Resin composition, pre-preg, and metal foil clad laminate

A resin composition, epoxy resin technology, applied in metal layered products, layered products, thin material processing and other directions, can solve the problems of decreased reflectivity, low heat resistance of laminates, discoloration of substrate surfaces, etc. Less drop in reflectance, high industrial applicability, high heat resistance and high light reflectance

Inactive Publication Date: 2013-12-18
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the heat resistance of laminates using such epoxy resins is generally low, discoloration of the substrate surface occurs during the manufacturing process of printed circuit boards, heat treatment in the LED mounting process, heating during use after LED mounting, and light irradiation. , so there may be a problem that the reflectivity drops significantly

Method used

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  • Resin composition, pre-preg, and metal foil clad laminate
  • Resin composition, pre-preg, and metal foil clad laminate
  • Resin composition, pre-preg, and metal foil clad laminate

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1）

[0113] Into a 300ml five-necked glass round bottom flask equipped with stainless steel half-moon stirring blades, nitrogen introduction tube, Dean-Stark trap equipped with condenser, thermometer, and glass end cap, each 100g1 ,2,4-Cyclohexanetricarboxylic acid-1,2-anhydride (H-TMAn, manufactured by Mitsubishi Gas Chemical Co., Ltd.), 100g of methyl ethyl ketone, heated with a mantle heater, and heated the reaction system in about 10 minutes The temperature was raised to 80°C, stirred for 60 minutes to form a uniform solution, and air-cooled to 50°C for about 10 minutes to obtain a solution with a solid content concentration of 50% by mass.

Embodiment 1）

[0115] Stir and mix 24 parts by mass of the solution obtained in Preparation Example 1 with a homomixer (12 parts by mass based on 1,2,4-cyclohexanetricarboxylic acid-1,2-anhydride (H-TMAn)), as The epoxy resin having a bisphenol A skeleton represented by the following formula (3) is an epoxy resin having a bisphenol A skeleton (EP-1001, manufactured by Japan Epoxy Resins Co., Ltd.) 27 parts by mass, as an alicyclic formula 2,2-bis(hydroxymethyl)-1-butanol 1,2-epoxy-4-(2-oxiranyl) cyclohexane adduct of epoxy resin (EHPE-3150, DAICELCHEMICAL Made by INDUSTRIES, LTD.) 61 parts by mass, titanium dioxide (CR90 (with respect to the total amount of 100 parts by mass, containing 1 to 5 parts by mass of SiO) 2 And 1~3 parts by mass of Al 2 O 3 . ), ISHIHARASANGYO KAISHA, LTD.) 75 parts by mass, and 1.75 parts by mass of the dispersant (BYK-W903, manufactured by BYK Japan K.K.) to obtain a varnish.

[0116] The varnish was diluted with methyl ethyl ketone in equal times on a mass basis, ...

Embodiment 2）

[0121] Stir and mix 28 parts by mass of the solution obtained in Preparation Example 1 with a homomixer (14 parts by mass based on 1,2,4-cyclohexanetricarboxylic acid-1,2-acid anhydride (H-TMAn)), as Novolac type epoxy resin having a bisphenol A skeleton represented by the following formula (4): 12 parts by mass of an epoxy resin having a bisphenol A skeleton (N-890, manufactured by DICCORPORATION), alicyclic epoxy resin ( EHPE-3150) 74 parts by mass, 75 parts by mass of titanium dioxide (CR90), and 1.75 parts by mass of dispersant (BYK-W903) to obtain a varnish.

[0122] Except for using the varnish, the same procedure as in Example 1 was carried out to obtain a prepreg and a double-sided copper-clad laminate with a thickness of 0.2 mm.

[0123]

[0124] (In the formula, m is a positive integer.)

[0125] Among them, in the skeleton represented by the general formula (4), the part formed by m repeating units is the same as the skeleton represented by the above general formula (2), ...

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Abstract

Provided are a resin composition, pre-preg therefor, and metal foil clad layer plate, that can be suitably used as a printed wiring board for LED packaging with high light reflectivity in the ultraviolet light region and the visible light region, that does not lose light reflectivity due to heating and light irradiation, and that also has excellent peel strength relative to a metal foil. This resin composition includes at least (A) an epoxy resin having a bisphenol A backbone, (B) an alicyclic epoxy resin, (C) an acid anhydride of a partially hydrogenated compound or a totally hydrogenated compound of an aromatic polycarboxylic acid, (D) titanium dioxide, and (E) a dispersing agent.

Description

Technical field [0001] The present invention relates to a resin composition, a prepreg, and a metal-clad laminate, and particularly relates to a resin composition, a prepreg, and a metal-clad laminate that can be suitably used for a printed circuit board for light-emitting diode (LED) mounting. Background technique [0002] Conventionally, as a printed circuit board for LED mounting, a laminated board obtained by impregnating an epoxy resin containing titanium dioxide in a glass woven fabric and then heating and curing it (for example, refer to Patent Document 1) and the like. However, due to the low heat resistance of laminates generally using this epoxy resin, the printed circuit board manufacturing process, heating treatment in the LED mounting process, heating during use after LED mounting, and light irradiation cause discoloration of the substrate surface , So there may be a problem of a significant drop in reflectivity. [0003] Especially in recent years, as LEDs that emit ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00B32B15/092C08G59/42C08J5/24C08K3/22C08K5/092
CPCC08J2363/00C08G59/24C08G59/4215C08L63/00C08K2003/2241B32B15/092B32B15/14B32B2260/046B32B2305/076B32B2457/08B32B15/20B32B2260/021B32B2260/023C08G59/3218C08G59/38C08G59/42C08L2205/025Y10T428/31522Y10T428/31529C08J5/244C08J5/249C08K3/22C08K5/092C08J5/24C08K2201/003H05K1/03
Inventor 高田圭辅小泉薫森下宏治
Owner MITSUBISHI GAS CHEM CO INC
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