratio of synthesis is actually approximately equimolar, and a thermoplastic phase-embedded polyimide prepolymer is obtained.

[0026] Dissolve 50 liters of p-phenylenediamine (P-PDA) in this solution, add 55 liters of tetracarboxylic boric acid, stir for 2 hours to dissolve, and then add pyromellitic dianhydride (PMDA) in N,N-dimethylformamide CDMF solution, monitor the viscosity of the solution, stop adding when the viscosity reaches 5000, stir for 2 hours until the solid content weight ratio is 20% for...

Embodiment 3

[0031] Dissolve 25 L of 2,2-bis[4-(4-aminophenoxy)phenyl]propane (BAPP) and 4,4'- Diaminodiphenyl ether (4,4'-ODA) 25 liters, add 3,3',4,4'-benzophenone tetra-acid dianhydride (BTDA) 30 liters, and add pyromellitic acid after dissolving Diacid dianhydride (PMDA) 10 liters and stirred for 2 hours to form a thermoplastic polyimide prepolymer prepolymer; after a period of reaction, add 3,3',4,4'-benzophenone tetraacid di Anhydride and / or pyromellitic dianhydride, so that the molar ratio of synthesis is actually approximately equimolar, and a thermoplastic phase-embedded polyimide prepolymer is obtained.

[0032] Dissolve 50 liters of p-phenylenediamine (P-PDA) in this solution, add 55 liters of tetracarboxylic boric acid, stir for 2 hours to dissolve, and then add pyromellitic dianhydride (PMDA) in N,N-dimethylformamide CDMF solution, monitor the viscosity of the solution, stop adding when the viscosity reaches 5000, and stir for 2 hours to obtain a solid content weight ratio of...

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Abstract

The invention provides a thermoplastic polyimide (TPI) adhesive film, a double-sided base material containing the same and a preparation method thereof. Through the combination of dianhydrides and diamines which are different in number of benzene rings and replacement position, the inlaid TPI adhesive film is prepared by inlaying a thermosetting material in a thermoplastic material; in the crystal imidization process, the glass transition temperature is 255 DEG C, the melting point is 380 DEG C, and the storage modulus is 2*10<6>Pa; the double-sided base material is synthesized by taking the TPI adhesive film as a medium carrier and coating the TPI adhesive film with a copper base, an aluminum base or other metal foils; the peel strength of the double-sided base material is ultra high (2.5KN / CM or above), the dielectric strength is more than 190KV / mm, and the thermal expansion coefficient is 21ppm DEG C; and the double-sided base material has a roughness of less than 2mu m, and does not warp or curl.

Description

Technical field: [0001] The invention relates to a thermoplastic polyimide (TPI, Thermoplastic Polyimide) adhesive film, an intermediate medium carrier used for flexible circuit substrates, chip packaging substrates, etc., a double-sided substrate containing the TPI adhesive film, and its preparation method. The double-sided base material is used as electronic devices and micro devices such as flexible circuit substrates and chip packaging substrates, and plays an important role in miniaturization, light weight, and high integration. The flexible circuit substrates and flexible packaging substrates are used for semiconductor packaging Bind with the chip to carry the component installation (that is, the actual installation) field, such as TAB, COF, PGA, TCP, etc. Background technique [0002] With the miniaturization, light weight and high density of electronic products, semiconductor chips are also highly integrated. For this reason, various methods have been proposed for s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J179/08C08L79/08C08G73/10B32B7/12B32B15/08
Inventor 刘萍
Owner SHENZHEN DANBOND TECH
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