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Dual-cured high-performance LED packaging material and preparation method thereof

A technology of LED encapsulation and dual curing, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems such as the decrease of optical properties such as the refractive index and light transmittance of the material, and the uneven mixing of the material matrix.

Active Publication Date: 2013-11-27
GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Directly doping nano-silicon dioxide physically into the packaging material to reinforce the material can improve the mechanical strength of the material, but due to the agglomeration of nano-silicon dioxide, it mixes unevenly with the material matrix. The optical properties such as the refractive index and light transmittance of the material decrease significantly
Therefore, the traditional methods of hydrosilylation and adding silica fillers obviously cannot meet the requirements of preparing LED packaging materials with high refractive index, high strength, and high light transmittance.

Method used

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  • Dual-cured high-performance LED packaging material and preparation method thereof
  • Dual-cured high-performance LED packaging material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0024] 1. 20 parts by mass of phenyltrimethoxysilane, 20 parts by mass of vinyltrimethoxysilane, 80 parts by mass of dimethyldimethoxysilane, catalyst hydrochloric acid 1×10 -2 Parts by mass, 0.1 part by mass of water, 500 parts by mass of ethanol, hydrolyzed at 65°C for 5 hours, and removed water and organic solvents to obtain a condensate of silicon-hydroxyl-containing phenylvinylsiloxane (vinyl content: 3%).

[0025] 2. 99 parts by mass of vinyl silicone oil (vinyl content 0.84%, Guangzhou Hongyu Organic Silicon Material Co., Ltd.), 1 part by mass of silicon-containing hydroxyphenyl vinyl siloxane condensate synthesized in step 1, 75 parts by mass of hydrogen-containing silicone oil parts (hydrogen content 0.5%, Kaihua County Taicheng Silicone Co., Ltd.), 2.5 parts by mass of 20-40nm silicon dioxide, hydroxyl self-condensation catalyst dibutyltin diacetate 1×10 -4 Parts by mass, hydrosilylation catalyst H 2 PtCl 6 Isopropanol solution 3 x 10 -6 parts by mass, mixed evenl...

Embodiment 2

[0029] 1. 80 parts by mass of diphenyldimethoxysilane, 5 parts by mass of methylvinyldimethoxysilane, 20 parts by mass of dimethyldimethoxysilane, catalyst hydrochloric acid 16×10 -3 Parts by mass, 1 part by mass of water, 400 parts by mass of tetrahydrofuran, hydrolyzed at 60°C for 10 hours, and removed water and organic solvents to obtain a silicon hydroxyphenyl vinylsiloxane condensate (vinyl content 1%).

[0030] 2. 1 mass part of vinyl silicone oil (vinyl content 0.84%, Guangzhou Hongyu Organic Silicon Material Co., Ltd.), 99 mass parts of silicon-containing hydroxyphenyl vinyl siloxane condensate synthesized in step 1, 60 mass parts of hydrogen-containing silicone oil parts (hydrogen content 0.5%, Kaihua County Taicheng Silicone Co., Ltd.), 0.5 parts by mass of 100nm nano-silica, hydroxyl self-condensation catalyst dibutyltin dilaurate 6×10 -6 Parts by mass, hydrosilylation catalyst Pt (PPh 3 ) 4 2×10 -5 parts by mass, mixed uniformly, reacted at 95° C. for 0.35 h, th...

Embodiment 3

[0033] 1. 30 parts by mass of diphenyldiethoxysilane, 10 parts by mass of methylvinyldimethoxysilane, 80 parts by mass of dimethyldiethoxysilane, catalyst dibutyltin diacetate 5×10 -3Parts by mass, 0.5 parts by mass of water, 200 parts by mass of ethanol, hydrolyzed at 45°C for 18 hours, removed water and organic solvents, and obtained silicon hydroxyphenyl vinylsiloxane condensate (vinyl content 1.7%).

[0034] 2. 10 parts by mass of vinyl silicone oil (vinyl content 0.09%, Guangzhou Hongyu Organic Silicon Material Co., Ltd.), 90 parts by mass of silicon-containing hydroxyphenyl vinyl siloxane condensate synthesized in step 1, 100 parts by mass of hydrogen-containing silicone oil parts (hydrogen content 1.54%, Kaihua County Taicheng Organic Silicon Co., Ltd.), 40 ~ 70nm nano-silica 1 mass part, hydroxyl self-condensation catalyst stannous octoate 3.5 × 10 -5 Parts by mass, hydrosilylation catalyst H 2 PtCl 6 A solution of isopropanol 2.9 x 10 -6 parts by mass, mixed unifor...

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Abstract

The invention relates to the field of organosilicon packaging materials, and discloses a dual-cured high-performance LED packaging material and a preparation method thereof. The preparation method of the packing material comprises the following steps: uniformly mixing the following components in parts by weight: 0.5-100 parts of condensation compound containing silicon hydroxyl phenyl vinyl siloxane, 0 to 100 parts of vinyl silicone oil, 10 to 100 parts of hydrogen-containing silicone oil, 0.1 to 5 parts of nano silica, 10<-4> to 10<-6> part of silicon hydroxyl self-condensation catalyst and 10<-4> to 10<-6> part of hydrosilylation catalyst; performing reaction for 0.1-0.5 hour at the temperature of 90-120 DEG C to realize hydrosilylation curing reaction; then rising the temperature up to 130-150 DEG C for reaction for 1-5 hours to realize condensation of silicon hydroxyl so as to obtain the product. The obtained material has high light transmittance, high refraction indexes and excellent high-temperature resistance and anti-ultraviolet ageing performance, and is suitable for substrate equipment, touchpads, LCD components and the like, which utilize the LED packing materials.

Description

technical field [0001] The invention belongs to the field of organic silicon encapsulation materials, in particular to a dual-curable high-performance LED encapsulation material and a preparation method thereof. Background technique [0002] In recent years, with the continuous improvement of LED manufacturing technology, its luminous efficiency, brightness and power have been greatly improved, which puts forward higher requirements for the optical, mechanical, electrical and heat resistance properties of LED packaging materials. . At present, the LED packaging materials at home and abroad are mainly epoxy resin and silicone materials. Epoxy resin has the advantages of excellent adhesion, mechanical properties, electrical insulation properties, low cost and easy processing, etc., but it is easy to change color, brittle, easy to age, moisture absorption, etc., which limits the use of epoxy resin in high-performance LEDs. use in packaging materials. Silicone materials have ...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/06C08L83/05H01L33/56C08K3/36C08G77/38C08G77/20
Inventor 刘伟区韩敏健闫振龙马子淇高南罗广建王政芳
Owner GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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