Organic silicone resin, curable organopolysiloxane composition and application

An organopolysiloxane and organosilicon technology, used in adhesives and other directions, can solve problems such as insufficient adhesion and peeling

Active Publication Date: 2013-10-09
GUANGZHOU HUMAN CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the epoxy resin/organic silicon resin composition cured material obtained above has insufficient adhesion to PPA/metal, and it

Method used

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  • Organic silicone resin, curable organopolysiloxane composition and application

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Experimental program
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Effect test

Embodiment 1

[0063] Put 10.4g of tetraethyl orthosilicate into the flask, add 30g of absolute ethanol and 15g of concentrated hydrochloric acid with a concentration of 37% by mass in sequence, react at 70°C for 5 minutes, quickly add 41.2g of phenyltrimethoxysilane, and react at 70°C for 30 Minutes, add 63.7g of methylphenyldimethoxysilane, 7.9g of methylvinyldimethoxysilane and 7.4g of 3-glycidyl ether propylmethyldiethoxysilane, reflux at 70°C for 60 minutes, Add 1.8g of tetramethyldivinyldisiloxane, continue to reflux at 70°C for 60 minutes, pour into a separatory funnel, separate the acidic water layer, wash the organic layer with deionized water to neutral pH, pour it into a flask, and add 1 g of ionized water was refluxed at 70°C for 30 minutes, then concentrated by distillation under reduced pressure with a vacuum water pump to obtain a resin with a viscosity of 6000 mPa·s (detected by a viscometer) at 25°C. pass 1 H NMR, 13 C NMR, 29 Si NMR and FT-IR detection, the following dat...

Embodiment 2

[0067] Put 10.4g of tetraethyl orthosilicate into the flask, add 30g of absolute ethanol and 15g of concentrated hydrochloric acid with a concentration of 37% by mass in sequence, react at 70°C for 5 minutes, quickly add 68.3g of phenyltrimethoxysilane, and react at 70°C for 30 Minutes, add 44.2g of methylphenyldimethoxysilane, 7.9g of methylvinyldimethoxysilane and 7.4g of 3-glycidyl ether propylmethyldiethoxysilane, reflux at 70°C for 60 minutes, Add 1.8g of tetramethyldivinyldisiloxane, continue to reflux at 70°C for 60 minutes, pour into a separatory funnel, remove the acidic water layer, wash the organic layer with water to neutral pH, pour it into a flask, and add 1g of deionized water , refluxed at 70°C for 60 minutes, concentrated by vacuum water pump distillation under reduced pressure, and obtained a resin with a viscosity of 12000 mPa·s at 25°C. pass 1 H NMR, 13 CNMR, 29 Si NMR and FT-IR detection, the following data were obtained:1 H NMR (δ, ppm, 7-8, 280H, Si-P...

Embodiment 3

[0071] Add 10.4g of tetraethyl orthosilicate to the flask, add 30g of absolute ethanol and 15g of concentrated hydrochloric acid with a concentration of 37% by mass in sequence, react at 70°C for 5 minutes, quickly add 61.9g of phenyltrimethoxysilane, and react at 70°C for 30 minutes , add 24.7g of methylphenyldimethoxysilane, 7.9g of methylvinyldimethoxysilane and 14.8g of 3-glycidyl ether propylmethyldiethoxysilane, reflux at 70°C for 60 minutes, add Tetramethyldivinyldisiloxane 1.8g, continue to reflux at 70°C for 60 minutes, pour into a separatory funnel, remove the acidic water layer, wash the organic layer with water to neutral pH, pour into a flask, add 1g of deionized water, Reflux at 70°C for 30 minutes, vacuum distillation and concentration with a vacuum pump, and remove solvent and low boiling point substances under reduced pressure to obtain a resin with a viscosity of 20,000 mPa·s at 25°C. pass 1 H NMR, 13 C NMR, 29 Si NMR and FT-IR detection, the following dat...

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Abstract

The invention discloses an organic silicone resin, a curable organopolysiloxane composition and an application. A structural formula of the organic silicone resin is shown as formula I. The curable organopolysiloxane composition is obtained by mixing the organic silicone resin with an organic silicone compound having at least two hydrogen atoms bonded with a silicone atom in one molecule. The curable organopolysiloxane composition can be applied on luminescent semiconductor package. The curable organopolysiloxane composition has the following advantages of excellent adhesive property, relatively strong hardness, excellent impact resistance, high transparency, little color change in a heat resistance test and high luminescent efficiency. Besides, the curable organopolysiloxane composition is not easy to peel off in a thermal shock test and presents excellent adhesive power in adhesive experiments with PPA and metal. The formula I is R1R22SiO(R3SiO3/2)a(SiO4/2)b(R42SiO)cOSiR22R1.

Description

technical field [0001] The invention relates to an adhesive, in particular to a composition and application of a silicone resin and a curable organopolysiloxane. Background technique [0002] Curable resin compositions used in traditional electronic / electric appliance sealing curing and bonding often use curable epoxy resin compositions to obtain cured materials with high hardness, high transparency and low thermal expansion. However, this cured product is too rigid, and thermal expansion during curing tends to generate large stress inside electronic / electrical parts to cause cracks inside the cured product. In addition, a large amount of heat generated in the application of high-current and high-power electronic / electrical components is likely to cause the cured epoxy resin composition to turn yellow and affect the luminous efficiency. [0003] In order to reduce the stress and improve the yellowing of the cured product, it has been proposed to use an organopolysiloxane co...

Claims

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Application Information

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IPC IPC(8): C08G77/20C08L83/07C08L83/05C09J183/07C09J183/05
Inventor 郑海庭何海唐渝朱经纬黄光燕
Owner GUANGZHOU HUMAN CHEM
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