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However, this manufacturing method must use flame retardants containing halogens (such as bromine), such as tetrabromocyclohexane, hexabromocyclodecane, and 2,4,6-tris(tribromophenoxy)-1 ,3,5-Triazabenzene, and these bromine-containing flame retardants are easy to cause pollution to the environment when the product is manufactured, used, or even recycled or discarded
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[0041]For fully understanding object of the present invention, feature and effect, by following specific embodiment, the present invention is described in detail, and description is as follows:
Embodiment 1
[0043] Example 1 (E1)
[0044] A resin composition comprising the following components:
[0061] (F) 50 parts by weight of phosphazene compound (SPB-100);
[0062] (G) 50 parts by weight of fused silica;
[0063] (H) 0.3 parts by weight catalyst (2E4MI); and
[0064] (1) 60 parts by weight of methyl ethyl ketonesolvent (MEK).
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Abstract
The invention provides a halogen-free resin composition, which comprises: (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of benzoxazine resin; (C) 10 to 100 parts by weight of styrene maleate An acid anhydridecopolymer; and (D) 10 to 90 parts by weight of dicyclopentadiene phenolic resin. The present invention can achieve low dielectric constant, low dielectric loss, high heat resistance and high flame resistance by including specific components and ratios; it can be made into prepreg or resin film, and then it can be applied to copper Foil substrate and printed circuit board purposes.
Description
technical field [0001] The present invention relates to a halogen-free resin composition, in particular to a halogen-free resin composition applied to copper foil substrates and printed circuit boards. Background technique [0002] In response to the world's environmental protection trends and green laws and regulations, Halogen-free has become the current environmental protection trend of the global electronics industry. Countries around the world and related electronics manufacturers have successively formulated mass production schedules for halogen-free electronic products. After the implementation of the EU Restriction of Hazardous Substances (RoHS), substances including lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers are no longer allowed to be used in the manufacture of electronic products or their components. Printed Circuit Board (PCB) is the basis of electronic and electrical products. Halogen-free is the firs...
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