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Thermosetting adhesive composition, and heat resistant adhesive film and wiring film using the same

An adhesive and thermosetting technology, applied in the field of thermosetting adhesive compositions, heat-resistant adhesive films and wiring films, to achieve excellent low-temperature adhesiveness, not easy to curl, moisture-resistant reliability and long-term heat-resistant reliability. Effect

Inactive Publication Date: 2015-02-11
HITACHI METALS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of the heat-resistant adhesive film of Patent Document 2, there is a problem that although the adhesive layer contains a phenoxy resin with a so-called superior adhesive force, the adhesive force is only about 0.5 kN / m , and the soldering heat resistance is 260°C, slightly lower

Method used

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  • Thermosetting adhesive composition, and heat resistant adhesive film and wiring film using the same
  • Thermosetting adhesive composition, and heat resistant adhesive film and wiring film using the same
  • Thermosetting adhesive composition, and heat resistant adhesive film and wiring film using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6

[0176] Table 3 shows the thermosetting adhesive compositions of Examples 1-6. Examples 1 to 6 are examples of thermosetting adhesive compositions containing inorganic acicular fillers. Table 4 shows the characteristics of the heat-resistant adhesive film produced by applying the thermosetting adhesive composition on the polyimide film and drying it, and the laminated film obtained by heat-sealing the heat-resistant adhesive film and copper foil.

[0177] In the heat-resistant adhesive films of Examples 1 to 6, generation of strong curl was suppressed, and slight warpage of 4 to 10 mm was observed. The addition of inorganic acicular fillers effectively suppresses strong curling. Even after the humidity resistance test, the adhesive strength is 1.0 to 1.3 kN / m, and the soldering heat resistance at 280°C and storage stability are also good.

[0178] From the above, the following results were obtained: the heat-resistant adhesive film composed of the thermosetting adhesive compo...

Embodiment 7、8

[0188] Examples 7 and 8 are examples of thermosetting adhesive compositions having different blending amounts of inorganic acicular fillers. In the heat-resistant adhesive film of this example, strong curling was suppressed, and only slight warping of 4 to 9 mm was observed. The adhesive strength is 0.9 to 1.2 kN / m even after the humidity resistance test, and the 280°C soldering heat resistance and storage stability are also good. In Examples 7 and 8, the wiring embedding property was the same as that of Comparative Examples 1 to 5 which did not contain the inorganic acicular filler, and showed excellent values.

[0189] From the above, the following results were obtained: the heat-resistant adhesive films of Examples 7 and 8 were less likely to curl and had excellent storage stability, and the laminated film and wiring film using the same had excellent adhesiveness, moisture resistance, and soldering heat resistance.

[0190] Next, the thermosetting adhesive compositions of ...

Embodiment 9、10

[0196] Examples 9 and 10 are examples of thermosetting adhesive compositions having different compounding amounts of non-reactive plasticizers. The heat-resistant adhesive film of this example suppressed the occurrence of strong curling, and only slight warpage of 7 mm or more and 10 mm or less was observed. Even after the humidity resistance test, the adhesive strength is not less than 0.8 kN / m and not more than 1.0 kN / m, and the 280° C. soldering heat resistance and storage stability are also good. In addition, good wiring embedding properties were obtained even at a pressure of 3 MPa.

[0197] From the above, the following results were obtained: the heat-resistant adhesive film composed of the thermosetting adhesive composition of Examples 9 and 10 and the polyimide film is not easy to curl and has excellent storage stability, and the laminated film and wiring film using it , Excellent in adhesion, moisture resistance and soldering heat resistance.

[0198] Next, the ther...

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Abstract

Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film.

Description

technical field [0001] The present invention relates to a thermosetting adhesive composition, and a heat-resistant adhesive film and a wiring film using the same. Background technique [0002] In recent years, electronic instruments have been miniaturized, thinned, and lightweight. For wiring components used in electronic instruments, it is required to achieve high-density fine wiring through multilayer, fine wiring, and thinning. Also, in this field, the adoption of lead-free soldering is progressing in order to reduce the environmental burden. At the same time, FFC (Flexible Flat Cable: flexible flat cable), TAB (Tape Automated Bonding: tape automatic connection) tape, FPC (Flexible Printed Circuit: flexible printed circuit), MFJ (Multi Frame Joiner: multi-frame Fitting) and other wiring components are required to improve their heat resistance. The insulating layer of the wiring member is basically composed of a base film and an adhesive layer. As such an example, Paten...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J171/12C09J11/06C09J11/04C09J7/02B32B27/08B32B37/06
CPCH05K2201/0248C09J181/06B32B2307/306B32B7/12B32B2307/7246B32B27/08B32B5/00C08G2650/54H05K2201/0209H05K1/02B32B2457/08Y10T428/263B32B3/08B32B15/08Y10T428/2826B32B2307/732H05K3/386Y10T428/26C09J171/00B32B27/281C08L79/08Y10T428/264Y10T428/265Y10T428/266Y10T428/31681Y10T428/31721C08K5/3415C08K7/04
Inventor 天羽悟阿部富也社内大介小松广明村上贤一
Owner HITACHI METALS LTD
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