Electroplating auxiliary as well as preparation method and application thereof

Abstract

The invention discloses an electroplating auxiliary as well as a preparation method and application thereof. The electroplating auxiliary comprises the following components of 0.3 gram of sodium benzoate, 0.7 gram of gluside, and 0.06 gram of ascorbic acid dissolved into per 100 ml plating solution. The electroplating auxiliary is prepared by electroplating preprocessing, electroplating and electroplating post-processing. Visual inspection proves that plating is bright, and leveling capability is better. Observation under an invert metallographic microscope proves that the plating is compact. The binding force of 9.37 MPa of the plating and a basal body is obtained through an adhesive attraction tester, an electrochemical workstation is adopted for testing a Tafel curve and an electrochemistry impedance spectrogram, and the results show that the corrosion resistance is improved with the comparison to that of electroplating which is not added with the electroplating auxiliary. Measuring a magnetic hysteresis loop and a magnetic curve by a vibration magnetometer proves that the magnetic respond capability of the plating sample is better, but the magnetic property is worse.

Description

technical field [0001] The invention relates to a chemical reagent, in particular to a chemical auxiliary agent used in electroplating. Background technique [0002] Electroplating additives are a general term for a class of chemicals added to the electroplating solution that have special effects on the properties of the plating solution and coating. The NdFeB permanent magnets prepared by the traditional sintering method have poor corrosion resistance due to the defects of the preparation process, while the nanocrystals prepared by electrodeposition have high density and extremely small porosity. Has unique advantages and has attracted widespread attention [1] . Through a large number of experiments, observations and theoretical analysis, it is shown that the plating solution only contains the salt of the metal to be plated, and the coating with decorative, functional and other special and excellent properties required in actual production practice cannot be obtained, and...

AI Technical Summary

Problems solved by technology

[0003] The method of electroplating to prepare NdFeB is a relatively new and theoretically very feasible method, and has made some progress. Pei Ling [3] have prepared NdFeB thin films by electroplating, but through repeated tests, it was found that under the main salt system without any additives, the density, leveling, and brightness of the NdFeB thin films electroplated , corrosion resistance and poor adhesion between the film and the copper substrate

It is particularly obvious that the stability of the plating solution is very poor. After two samples were plated, it was found that there were many reddish-brown precipitates at the bottom and suspended solids suspended in the three-necked bottle.

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