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High molecular weight epoxy resin, resin film using same, resin composition and cured product

A technology of epoxy resin and high molecular weight, which is applied in the direction of epoxy resin glue, synthetic resin layered products, film/sheet without carrier, etc., which can solve the problem of high glass transition temperature, lower glass transition temperature, uneconomical, etc. problem, to achieve the effect of low linear expansion

Inactive Publication Date: 2015-11-25
NIPPON STEEL CHEMICAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, since the polycyclic aromatic compound has a rigid main chain, it is characterized by a high glass transition temperature, but also has a hard and brittle side
Patent Document 2 describes that warping resistance can be imparted by using a phenoxy resin containing a naphthalene skeleton, and the secondary hydroxyl groups in the skeleton are acylated, and the dielectric properties can also be improved. However, since the glass transition temperature is lowered, Therefore, further improvement in heat resistance is required
[0005] In addition, Patent Document 3 describes that a high-molecular-weight epoxy resin containing a naphthalene skeleton obtained by reacting a divalent epoxy resin with naphthalene diol can obtain a compound having film-forming ability that has not been obtained before, but in order to impart film-forming ability, It is necessary to obtain a compound having a high molecular weight exceeding 200,000 in the evaluation by gel filtration chromatography, and it is difficult to produce it stably because it becomes a condition close to gelation, and because the viscosity of the high molecular weight epoxy resin varnish increases, so Workability deteriorates, and it is uneconomical to use a large amount of solvent to improve workability, and it is not preferable in terms of reducing environmental load
Moreover, when the viscosity is high, the solution viscosity or melt viscosity becomes higher by adding fillers, etc., so the degree of freedom in the addition of fillers, etc., is impaired, and it is not preferable from this point of view.

Method used

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  • High molecular weight epoxy resin, resin film using same, resin composition and cured product
  • High molecular weight epoxy resin, resin film using same, resin composition and cured product
  • High molecular weight epoxy resin, resin film using same, resin composition and cured product

Examples

Experimental program
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Effect test

Embodiment

[0051] Examples are shown below, but the present invention is not limited to the following examples.

[0052] (raw material resin)

[0053] As an epoxy resin having two epoxy groups in one molecule and a naphthalene skeleton, a diglycidyl ether type epoxy of 1,6-dihydroxynaphthalene (epoxy group equivalent: 143.8 g / eq, n=1 component content 5.23 area %, oligomer content 3.23 area %), commercially available 1,6? dihydroxynaphthalene epoxy resin (Nippon Steel Chemical Co., Ltd. ZX? 1711 (epoxy group equivalent 147.0 g / eq, n=1 component content 6.63 area%, oligomer component content 7.32 area%)) and ZX? 1711 distillate (epoxy equivalent 139.5g / eq, n=1 component content 0.05 area%, Ingredient content 0.00 area %), diglycidyl ether type epoxy of 2,7? dihydroxynaphthalene (epoxy group equivalent 145.0g / eq, n=1 component content 6.54 area%, oligomer content 1.67 area %). As compounds having two phenolic hydroxyl groups in one molecule, 4,4'-dihydroxybiphenyl and bisphenol A were ...

Synthetic example 1

[0061] 300 parts by weight of 1,6? Hydroxynaphthalene, 1387.5 parts by weight of epichlorohydrin, 208.1 parts by weight of Hisolbu MDM, heated up to 60°C for dissolving after nitrogen purging, then charged 31.1 parts by weight of sodium hydroxide 48.8% by weight aqueous solution while paying attention to heat release, and reacted 1 hour. Then, the introduction of nitrogen gas was stopped, and 290.0 parts by weight of a 48.8% by weight aqueous solution of sodium hydroxide was added dropwise over 8 hours under the conditions of 160 Torr and 63°C. After completion of the dropwise addition, the temperature was raised to 150° C., and the pressure was further reduced to 10 Torr to distill off epichlorohydrin and Hisolbu MDM. After adding toluene to the obtained resin, it was filtered with celite, washed with a 0.1% by weight aqueous solution of sodium hydroxide in parts by weight, oil-water separation was performed, and the water phase was removed. Furthermore, after washing|clean...

Embodiment 1

[0067] In a detachable flask equipped with a stirrer, a cooling pipe, a thermometer, and a nitrogen blowing port, 61.2 parts by weight of 1,6-dihydroxynaphthalene diglycidyl ether type epoxy resin obtained in Synthesis Example 1, 38.8 Parts by weight of 4,4'-dihydroxybiphenyl and 25 parts by weight of cyclohexanone were dissolved by heating up to 145° C. and stirred for 1 hour. Then, 0.1 part by weight of tris-(2,6-dimethoxyphenyl)phosphine was charged as a reaction catalyst, and the temperature was raised to 165°C. While the reaction proceeds, the viscosity of the reaction solution rises, and cyclohexanone is added appropriately, and stirring is continued until a certain torque is reached. In addition, the progress of the reaction was constantly checked using gel permeation chromatography, and the reaction was terminated when the weight average molecular weight reached about 40,000. After the reaction was terminated, it was diluted so that high molecular weight epoxy resin / c...

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Abstract

Provided is an epoxy resin (C) obtained by causing a bifunctional epoxy resin (A) containing at least 50 wt% of the epoxy resin (a) represented by General Formula 1, and a compound (B) having two phenolic hydroxyl groups per molecule to react in a solvent, the weight-average molecular weight in terms of a reference polystyrene by gel permeation chromatography (hereinafter, "GPC") being 30,000 to 80,000, wherein the epoxy resin can satisfy low linear expansion properties, self-film-formation properties, and handling properties (where n represents a repeating unit and is an integer 0 or greater).

Description

technical field [0001] The present invention relates to a high molecular weight epoxy resin used in the field of electronic materials, a resin film using the high molecular weight epoxy resin, an epoxy resin composition, and a cured product. Background technique [0002] Epoxy resins are used in a wide range of electronic parts, electrical equipment, automotive parts, FRP, sporting goods, and the like because of their excellent adhesiveness, heat resistance, and formability. In particular, in recent years, it is one of materials attracting much attention in the field of electronic materials, and general techniques have been summarized in Non-Patent Document 1 and the like. The physical properties of components used in electrical equipment are extremely demanding, and materials with a small coefficient of linear expansion are especially required for laminates in which multiple components are integrated. [0003] In components used in electrical equipment, etc., it is known t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/14B32B27/00B32B27/38C08J5/24C09J7/02C09J163/00C09J7/22C09J7/10C09J7/35
CPCC08J5/24C08G59/066C08G59/245C08J2363/00C09J7/00C09J7/0242C09J163/00C09J2201/622C09J2400/143C09J2400/163C09J2463/00C09J7/35C09J2467/006C09J2301/312C08J5/244C09J7/22C09J7/30C08G59/1494C09J2301/40C09J7/10
Inventor 中西哲也朝荫秀安内田美幸
Owner NIPPON STEEL CHEMICAL CO LTD