Flame-retardant photocurable resin composition, dry film and cured product of same, and printed circuit board using composition thereof

A light-curable resin, flame retardant technology, applied in the direction of printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., to achieve the effect of low environmental load and excellent flame retardancy

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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, from the viewpoint of environmental load, it is not preferable to use a halogen compound such as a compound having a halogenated aromatic ring and a polymerizable unsaturated double bond.

Method used

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  • Flame-retardant photocurable resin composition, dry film and cured product of same, and printed circuit board using composition thereof
  • Flame-retardant photocurable resin composition, dry film and cured product of same, and printed circuit board using composition thereof
  • Flame-retardant photocurable resin composition, dry film and cured product of same, and printed circuit board using composition thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3、 comparative example 1、2

[0166] The components shown in Table 1 were blended in the proportions (parts by mass) shown in Table 1, pre-mixed with a mixer, and then kneaded with a 3-roll mixer to prepare a photocurable thermosetting resin composition for solder resist . Here, the degree of dispersion of the obtained photocurable thermosetting resin composition was evaluated by particle size measurement using GRIND METER manufactured by ERICHSEN, and was 15 μm or less.

[0167] [Table 1]

[0168]

[0169] performance evaluation

[0170]

[0171] A circuit pattern substrate with a copper thickness of 35 μm was ground with a polishing roller, then washed with water and dried, and then coated with the photocurable thermosetting resin composition of the aforementioned examples and comparative examples on the entire surface by the screen printing method, and heated at 80° C. Dry in a hot air circulation drying oven for 30 minutes. After drying, use an exposure device (HMW-680-GW20) equipped with a met...

Embodiment 4

[0204] Dilute the photocurable thermosetting resin composition prepared according to the same combination as in Example 1 with methyl ethyl ketone, apply it on the carrier film and heat and dry to form a resin composition layer with a thickness of 20 μm, and use a hot air dryer at 80°C to Let dry for 30 minutes. Further, a cover film was bonded thereon to obtain a dry film. Thereafter, the cover film was peeled off, and this was bonded to the patterned polyimide film substrate using a laminator. Use an exposure device (HMW-680-GW20) equipped with a metal halide lamp to expose the solder resist pattern on the substrate at an optimal exposure amount, peel off the carrier film, and then use 1wt% Na at 30°C 2 CO 3 The aqueous solution was developed for 60 seconds under the condition of a spray pressure of 0.2 MPa to obtain a substrate on which a resist pattern was formed. Thereafter, heat curing was performed for 60 minutes in a hot air drier at 150° C. to prepare a test substr...

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Abstract

Disclosed is a flame-retardant photocurable resin composition which has a halogen-free composition and thus places little burden on the environment. The flame-retardant photocurable resin composition has excellent flame retardancy and is capable of forming a cured coating film having excellent flexibility. A dry film and cured product of the composition, and a printed wiring board provided with a flame-retardant cured coating film such as a solder resist obtained by using the composition, dry film or cured product are also disclosed. The flame-retardant photocurable resin composition contains (A) an organic solvent-soluble phosphorus-containing polyester, (B) a carboxyl group-containing resin, and (C) a photopolymerization initiator. Preferably, the carboxyl group-containing resin (B) is a carboxyl group-containing polyurethane resin. Preferably, the flame-retardant photocurable resin composition additionally contains (D) a photopolymerizable monomer or (E) a thermosetting resin. The flame-retardant photocurable resin composition, particularly a flame-retardant photocurable/thermosetting resin composition containing the thermosetting resin (E) can be suitably used as a solder resist.

Description

technical field [0001] The present invention relates to a flame-retardant photocurable resin composition capable of being developed by a dilute alkaline aqueous solution, in particular a composition for a solder resist that is photocured by ultraviolet exposure or laser exposure, its dry film and cured product, and its use. A printed circuit board with a flame-retardant cured film formed. Background technique [0002] Conventionally, printed circuit boards and flexible circuit boards (hereinafter abbreviated as FPC) have been required to have flame retardancy because they are mounted on electronic devices, and flame retardancy has also been required for solder resists that are part of them. Among them, FPC is usually composed of a polyimide substrate, so it is a thin film unlike a printed circuit board with a glass epoxy substrate. However, since the solder resist to be applied has the same film thickness regardless of whether it is a printed circuit board or an FPC, in the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/035H05K3/28
CPCG03F7/032H05K3/287
Inventor 横山裕米田一善有马圣夫
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