Thermosetting adhesive composition, and heat resistant adhesive film and wiring film using the same
An adhesive and thermosetting technology, applied in the field of thermosetting adhesive compositions, heat-resistant adhesive films and wiring films, to achieve excellent low-temperature adhesiveness, not easy to curl, moisture-resistant reliability and long-term heat-resistant reliability. Effect
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Examples
Embodiment 1～6
[0176] Table 3 shows the thermosetting adhesive compositions of Examples 1-6. Examples 1 to 6 are examples of thermosetting adhesive compositions containing inorganic acicular fillers. Table 4 shows the characteristics of the heat-resistant adhesive film produced by applying the thermosetting adhesive composition on the polyimide film and drying it, and the laminated film obtained by heat-sealing the heat-resistant adhesive film and copper foil.
[0177] In the heat-resistant adhesive films of Examples 1 to 6, generation of strong curl was suppressed, and slight warpage of 4 to 10 mm was observed. The addition of inorganic acicular fillers effectively suppresses strong curling. Even after the humidity resistance test, the adhesive strength is 1.0 to 1.3 kN / m, and the soldering heat resistance at 280°C and storage stability are also good.
[0178] From the above, the following results were obtained: the heat-resistant adhesive film composed of the thermosetting adhesive compo...
Embodiment 7、8
[0188] Examples 7 and 8 are examples of thermosetting adhesive compositions having different blending amounts of inorganic acicular fillers. In the heat-resistant adhesive film of this example, strong curling was suppressed, and only slight warping of 4 to 9 mm was observed. The adhesive strength is 0.9 to 1.2 kN / m even after the humidity resistance test, and the 280°C soldering heat resistance and storage stability are also good. In Examples 7 and 8, the wiring embedding property was the same as that of Comparative Examples 1 to 5 which did not contain the inorganic acicular filler, and showed excellent values.
[0189] From the above, the following results were obtained: the heat-resistant adhesive films of Examples 7 and 8 were less likely to curl and had excellent storage stability, and the laminated film and wiring film using the same had excellent adhesiveness, moisture resistance, and soldering heat resistance.
[0190] Next, the thermosetting adhesive compositions of ...
Embodiment 9、10
[0196] Examples 9 and 10 are examples of thermosetting adhesive compositions having different compounding amounts of non-reactive plasticizers. The heat-resistant adhesive film of this example suppressed the occurrence of strong curling, and only slight warpage of 7 mm or more and 10 mm or less was observed. Even after the humidity resistance test, the adhesive strength is not less than 0.8 kN / m and not more than 1.0 kN / m, and the 280° C. soldering heat resistance and storage stability are also good. In addition, good wiring embedding properties were obtained even at a pressure of 3 MPa.
[0197] From the above, the following results were obtained: the heat-resistant adhesive film composed of the thermosetting adhesive composition of Examples 9 and 10 and the polyimide film is not easy to curl and has excellent storage stability, and the laminated film and wiring film using it , Excellent in adhesion, moisture resistance and soldering heat resistance.
[0198] Next, the ther...
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