Thin sheet type CPU heat dissipation device and machining method thereof

Abstract

The invention relates to heat dissipation devices, in particular to a thin sheet type CPU heat dissipation device and a machining method thereof. The thin sheet type CPU heat dissipation device comprises a heat transmission and heat dissipation integrated device, wherein the heat transmission and heat dissipation integrated device is formed by stamping, and network channels are formed inside the heat transmission and heat dissipation integrated device. The network channels are filled with certain amount of heat transmission working media from technological filling ports and are sealed through welding. The heat dissipation device comprises a heat transmission substrate and a heat dissipation part, wherein the heat transmission substrate in contact with a CPU is of a protruding structure, and the portion outside the heat transmission substrate is the heat dissipation part. Mirror surface machining is carried out on the surface, in contact with the CUP, of the heat dissipation substrate. An efficient heat transmission technology is adopted in the thin sheet type CPU heat dissipation device and the manufacturing method thereof, heat generated by the CPU is made to be transmitted to a heat dissipation end fast, and the heat dissipation end carries out heat exchange with ambient air to ensure the normal work of the CPU.

Description

technical field [0001] The invention relates to a cooling device, in particular to a thin-plate CPU cooling device and a processing method thereof. Background technique [0002] At present, the CPU radiators on the market, the low-end ones are: pure aluminum, pure copper, and pure silver; the middle-end ones are: copper-embedded aluminum, die-cast copper aluminum, thermal control; , oil cooling, semiconductor refrigeration, compressor refrigeration, dry ice refrigeration, liquid nitrogen refrigeration, liquid helium refrigeration, etc.; heat dissipation methods include: passive heat dissipation, active heat dissipation and active refrigeration. In terms of cost, installation space and use effect, they can no longer meet the requirements of CPU's increasingly higher power density and narrow heat transfer space, especially the requirements of computer centers. Contents of the invention [0003] The purpose of the present invention is to provide a thin-plate CPU heat dissipa...

AI Technical Summary

Problems solved by technology

In terms of cost, installation space and use effect, they can no longer meet the requirements of CPU's increasingly higher power density and narrow heat transfer space, especially the requirements of computer centers.

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