Two-component organic silicon pouring sealant

A silicone potting glue, a two-component technology, applied in the direction of adhesives, adhesive additives, electrical components, etc., can solve the problems of insufficient adhesion, large influence of ambient temperature, oil leakage, etc., and achieve good impact resistance , good leveling, prolonging the life of the effect

Active Publication Date: 2013-11-13
深圳市欧普特工业材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the cost of silica gel is high, and the performance of silica gel is greatly affected by the ambient temperature
As the temperature rises, the thermal stress inside the silica gel increases, resulting in a decrease in the refractive index of the silica gel, which affects the LED light efficiency and light intensity distribution. Moreover, some silicone rubber is potted and sealed in the LED display for aging, and the adhesion is not enough. It affects the waterproof function of the LED display, and there will be shrinkage, oil leakage, corrosion and other phenomena, which seriously affect the use of the LED display

Method used

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  • Two-component organic silicon pouring sealant

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Preparation of RTV-2 base glue: Add simethicone, white carbon black, and hexamethyldisiloxane into the kneader in a weight ratio of 100:50:10 and knead for about 1 hour, then raise the temperature to 160°C, and turn on the vacuum pump , pressure to -0.1MPa, constant temperature and pressure reaction for about 4 hours, stop the reaction, turn off the kneader and vacuum pump in turn, deflate, let stand to cool, that is.

[0023] Component A consists of α, ω-dihydroxy polydimethylsiloxane (107 glue), dimethyl silicone oil (201 silicone oil), RTV-2 base glue, silica powder, iron black, and black paste in a weight ratio of 100: 65:20:20:5:3 Mix evenly, slowly raise the temperature to 90°C, stir at constant temperature for 4 hours, let stand to cool, and filter with a 100-mesh filter. The viscosity of component A is 2500CPS.

[0024] Component B consists of dimethyldiethoxysilane, dimethyl silicone oil (201 silicone oil), 3-aminopropyltriethoxysilane (KH-550), vinyltriethoxy...

Embodiment 2

[0027] Preparation of RTV-2 base glue: Add simethicone, white carbon black, and hexamethyldisiloxane into the kneader in a weight ratio of 100:50:10 and knead for about 1 hour, then raise the temperature to 170°C, and turn on the vacuum pump , pressure to -0.1MPa, constant temperature and pressure reaction for about 4 hours, stop the reaction, turn off the kneader and vacuum pump in turn, deflate, let stand to cool, that is.

[0028] Component A is composed of α, ω-dihydroxy polydimethylsiloxane, dimethyl silicone oil, RTV-2 base glue, silica powder, iron black, and black paste in a weight ratio of 100:50:30:20:5: 3 Mix and mix evenly, slowly raise the temperature to 100°C, stir at constant temperature for 3 hours, let stand to cool, and filter with a 100-mesh filter. The viscosity of component A is 5000CPS.

[0029] Component B consists of dimethyldiethoxysilane, dimethicone, 3-aminopropyltriethoxysilane, vinyltriethoxysilane, and dibutyltin dilaurate in a weight ratio of 10...

Embodiment 3

[0032]Preparation of RTV-2 base glue: add simethicone, white carbon black, and hexamethyldisiloxane into the kneader in a weight ratio of 100:80:30 and knead for about 1 hour, then raise the temperature to 170°C, and turn on the vacuum pump , pressure to -0.1MPa, constant temperature and pressure reaction for about 4 hours, stop the reaction, turn off the kneader and vacuum pump in turn, deflate, let stand to cool, that is.

[0033] Component A is composed of α, ω-dihydroxy polydimethylsiloxane, dimethyl silicone oil, RTV-2 base glue, silica powder, iron black, and black pulp in a weight ratio of 100:57:25:20:8: 3 Mix evenly, slowly heat up to 110°C, stir at constant temperature for 3 hours, let stand to cool, and filter with a 100-mesh filter. The viscosity of component A is 3750CPS.

[0034] Component B consists of dimethyldiethoxysilane, dimethicone, 3-aminopropyltriethoxysilane, vinyltriethoxysilane, and dibutyltin dilaurate in a weight ratio of 100:55:33 :30:1 Mix evenl...

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Abstract

The invention provides a two-component organic silicon pouring sealant comprising a component A and a component B, wherein the component A is formed by mixing alpha,omega-dihydroxy polydimethylsiloxane, dimethicone, RTV-2 (room temperature vulcanization silicon rubber)-based rubber, silicon micro-powder, iron oxide black and black slurry at a weight ratio of 100:(50-65):(20-30):(20-30):(3-8):(2-4); the component B is formed by mixing dimethyl diethoxy silane, dimethicone, 3-amino propyl triethoxy silane, vinyl triethoxy silane and dibutyltin dilaurate at a weight ratio of 100:(50-65):(30-35):(30-35):(1-3). The two-component organic silicon pouring sealant is low in viscosity, good in leveling property and suitable for encapsulation of indoor and outdoor LED (Light-Emitting Diode) display screens and decorative lighting modules, has excellent heat resistance, moisture resistance and cold resistance, and can be used for prolonging the service life of electronic accessories, and the LED display screens can reach an IP65 waterproofing grade.

Description

technical field [0001] The invention belongs to the technical field of potting materials, and in particular relates to a two-component silicone potting glue for LEDs. Background technique [0002] During the use of LEDs, the loss of photons produced by radiative recombination when they are emitted to the outside mainly includes three aspects: the internal structure of the chip and the absorption of materials; the reflection loss of photons at the exit interface due to the difference in refractive index; The loss of total reflection caused by the incident angle greater than the critical angle of total reflection. Therefore, a lot of light cannot exit the chip to the outside. By coating a layer of glue layer with a relatively high refractive index on the surface of the chip - LED potting glue, it can effectively reduce the loss of photons at the interface and improve the light extraction efficiency. In addition, the function of the encapsulant also includes mechanical protec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/06C09J183/04C09J11/04C09J11/06H01L33/56
Inventor 刘诚
Owner 深圳市欧普特工业材料有限公司
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