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Copper-platinum alloy wires for connections in semiconductor devices

A platinum alloy and semiconductor technology, applied in the field of copper-platinum alloy wire, can solve problems such as instability, and achieve the effect of preventing chip cracking and not improving dynamic strength

Active Publication Date: 2016-12-28
TANAKA DENSHI KOGYO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, since various oxide films are formed when the cleaned copper alloy wire surface is heat-treated as a post-treatment or left in the atmosphere, the problem of an unstable oxide film on the copper alloy wire surface remains unsolved.

Method used

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  • Copper-platinum alloy wires for connections in semiconductor devices
  • Copper-platinum alloy wires for connections in semiconductor devices
  • Copper-platinum alloy wires for connections in semiconductor devices

Examples

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Embodiment Construction

[0054] As Examples 1 to 30 and Comparative Examples 1 to 6, copper alloy thick wires each having a diameter of 5 mm were produced by melting alloys of the compositions shown in Table 1 and performing continuous casting.

[0055] By the surface of the copper-platinum alloy thick wire of embodiment 1, measure platinum (Pt) and copper (Cu) by SIMS mass spectrometer respectively ( figure 1 ) and the concentration of oxygen (O). The horizontal axis of the graph represents the depth (μm) from the surface of the thick line, and the vertical axis represents the relative secondary ion intensity (log) of the depth.

[0056] according to figure 1 , platinum (Pt) is absent on the surface layer, and up to 50 nm, platinum (Pt) has a lower relative secondary ionic strength than the solid solution matrix. In contrast, it is apparent that copper (Cu) has a significantly higher purity near the surface.

[0057] according to figure 2 , oxygen (O) decreases linearly from the surface layer ...

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Abstract

PROBLEM TO BE SOLVED: To improve second bondability as well as prevent breakage of a chip in ball bonding and improve looping property in a copper fine wire for ball bonding.SOLUTION: An ultra thin layer of copper not containing platinum due to segregation is formed in a process of forming a single wire by continuous casting from a molten copper platinum alloy containing high purity copper (Cu), 0.1 to 2.0 mass% of platinum (Pt), 1 to 10 mass ppm of sulfur (S), 10 to 150 mass of oxygen (O) and if necessary 1 to 5 mass ppm of phosphorus (P) as nonmetallic elements, and is oxidized in the air atmosphere to form an oxide film having 6 to 2 nm on a wire surface layer after wire drawing. Uniform oxide film improves second bondability as a bonding wire having a Vickers hardness of 77 to 105 Hv, prevents aluminum splash by preventing dynamic strength at ball bonding by a matrix additive element, and maintains static strength without generating leaning.

Description

technical field [0001] The present invention relates to a copper alloy wire for connecting a pad electrode and an external electrode on a semiconductor element to each other by ultrasonic-assisted thermocompression bonding, and in particular, to a copper-platinum alloy wire in which a small amount of platinum (Pt) Dissolved in a matrix rich in copper (Cu) with a purity of 99.995% by mass or higher. Background technique [0002] With the recent rise in gold prices, copper alloy wires are attracting attention again as a substitute for the 4N gold alloy wires that have been used hitherto. [0003] In the conventional ultrasonic-assisted thermocompression bonding employed for conventional copper alloy wires, the copper alloy bonding wire is heated by an arc while being held on an aluminum disk under a non-oxidizing atmosphere such as a nitrogen atmosphere and a hydrogen-mixed nitrogen atmosphere. Input heat and melt the end of the wire, form a ball by surface tension, and then ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/49C22C9/00
CPCH01L24/43H01L2224/05624H01L2224/43H01L2224/43848H01L2224/45H01L2224/45015H01L2224/45144H01L2224/45147H01L2224/45565H01L2224/45644H01L2224/45664H01L2224/48463H01L2224/48824H01L2924/00011H01L2924/00014H01L2924/01015H01L2924/01078H01L2924/01016H01L2924/01008H01L2924/01204H01L2924/013H01L2924/00H01L2224/48H01L2924/20108H01L2924/20109H01L2924/2011H01L2924/20111H01L2924/20751H01L2924/01029H01L2924/00013H01L2924/01083H01L2924/00012H01L2924/01004
Inventor 天野裕之三上道孝冈崎纯一滨本拓也中岛伸一郎山下勉三苫修一小野甲介刘斌执行裕之
Owner TANAKA DENSHI KOGYO KK
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