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Room-temperature-storage type acrylate underfill adhesive and preparation method thereof

A technology of underfill glue and acrylate, which is applied in the direction of modified epoxy resin adhesives, etc., can solve the problems of high cost pressure, affecting product reliability, high storage and transportation costs, etc., and achieve reduced transportation and use costs, excellent room temperature Stability, effect of low halogen content

Inactive Publication Date: 2015-06-24
TONSAN ADHESIVES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Due to its high viscosity, the traditional one-component epoxy underfill will have poor wettability and trap air bubbles during the filling process, which seriously affects the reliability of the product
[0009] 2. Environmental issues
In order to meet the requirements of halogen content, often only the rectified epoxy resin whose price is tens of times higher can be selected as the raw material, and the cost pressure is very high
[0011] 3. The traditional one-component epoxy underfill needs to be refrigerated or even frozen for storage and transportation. The conditions are harsh and the storage and transportation costs are high.

Method used

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  • Room-temperature-storage type acrylate underfill adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] 30 parts of polyurethane modified acrylate resin

[0055] 30 parts of epoxy modified acrylate resin

[0056] 33.5 parts of isobornyl acrylate

[0057] Cumene hydroperoxide 3.0 parts

[0058]p-benzoquinone 0.5 parts

[0059] Leveling agent 1.0 parts

[0060] Defoamer 1.0 parts

[0061] Carbon black paste 1.0 parts

[0062] Preparation:

[0063] Accurately weigh various raw materials according to the proportion of the formula, first add polyurethane modified acrylate resin, epoxy modified acrylate resin, isobornyl acrylate, leveling agent, defoamer, p-benzoquinone, and carbon black slurry to the reaction Stir in the kettle, after stirring evenly, add cumene hydroperoxide, disperse evenly and discharge.

Embodiment 2

[0065] 60 parts of epoxy modified acrylate resin

[0066] 33.5 parts of isobornyl acrylate

[0067] Cumene hydroperoxide 3.0 parts

[0068] p-benzoquinone 0.5 parts

[0069] Leveling agent 1.0 parts

[0070] Defoamer 1.0 parts

[0071] Carbon black paste 1.0 parts

[0072] Preparation:

[0073] Accurately weigh various raw materials according to the proportion of the formula, first add epoxy modified acrylate resin, isobornyl acrylate, leveling agent, defoamer, p-benzoquinone, and carbon black paste into the reaction kettle and stir until they are evenly stirred Finally, add cumene hydroperoxide, disperse evenly and discharge.

[0074] Examples listed in Table 1 and performance test results after curing thereof. The test results show that the underfill of the present invention has good storage stability, low viscosity, excellent process adaptability and good reliability, and can fully meet the process requirements of SMT.

[0075] Table 1

[0076]

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PUM

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Abstract

The invention relates to a room-temperature-storage type acrylate underfill adhesive and a preparation method thereof. The underfill adhesive comprises, by weight, 50-70 parts of modified acrylate resin, 20-30 parts of acrylate monomer, 1.0-5.0 parts of initiator, 0.1-1.0 part of inhibitor, 0.1-5.0 parts of auxiliaries and 0-5.0 parts of pigment. The room-temperature-storage type acrylate underfill adhesive is low in system halogen content, safer and more environment friendly, low in guarant viscosity, good in wettability and high in reliability, fully meets requirements on production process and reliability of SMT (surface mount technology), has excellent stability at room temperature and can be stored and transported at room temperature without cold preservation, and transportation and use costs are greatly reduced.

Description

technical field [0001] The invention relates to a low-viscosity, high-reliability, room temperature storage type acrylate underfill and a preparation method thereof. The underfill is mainly used in chip-level packaging (Chip Scale Package) and ball packaging in surface mount (SMT) technology. Grid Array (Ball Grid Array) package. Background technique [0002] With the gradual escalation of the demand for miniaturization and integration of electronic and electrical products, electronic packaging technology continues to improve, and surface mount technology (SMT) has become the mainstream packaging technology. It is a circuit packaging technology that mounts non-lead or short-lead surface mount components on the surface of a printed circuit board or other substrates and assembles them by reflow soldering or wave soldering. [0003] In the SMT process, chip-scale packaging (CSP) and ball grid array (BGA) packaging processes require the introduction of underfill technology. Th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/14C09J163/10
Inventor 史伟同王晓颖陈三多
Owner TONSAN ADHESIVES INC
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