Shitake mushroom cultivation material compatibility and production method of shitake mushroom cultivation material
A shiitake mushroom cultivation material and cultivation material technology, which is applied in the preparation of organic fertilizers, organic fertilizers, fertilizer mixtures, etc., can solve the problems of inhibiting the growth of edible fungus mycelia, and achieve the expansion of cultivation raw material channels, good performance, and good air permeability Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0027] Mode 1: In this embodiment, the mushroom cultivation material includes the following components and mass proportions: 30% of chestnut twigs, 22% of bract husks, 25% of chestnut husks, 20% of bran, 1% of gypsum powder, and 2% of lime powder. %, all are the quality of dry matter, and the sum of proportioning is 100%.
[0028] Production Method:
[0029] ①Sunning: Expose the raw materials for 2 days before mixing;
[0030] 2. Pre-wet: First, mix chestnut twigs, bract crumbs, and chestnut husks evenly in a dry state, and then pre-wet (fully soak) with 2% lime aqueous solution;
[0031] ③ Stacking and fermentation: Pile the wet material into a trapezoidal pile with a height of 1.2m and a width of 3m. After the pile is completed, pat the surroundings lightly, and then use a wooden stick with a diameter of 15cm to insert some vertical air holes on the pile to reach the bottom of the pile. Pore density is 1 / m 3 , and finally covered with thatch to let it ferment naturally;...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com